Article(id=1304377465170842367, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304377446971757108, articleNumber=null, orderNo=null, doi=10.3969/j.issn.1009-3842.2026.02.006, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1753804800000, receivedDateStr=2025-07-30, revisedDate=1761926400000, revisedDateStr=2025-11-01, acceptedDate=null, acceptedDateStr=null, onlineDate=1788917421858, onlineDateStr=2026-09-09, pubDate=1777305600000, pubDateStr=2026-04-28, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1788917421858, onlineIssueDateStr=2026-09-09, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1788917421858, creator=13701087609, updateTime=1788917421858, updator=13701087609, issue=Issue{id=1304377446971757108, tenantId=1146029695717560320, journalId=1303687303576780880, year='2026', volume='', issue='2', pageStart='1', pageEnd='140', issueExtLink='null', onlineDate='null', pubDate='1777305600000', pubDateStr='2026-04-28', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1788917417519, creator='13701087609', updateTime=1788924949893, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext={EN=IssueExt(id=1304409040088490937, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304377446971757108, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1304409040088490938, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304377446971757108, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null, downloadFileDto=null}, startPage=55, endPage=65, ext={EN=ArticleExt(id=1304377465342808832, articleId=1304377465170842367, tenantId=1146029695717560320, journalId=1303687303576780880, language=EN, title=Fabrication of Thermally Stable Graphene-encapsulated Fine-grained Copper Composites, columnId=1304141568877814747, journalTitle=Copper Engineering, columnName=Material Preparation and Process Engineering, runingTitle=null, highlight=null, articleAbstract=

The poor thermal stability of metallic copper limits its applications. This study fabricated graphene-encapsulated fine-grained copper composites via chemical vapor deposition (CVD) and investigated graphene growth on fine-grained copper (about 1 μm diameter). Results showed that pure copper's grain size increased from 2.03 μm (600 ℃) to 18.2 μm (1000 ℃), with hardness decreasing from 91.56HV to 27.64HV. Interestingly, graphene-encapsulated composites maintained stable grain size distribution (1.25~1.35 μm) and hardness distribution (83.96~100.63HV) across the different temperatures. These findings demonstrated that the graphene encapsulation on fine-grained copper significantly enhanced thermal stability by inhibiting copper atom diffusion. Furthermore, the drawn composite wires fabricated from the graphene-encapsulated copper composites by annealing at 1000 ℃ showed a 53.9% increase in hardness, a 12% improvement in tensile strength, a 29.8% higher elongation, and a 6.8% reduction in electrical resistivity compared with the counterpart produced from pure copper. This work provided new insights for fabricating copper-based composites with superior thermal stability.

, authors=Huilong TAO1, Jin BAI1, Yuchun HUAN1, Min WANG1, 2, authorsList=Huilong TAO, Jin BAI, Yuchun HUAN, Min WANG, authorCompany=null, correspAuthors=Min WANG, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1304377465619632897, articleId=1304377465170842367, tenantId=1146029695717560320, journalId=1303687303576780880, language=CN, title=高热稳定性石墨烯包覆细晶铜复合材料的研制, columnId=1304141569037198301, journalTitle=铜业工程, columnName=材料制备与加工工程, runingTitle=null, highlight=null, articleAbstract=

金属铜较差的热稳定性导致其应用受限。本研究采用化学气相沉积法(CVD)在晶粒直径约为1 μm的细晶铜表面生长石墨烯,成功制备了石墨烯包覆细晶铜复合材料。研究结果显示:细晶纯铜的晶粒尺寸随着烧结温度升高而增大,由600 ℃时的2.03 μm增加至1000 ℃时的18.2 μm,且硬度由600 ℃时的91.56HV降至1000 ℃时的27.64HV; 在不同烧结温度下,石墨烯包覆细晶铜复合材料的晶粒尺寸稳定在1.25~1.35 μm,硬度保持在83.96~100.63HV。该结果表明,石墨烯包覆的细晶铜复合材料展现出比细晶纯铜更优异的热稳定性,这是因为铜颗粒表面石墨烯的包覆有效抑制了铜原子的扩散。此外,对石墨烯包覆细晶铜复合材料拉拔得到的复合导线进行了性能测试,结果表明:与细晶纯铜相比,其硬度提升了53.9%,抗拉强度增加了12%,延伸率提高了29.8%,而电阻率降低了6.8%。该研究为高热稳定性铜基复合材料的研制提供了新的思路。

, authors=陶慧龙1, 白金1, 环瑀淳1, 王敏1, 2, authorsList=陶慧龙, 白金, 环瑀淳, 王敏, authorCompany=null, correspAuthors=王敏, authorNote=

陶慧龙(2000—),男,安徽芜湖人,硕士,研究方向:石墨烯铜基复合材料,E-mail:

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王敏,教授,E-mail:
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陶慧龙(2000—),男,安徽芜湖人,硕士,研究方向:石墨烯铜基复合材料,E-mail:

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高热稳定性石墨烯包覆细晶铜复合材料的研制
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陶慧龙 1 , 白金 1 , 环瑀淳 1 , 王敏 1, 2
铜业工程 | 材料制备与加工工程 2026,(2): 55-65
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铜业工程 |材料制备与加工工程 2026 , (2) : 55 -65
高热稳定性石墨烯包覆细晶铜复合材料的研制
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陶慧龙1 , 白金1, 环瑀淳1, 王敏1, 2
作者信息
  • 1.南京航空航天大学材料科学与技术学院,江苏 南京 210016
  • 2.航空航天结构力学及控制全国重点实验室,江苏 南京 210016
通讯作者:
王敏,教授,E-mail:
作者简介:

陶慧龙(2000—),男,安徽芜湖人,硕士,研究方向:石墨烯铜基复合材料,E-mail:

Fabrication of Thermally Stable Graphene-encapsulated Fine-grained Copper Composites
Huilong TAO1 , Jin BAI1, Yuchun HUAN1, Min WANG1, 2
Affiliations
  • 1.College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China
  • 2.State Key Laboratory of Mechanics and Control for Aerospace Structures,Nanjing 210016,China
出版时间: 2026-04-28 doi: 10.3969/j.issn.1009-3842.2026.02.006
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金属铜较差的热稳定性导致其应用受限。本研究采用化学气相沉积法(CVD)在晶粒直径约为1 μm的细晶铜表面生长石墨烯,成功制备了石墨烯包覆细晶铜复合材料。研究结果显示:细晶纯铜的晶粒尺寸随着烧结温度升高而增大,由600 ℃时的2.03 μm增加至1000 ℃时的18.2 μm,且硬度由600 ℃时的91.56HV降至1000 ℃时的27.64HV; 在不同烧结温度下,石墨烯包覆细晶铜复合材料的晶粒尺寸稳定在1.25~1.35 μm,硬度保持在83.96~100.63HV。该结果表明,石墨烯包覆的细晶铜复合材料展现出比细晶纯铜更优异的热稳定性,这是因为铜颗粒表面石墨烯的包覆有效抑制了铜原子的扩散。此外,对石墨烯包覆细晶铜复合材料拉拔得到的复合导线进行了性能测试,结果表明:与细晶纯铜相比,其硬度提升了53.9%,抗拉强度增加了12%,延伸率提高了29.8%,而电阻率降低了6.8%。该研究为高热稳定性铜基复合材料的研制提供了新的思路。

细晶铜  /  石墨烯  /  铜基复合材料  /  热稳定性  /  原子扩散  /  力学性能  /  电学性能

The poor thermal stability of metallic copper limits its applications. This study fabricated graphene-encapsulated fine-grained copper composites via chemical vapor deposition (CVD) and investigated graphene growth on fine-grained copper (about 1 μm diameter). Results showed that pure copper's grain size increased from 2.03 μm (600 ℃) to 18.2 μm (1000 ℃), with hardness decreasing from 91.56HV to 27.64HV. Interestingly, graphene-encapsulated composites maintained stable grain size distribution (1.25~1.35 μm) and hardness distribution (83.96~100.63HV) across the different temperatures. These findings demonstrated that the graphene encapsulation on fine-grained copper significantly enhanced thermal stability by inhibiting copper atom diffusion. Furthermore, the drawn composite wires fabricated from the graphene-encapsulated copper composites by annealing at 1000 ℃ showed a 53.9% increase in hardness, a 12% improvement in tensile strength, a 29.8% higher elongation, and a 6.8% reduction in electrical resistivity compared with the counterpart produced from pure copper. This work provided new insights for fabricating copper-based composites with superior thermal stability.

fine-grained copper  /  graphene  /  copper-based composite  /  thermal stability  /  atomic diffusion  /  mechanical property  /  electrical property
陶慧龙, 白金, 环瑀淳, 王敏. 高热稳定性石墨烯包覆细晶铜复合材料的研制. 铜业工程, 2026 , (2) : 55 -65 . DOI: 10.3969/j.issn.1009-3842.2026.02.006
Huilong TAO, Jin BAI, Yuchun HUAN, Min WANG. Fabrication of Thermally Stable Graphene-encapsulated Fine-grained Copper Composites[J]. Copper Engineering, 2026 , (2) : 55 -65 . DOI: 10.3969/j.issn.1009-3842.2026.02.006
  • 中央高校基本科研业务费-青年科技创新基金(理工军口类)项目(NT2024015)
  • 南京航空航天大学科研人才启动基金项目(YAH20033)
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doi: 10.3969/j.issn.1009-3842.2026.02.006
  • 接收时间:2025-07-30
  • 首发时间:2026-09-09
  • 出版时间:2026-04-28
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  • 收稿日期:2025-07-30
  • 修回日期:2025-11-01
基金
中央高校基本科研业务费-青年科技创新基金(理工军口类)项目(NT2024015)
南京航空航天大学科研人才启动基金项目(YAH20033)
作者信息
    1.南京航空航天大学材料科学与技术学院,江苏 南京 210016
    2.航空航天结构力学及控制全国重点实验室,江苏 南京 210016

通讯作者:

王敏,教授,E-mail:
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2种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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