Article(id=1304377454064325230, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304377446971757108, articleNumber=null, orderNo=null, doi=10.3969/j.issn.1009-3842.2026.02.004, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1758902400000, receivedDateStr=2025-09-27, revisedDate=1763827200000, revisedDateStr=2025-11-23, acceptedDate=null, acceptedDateStr=null, onlineDate=1788917419210, onlineDateStr=2026-09-09, pubDate=1777305600000, pubDateStr=2026-04-28, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1788917419210, onlineIssueDateStr=2026-09-09, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1788917419210, creator=13701087609, updateTime=1788917419210, updator=13701087609, issue=Issue{id=1304377446971757108, tenantId=1146029695717560320, journalId=1303687303576780880, year='2026', volume='', issue='2', pageStart='1', pageEnd='140', issueExtLink='null', onlineDate='null', pubDate='1777305600000', pubDateStr='2026-04-28', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1788917417519, creator='13701087609', updateTime=1788924949893, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext={EN=IssueExt(id=1304409040088490937, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304377446971757108, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1304409040088490938, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304377446971757108, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null, downloadFileDto=null}, startPage=27, endPage=42, ext={EN=ArticleExt(id=1304377454387286639, articleId=1304377454064325230, tenantId=1146029695717560320, journalId=1303687303576780880, language=EN, title=Fabrication Methods and Performance Regulation of Ceramic Particle Reinforced Copper Matrix Composites, columnId=1304141568877814747, journalTitle=Copper Engineering, columnName=Material Preparation and Process Engineering, runingTitle=null, highlight=null, articleAbstract=

Ceramic particle reinforced copper matrix composites have demonstrated broad application prospects in fields such as electronic packaging, aerospace, and rail transportation owing to their outstanding comprehensive properties. Incorporation of ceramic particles not only significantly enhances strength, hardness, and wear resistance of the copper matrix but also largely preserves its excellent electrical and thermal conductivity. In recent years, with the continuous advancement of fabrication technologies and characterization techniques, understanding of interfacial structures and interaction mechanisms between ceramic particles and the copper matrix has deepened considerably. Current research efforts mainly focus on precisely optimizing processing parameters and rationally designing the type and distribution characteristics of the reinforcing phases to maximize strengthening effects of ceramic particles within the copper matrix. Therefore, this review systematically summarized fabrication methods (internal oxidation, mechanical alloying, reactive spray deposition, powder metallurgy, additive manufacturing, stirring casting) of ceramic particle reinforced copper matrix composites. Influence of ceramic particle characteristics (type, content, particle size, interface bonding) on composite performance was analyzed. Electrical conduction and strengthening mechanisms were elucidated. Finally, existing challenges and future research directions were discussed, aiming to provide valuable insights for the further development and practical application of high-performance ceramic particle reinforced copper matrix composites.

, authors=Pengyuan LI1, Junjie XU2, Hongmei ZHANG1, authorsList=Pengyuan LI, Junjie XU, Hongmei ZHANG, authorCompany=null, correspAuthors=Hongmei ZHANG, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1304377454773162608, articleId=1304377454064325230, tenantId=1146029695717560320, journalId=1303687303576780880, language=CN, title=陶瓷颗粒增强铜基复合材料制备方法及性能调控研究进展, columnId=1304141569037198301, journalTitle=铜业工程, columnName=材料制备与加工工程, runingTitle=null, highlight=null, articleAbstract=

陶瓷颗粒增强铜基复合材料具有优异的综合性能,在电子封装、航空航天、轨道交通等领域展现出广阔的应用前景。在铜基复合材料中引入陶瓷颗粒,不仅能显著提升铜基体的强度、硬度和耐磨性,同时可在较大程度上保持其优异的导电性和导热性。近年来,随着先进制备技术和表征手段的发展,人们对陶瓷颗粒与铜基体之间界面结构和相互作用机制的认识不断深入。目前的研究重点在于优化制备工艺参数,以及合理设计增强相的类型与分布特征,以最大限度发挥陶瓷颗粒在铜基体中的强化效果。本文系统综述了陶瓷颗粒增强铜基复合材料的制备方法(内氧化法、机械合金化法、反应喷射沉积法、粉末冶金法、增材制造法、搅拌铸造法),分析了陶瓷颗粒特性(种类、含量、粒径、界面结合)对复合材料性能的影响,并阐述了复合材料的导电机制及强化机制。最后,针对现有研究的不足,对未来研究的重点方向与发展趋势进行了展望,以期为高性能陶瓷颗粒增强铜基复合材料的进一步开发和实际应用提供参考。

, authors=李鹏远1, 徐俊杰2, 张洪梅1, authorsList=李鹏远, 徐俊杰, 张洪梅, authorCompany=null, correspAuthors=张洪梅, authorNote=

李鹏远(1998—),男,山东菏泽人,博士研究生,研究方向:金属基复合材料,E-mail:

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张洪梅,教授,E-mail:
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李鹏远(1998—),男,山东菏泽人,博士研究生,研究方向:金属基复合材料,E-mail:

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陶瓷颗粒增强铜基复合材料制备方法及性能调控研究进展
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李鹏远 1 , 徐俊杰 2 , 张洪梅 1
铜业工程 | 材料制备与加工工程 2026,(2): 27-42
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铜业工程 |材料制备与加工工程 2026 , (2) : 27 -42
陶瓷颗粒增强铜基复合材料制备方法及性能调控研究进展
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李鹏远1 , 徐俊杰2, 张洪梅1
作者信息
  • 1.北京理工大学 材料学院,北京 100081
  • 2.西安稀有金属材料研究院有限公司,陕西 西安 710016
通讯作者:
张洪梅,教授,E-mail:
作者简介:

李鹏远(1998—),男,山东菏泽人,博士研究生,研究方向:金属基复合材料,E-mail:

Fabrication Methods and Performance Regulation of Ceramic Particle Reinforced Copper Matrix Composites
Pengyuan LI1 , Junjie XU2, Hongmei ZHANG1
Affiliations
  • 1.School of Materials Science & Engineering,Beijing Institute of Technology,Beijing 100081,China
  • 2.Xi'an Rare Metal Materials Institute Co.,Ltd.,Xi'an 710016,China
出版时间: 2026-04-28 doi: 10.3969/j.issn.1009-3842.2026.02.004
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陶瓷颗粒增强铜基复合材料具有优异的综合性能,在电子封装、航空航天、轨道交通等领域展现出广阔的应用前景。在铜基复合材料中引入陶瓷颗粒,不仅能显著提升铜基体的强度、硬度和耐磨性,同时可在较大程度上保持其优异的导电性和导热性。近年来,随着先进制备技术和表征手段的发展,人们对陶瓷颗粒与铜基体之间界面结构和相互作用机制的认识不断深入。目前的研究重点在于优化制备工艺参数,以及合理设计增强相的类型与分布特征,以最大限度发挥陶瓷颗粒在铜基体中的强化效果。本文系统综述了陶瓷颗粒增强铜基复合材料的制备方法(内氧化法、机械合金化法、反应喷射沉积法、粉末冶金法、增材制造法、搅拌铸造法),分析了陶瓷颗粒特性(种类、含量、粒径、界面结合)对复合材料性能的影响,并阐述了复合材料的导电机制及强化机制。最后,针对现有研究的不足,对未来研究的重点方向与发展趋势进行了展望,以期为高性能陶瓷颗粒增强铜基复合材料的进一步开发和实际应用提供参考。

铜基复合材料  /  陶瓷颗粒  /  制备方法  /  力学性能  /  电学性能

Ceramic particle reinforced copper matrix composites have demonstrated broad application prospects in fields such as electronic packaging, aerospace, and rail transportation owing to their outstanding comprehensive properties. Incorporation of ceramic particles not only significantly enhances strength, hardness, and wear resistance of the copper matrix but also largely preserves its excellent electrical and thermal conductivity. In recent years, with the continuous advancement of fabrication technologies and characterization techniques, understanding of interfacial structures and interaction mechanisms between ceramic particles and the copper matrix has deepened considerably. Current research efforts mainly focus on precisely optimizing processing parameters and rationally designing the type and distribution characteristics of the reinforcing phases to maximize strengthening effects of ceramic particles within the copper matrix. Therefore, this review systematically summarized fabrication methods (internal oxidation, mechanical alloying, reactive spray deposition, powder metallurgy, additive manufacturing, stirring casting) of ceramic particle reinforced copper matrix composites. Influence of ceramic particle characteristics (type, content, particle size, interface bonding) on composite performance was analyzed. Electrical conduction and strengthening mechanisms were elucidated. Finally, existing challenges and future research directions were discussed, aiming to provide valuable insights for the further development and practical application of high-performance ceramic particle reinforced copper matrix composites.

copper matrix composite  /  ceramic particle  /  fabrication method  /  mechanical property  /  electrical property
李鹏远, 徐俊杰, 张洪梅. 陶瓷颗粒增强铜基复合材料制备方法及性能调控研究进展. 铜业工程, 2026 , (2) : 27 -42 . DOI: 10.3969/j.issn.1009-3842.2026.02.004
Pengyuan LI, Junjie XU, Hongmei ZHANG. Fabrication Methods and Performance Regulation of Ceramic Particle Reinforced Copper Matrix Composites[J]. Copper Engineering, 2026 , (2) : 27 -42 . DOI: 10.3969/j.issn.1009-3842.2026.02.004
  • 陕西省青年科技新星项目(2025ZC-KJXX-58)
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doi: 10.3969/j.issn.1009-3842.2026.02.004
  • 接收时间:2025-09-27
  • 首发时间:2026-09-09
  • 出版时间:2026-04-28
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  • 收稿日期:2025-09-27
  • 修回日期:2025-11-23
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陕西省青年科技新星项目(2025ZC-KJXX-58)
作者信息
    1.北京理工大学 材料学院,北京 100081
    2.西安稀有金属材料研究院有限公司,陕西 西安 710016

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张洪梅,教授,E-mail:
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2种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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