Article(id=1304377454064325230, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304377446971757108, articleNumber=null, orderNo=null, doi=10.3969/j.issn.1009-3842.2026.02.004, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1758902400000, receivedDateStr=2025-09-27, revisedDate=1763827200000, revisedDateStr=2025-11-23, acceptedDate=null, acceptedDateStr=null, onlineDate=1788917419210, onlineDateStr=2026-09-09, pubDate=1777305600000, pubDateStr=2026-04-28, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1788917419210, onlineIssueDateStr=2026-09-09, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1788917419210, creator=13701087609, updateTime=1788917419210, updator=13701087609, issue=Issue{id=1304377446971757108, tenantId=1146029695717560320, journalId=1303687303576780880, year='2026', volume='', issue='2', pageStart='1', pageEnd='140', issueExtLink='null', onlineDate='null', pubDate='1777305600000', pubDateStr='2026-04-28', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1788917417519, creator='13701087609', updateTime=1788924949893, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext={EN=IssueExt(id=1304409040088490937, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304377446971757108, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1304409040088490938, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304377446971757108, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null, downloadFileDto=null}, startPage=27, endPage=42, ext={EN=ArticleExt(id=1304377454387286639, articleId=1304377454064325230, tenantId=1146029695717560320, journalId=1303687303576780880, language=EN, title=Fabrication Methods and Performance Regulation of Ceramic Particle Reinforced Copper Matrix Composites, columnId=1304141568877814747, journalTitle=Copper Engineering, columnName=Material Preparation and Process Engineering, runingTitle=null, highlight=null, articleAbstract=
Ceramic particle reinforced copper matrix composites have demonstrated broad application prospects in fields such as electronic packaging, aerospace, and rail transportation owing to their outstanding comprehensive properties. Incorporation of ceramic particles not only significantly enhances strength, hardness, and wear resistance of the copper matrix but also largely preserves its excellent electrical and thermal conductivity. In recent years, with the continuous advancement of fabrication technologies and characterization techniques, understanding of interfacial structures and interaction mechanisms between ceramic particles and the copper matrix has deepened considerably. Current research efforts mainly focus on precisely optimizing processing parameters and rationally designing the type and distribution characteristics of the reinforcing phases to maximize strengthening effects of ceramic particles within the copper matrix. Therefore, this review systematically summarized fabrication methods (internal oxidation, mechanical alloying, reactive spray deposition, powder metallurgy, additive manufacturing, stirring casting) of ceramic particle reinforced copper matrix composites. Influence of ceramic particle characteristics (type, content, particle size, interface bonding) on composite performance was analyzed. Electrical conduction and strengthening mechanisms were elucidated. Finally, existing challenges and future research directions were discussed, aiming to provide valuable insights for the further development and practical application of high-performance ceramic particle reinforced copper matrix composites.
, authors=Pengyuan LI
1, Junjie XU
2, Hongmei ZHANG
1, authorsList=Pengyuan LI, Junjie XU, Hongmei ZHANG, authorCompany=null, correspAuthors=Hongmei ZHANG, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1304377454773162608, articleId=1304377454064325230, tenantId=1146029695717560320, journalId=1303687303576780880, language=CN, title=陶瓷颗粒增强铜基复合材料制备方法及性能调控研究进展, columnId=1304141569037198301, journalTitle=铜业工程, columnName=材料制备与加工工程, runingTitle=null, highlight=null, articleAbstract=
陶瓷颗粒增强铜基复合材料具有优异的综合性能,在电子封装、航空航天、轨道交通等领域展现出广阔的应用前景。在铜基复合材料中引入陶瓷颗粒,不仅能显著提升铜基体的强度、硬度和耐磨性,同时可在较大程度上保持其优异的导电性和导热性。近年来,随着先进制备技术和表征手段的发展,人们对陶瓷颗粒与铜基体之间界面结构和相互作用机制的认识不断深入。目前的研究重点在于优化制备工艺参数,以及合理设计增强相的类型与分布特征,以最大限度发挥陶瓷颗粒在铜基体中的强化效果。本文系统综述了陶瓷颗粒增强铜基复合材料的制备方法(内氧化法、机械合金化法、反应喷射沉积法、粉末冶金法、增材制造法、搅拌铸造法),分析了陶瓷颗粒特性(种类、含量、粒径、界面结合)对复合材料性能的影响,并阐述了复合材料的导电机制及强化机制。最后,针对现有研究的不足,对未来研究的重点方向与发展趋势进行了展望,以期为高性能陶瓷颗粒增强铜基复合材料的进一步开发和实际应用提供参考。
, authors=李鹏远
1, 徐俊杰
2, 张洪梅
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