Article(id=1304141593028612224, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304141567850213817, articleNumber=null, orderNo=null, doi=10.3969/j.issn.1009-3842.2026.03.004, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1758729600000, receivedDateStr=2025-09-25, revisedDate=1768492800000, revisedDateStr=2026-01-16, acceptedDate=null, acceptedDateStr=null, onlineDate=1788861185556, onlineDateStr=2026-09-08, pubDate=1782576000000, pubDateStr=2026-06-28, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1788861185556, onlineIssueDateStr=2026-09-08, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1788861185556, creator=13701087609, updateTime=1788861185556, updator=13701087609, issue=Issue{id=1304141567850213817, tenantId=1146029695717560320, journalId=1303687303576780880, year='2026', volume='', issue='3', pageStart='1', pageEnd='134', issueExtLink='null', onlineDate='null', pubDate='1782576000000', pubDateStr='2026-06-28', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1788861179554, creator='13701087609', updateTime=1788924930580, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext={EN=IssueExt(id=1304408959088092087, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304141567850213817, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1304408959088092088, tenantId=1146029695717560320, journalId=1303687303576780880, issueId=1304141567850213817, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null, downloadFileDto=null}, startPage=33, endPage=38, ext={EN=ArticleExt(id=1304141593242521729, articleId=1304141593028612224, tenantId=1146029695717560320, journalId=1303687303576780880, language=EN, title=Heat Dissipation Characteristics of Vapor Chambers for 5G Devices with Gradient Wicks Based on Copper Foam/Copper Mesh Composite, columnId=1304141568877814747, journalTitle=Copper Engineering, columnName=Material Preparation and Process Engineering, runingTitle=null, highlight=null, articleAbstract=

This paper innovatively proposed thin vapor chambers based on gradient porosity copper foam/copper mesh composite structure to meet heat dissipation requirements of 5G communication equipment with high power density. Through two-way pore gradient design, thickness of copper foam was compressed from 1.6 mm to 0.15 mm by hot pressing technology at the evaporation end, forming a high-density microporous structure to enhance capillary. The condensation end was configured with 150 μm pore copper mesh to optimize the working medium reflux path, significantly reducing flow resistance. Experimental results showed that the design can reduce temperature fluctuation from 10.3 ℃ to 5.2 ℃ (a decrease of 49%) under a heat load of 65 W, with a thermal resistance (ΔR_th) of only 0.08 ℃/W. In particular, the gradient structure shortened start-up time to 8 s, providing a new idea for heat dissipation of miniaturized electronic devices. This study provided a new paradigm for the miniaturization and heat dissipation of high-power electronic devices, balancing efficient heat transfer and structural reliability. Design concept of the three-stage flow channel (large hole for evaporation end → middle hole for transition layer → small hole for copper mesh) can be extended to other high heat density application scenarios.

, authors=Zixuan Lei, Wenlu Zhang, Sheng Wu, Baiwen Zhang, Ming Hong, Yan Chen, Haifeng Zhang, authorsList=Zixuan Lei, Wenlu Zhang, Sheng Wu, Baiwen Zhang, Ming Hong, Yan Chen, Haifeng Zhang, authorCompany=null, correspAuthors=Haifeng Zhang, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1304141593544511618, articleId=1304141593028612224, tenantId=1146029695717560320, journalId=1303687303576780880, language=CN, title=泡沫铜/铜网复合梯度均热板的5G散热特性研究, columnId=1304141569037198301, journalTitle=铜业工程, columnName=材料制备与加工工程, runingTitle=null, highlight=null, articleAbstract=

针对5G通信设备高功率密度散热需求，创新性地提出了一种基于梯度孔隙率泡沫铜/铜网复合结构的薄型化均热板解决方案。通过双向孔隙梯度设计，在蒸发端采用热压技术将泡沫铜厚度从1.6 mm压缩至0.15 mm，形成高密度微孔结构以增强毛细力，冷凝端则配置150 μm孔径铜网优化工质回流路径，显著降低流动阻力。实验结果表明，该设计在65 W热负荷下可将温度波动幅度从10.3 ℃降至5.2 ℃（降幅49%），热阻（ΔR_th）低至0.080 ℃/W。此外，梯度结构使启动时间缩短至8 s，为微型化电子设备散热提供了新思路。本研究为高功率电子器件的微型化散热提供了兼具高效传热与结构可靠的新范式，其三级流道（蒸发端大孔→过渡层中孔→铜网小孔）设计理念可拓展至其他高热量密度应用场景。

, authors=雷子璇, 张文璐, 吴胜, 张柏文, 洪明, 陈岩, 张海丰, authorsList=雷子璇, 张文璐, 吴胜, 张柏文, 洪明, 陈岩, 张海丰, authorCompany=null, correspAuthors=张海丰, authorNote=, correspAuthorsNote=, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=qcexVzJfwY9ViNvy1TZGZA==, magXml=x1Its/30BaPLsVVHyiQ00w==, pdfUrl=null, pdf=KT3XSwx9SZ+aHUOosTYYkA==, pdfFileSize=7548106, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=7GLiUvNKGGWO3qWp8QKiFA==, mapNumber=null, fund=null)}, authors=[Author(id=1304141593812947079, tenantId=1146029695717560320, journalId=1303687303576780880, articleId=1304141593028612224, orderNo=0, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=zxuanlei@mail.ustc.edu.cn, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1304141593901027465, tenantId=1146029695717560320, journalId=1303687303576780880, articleId=1304141593028612224, authorId=1304141593812947079, language=EN, stringName=Zixuan Lei, firstName=Zixuan, middleName=null, lastName=Lei, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=Jiangxi Copper Technology Institute Co.，Ltd.，Nanchang 330096，China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1304141593984913546, tenantId=1146029695717560320, journalId=1303687303576780880, articleId=1304141593028612224, authorId=1304141593812947079, language=CN, stringName=雷子璇, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=江西铜业技术研究院有限公司，江西 南昌 330096, bio={"content":"

雷子璇（1994—），女，安徽安庆人，博士，工程师，研究方向：高性能铜及铜合金材料，E-mail：zxuanlei@mail.ustc.edu.cn

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雷子璇（1994—），女，安徽安庆人，博士，工程师，研究方向：高性能铜及铜合金材料，E-mail：zxuanlei@mail.ustc.edu.cn

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