Article(id=1319293633711420407, tenantId=1146029695717560320, journalId=1316781260334530699, issueId=1319293542573392487, articleNumber=null, orderNo=null, doi=10.3969/j.issn.1005-0329.2025.07.005, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1731945600000, receivedDateStr=2024-11-19, revisedDate=1747324800000, revisedDateStr=2025-05-16, acceptedDate=null, acceptedDateStr=null, onlineDate=1792473713567, onlineDateStr=2026-10-20, pubDate=1753804800000, pubDateStr=2025-07-30, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1792473713567, onlineIssueDateStr=2026-10-20, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1792473713567, creator=13701087609, updateTime=1792473713567, updator=13701087609, issue=Issue{id=1319293542573392487, tenantId=1146029695717560320, journalId=1316781260334530699, year='2025', volume='53', issue='7', pageStart='1', pageEnd='118', issueExtLink='null', onlineDate='null', pubDate='1753804800000', pubDateStr='2025-07-30', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1792473691838, creator='13701087609', updateTime=1792473691838, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext=null, issueFiles=null, downloadFileDto=null}, startPage=30, endPage=36, ext={EN=ArticleExt(id=1319293635678548986, articleId=1319293633711420407, tenantId=1146029695717560320, journalId=1316781260334530699, language=EN, title=Research on optimization design method for water‑cooling plate of insulate‑gate bipolar transistor module, columnId=null, journalTitle=Fluid Machinery, columnName=null, runingTitle=null, highlight=null, articleAbstract=

To address the issue of the increasing trend of temperature in the key area of the chip rise caused by increasing power density in insulated‑gate bipolar transistor (IGBT) modules,a fluid-solid coupling model of the IGBT module and water‑cooling plate was established,and an optimized design method for the water‑cooling plate of the IGBT module was proposed.The effectiveness of the method was verified through finite element simulation and experiments.Based on the dimensions and heat dissipation power characteristics of the IGBT module,three water‑cooling plates with different heat dissipation areas (122 mm×61 mm×20 mm,122 mm×122 mm×20 mm,122 mm×183 mm×20 mm) were simulated,analyzed,and optimized to systematically evaluate the influence of heat dissipation area on cooling efficiency.After determining the optimal size,straight ribs were welded inside the flow channel,and an orthogonal experimental method was employed to derive the optimal structural parameters(flow channel depth,rib height,and rib thickness).The results show that when the flow channel depth is 9 mm,the rib height is 5 mm,and the rib thickness is 1.5 mm,the optimized water‑cooling plate reduces the maximum temperature of the IGBT by 7.1 ℃,significantly improving thermal performance.Comparative experiments under different power losses and inlet water temperatures verifies the variation patterns of the maximum temperature on the chip and substrate surfaces,confirming the effectiveness of the proposed optimization scheme.This study provides a new solution for the thermal design of IGBT modules,which is of great significance for promoting their applications in renewable energy generation,smart grids,and high‑power electronic systems.

, authors=Jing HU, Xiaoyu ZHANG, authorsList=Jing HU, Xiaoyu ZHANG, authorCompany=null, correspAuthors=null, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1319293638224490511, articleId=1319293633711420407, tenantId=1146029695717560320, journalId=1316781260334530699, language=CN, title=绝缘栅双极型晶体管模块水冷板的优化设计方法研究, columnId=1317484287230853622, journalTitle=流体机械, columnName=设计计算, runingTitle=null, highlight=null, articleAbstract=

针对绝缘栅双极型晶体管(insulate‑gate bipolar transistor,IGBT)模块功率密度增大,导致芯片内部关键区域温度不断升高的问题,建立IGBT与水冷板的流固耦合模型,提出了一种IGBT模块水冷板的优化设计方法,并通过有限元仿真和试验验证其有效性。基于IGBT模块的尺寸和发热功率特性,对3种不同尺寸(122 mm×61 mm×20 mm,122 mm×122 mm×20 mm,122 mm×183 mm×20 mm)的水冷板进行仿真分析与优化设计,系统评估散热面积对散热效率的影响规律。在确定最优尺寸的基础上,通过在流道内焊接平直型肋片,并采用正交试验方法得出关键结构参数(流道深度、肋片高度及肋片厚度)的优化方案。结果表明,当流道深度为9 mm、肋片高度为5 mm、肋片厚度为1.5 mm时,优化后的水冷板可使IGBT最高温度降低7.1 ℃,散热性能得到显著提升。通过不同功率损耗和入口水温条件下的对比试验,得到芯片和基板表面最高温度的变化规律,证实了所提优化方案的有效性。研究为IGBT模块的散热设计提供了新的解决方案,对促进其在新能源发电、智能电网及大功率电力电子系统中的应用具有重要意义。

, authors=胡静, 张晓玉, authorsList=胡静, 张晓玉, authorCompany=null, correspAuthors=null, authorNote=

胡静(1979),女,副教授,主要从事工程热物理领域的研究工作,通信地址:300384天津市西青区津静公路26号天津城建大学能源与安全工程学院,E-mail:。

, correspAuthorsNote=null, copyrightStatement=作者向本刊所投稿件一经本刊录用,则该论文的复制权、发行权、信息网络传播权、翻译权、汇编权等权利视为自动转让给本刊。本刊为国内各主要数据库收录期刊,本刊所发表的稿件将同时通过互联网进行网络出版或提供信息服务。, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=eewfJkgB9toDFLIsm6bROg==, magXml=y/fhVYImOjOtrldeO06Akw==, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=SEWu9R41EIXqyJkPTqdV7A==, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=zK5JrXU/R3MJ6/KJPWHBsA==, mapNumber=null, fund=null)}, authors=[Author(id=1319293765039280770, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, orderNo=0, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=hujingemail@163.com, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1319293765114778244, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, authorId=1319293765039280770, language=EN, stringName=Jing HU, firstName=Jing, middleName=null, lastName=HU, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=School of Energy and Safety Engineering,Tianjin Chengjian University,Tianjin 300384,China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1319293765177692805, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, authorId=1319293765039280770, language=CN, stringName=胡静, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=天津城建大学 能源与安全工程学院,天津 300384, bio={"content":"

胡静(1979),女,副教授,主要从事工程热物理领域的研究工作,通信地址:300384天津市西青区津静公路26号天津城建大学能源与安全工程学院,E-mail:。

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胡静(1979),女,副教授,主要从事工程热物理领域的研究工作,通信地址:300384天津市西青区津静公路26号天津城建大学能源与安全工程学院,E-mail:。

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perforated dimple/protrusion fins[J].Applied Thermal Engineering,2024,256:124030., articleTitle=null, refAbstract=null), Reference(id=1319293772765188801, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=14, rfOrder=16, authorNames=null, journalName=null, refType=null, unstructuredReference=恽强龙,张广泰,姜波,等.界面热阻对IGBT散热影响的试验研究[J].机械设计与制造工程,2023,52(4):125-129., articleTitle=null, refAbstract=null), Reference(id=1319293772828103362, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=14, rfOrder=17, authorNames=null, journalName=null, refType=null, unstructuredReference=YUN Q L,ZHANG G T,JIANG B,et al.Experimental research on the influence of interface thermal resistance on IGBT heat dissipation[J].Machinery Design and Manufacturing Engineering,2023,52(4):125-129., articleTitle=null, refAbstract=null), Reference(id=1319293772903600835, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=15, rfOrder=18, authorNames=null, journalName=null, refType=null, unstructuredReference=DUAN L,ZHOU H,XU W,et al.Design method of multiple inlet/outlet air cooling frame of pouch lithium‑ion battery based on thermal‑fluid coupling topology optimization[J].International Journal of Heat and Mass Transfer,2023,215:124496., articleTitle=null, refAbstract=null), Reference(id=1319293772962321092, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, 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pageEnd=null, url=null, language=null, rfNumber=17, rfOrder=21, authorNames=null, journalName=null, refType=null, unstructuredReference=王洪清.面向大功率IGBT散热的一体式均热板液冷散热器设计与性能研究[D].广州:华南理工大学,2020., articleTitle=null, refAbstract=null), Reference(id=1319293773134287559, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, doi=null, pmid=null, pmcid=null, year=null, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=17, rfOrder=22, authorNames=null, journalName=null, refType=null, unstructuredReference=WANG H Q.Design and performance research of integrated liquid cooling heat sink with vapor chamber for high‑power IGBT[D].Guangzhou:South China University of Technology,2020., articleTitle=null, refAbstract=null)], funds=null, companyList=[AuthorCompany(id=1319293764959588990, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, xref=null, 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journalId=1316781260334530699, articleId=1319293633711420407, language=EN, label=Fig.8, caption=Test system, figureFileSmall=mDrwf8U4waZgTtNuKph4GQ==, figureFileBig=pIw33u4frcZybFmR7vAoKw==, tableContent=null), ArticleFig(id=1319293768793182882, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=CN, label=图8, caption=试验系统, figureFileSmall=mDrwf8U4waZgTtNuKph4GQ==, figureFileBig=pIw33u4frcZybFmR7vAoKw==, tableContent=null), ArticleFig(id=1319293768864486051, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=EN, label=Tab.1, caption=

The structure parameters of water‑cooling plate

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长宽比长/mm宽/mm流道
宽度/mm
流道
长度/mm
湿周
周长/mm
湿表
面积/m2
1∶0.51226161022 0700.006
1∶112212214.51022 4100.021
1∶1.512218314.51643 4040.032
), ArticleFig(id=1319293768923206308, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=CN, label=表1, caption=

水冷板结构参数

, figureFileSmall=null, figureFileBig=null, tableContent=
长宽比长/mm宽/mm流道
宽度/mm
流道
长度/mm
湿周
周长/mm
湿表
面积/m2
1∶0.51226161022 0700.006
1∶112212214.51022 4100.021
1∶1.512218314.51643 4040.032
), ArticleFig(id=1319293768998703781, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=EN, label=Tab.2, caption=

Material physical parameters

, figureFileSmall=null, figureFileBig=null, tableContent=
材料密度/(kg·m-3)热导率/(W·m-1·K-1)热容/(J·kg-1·K-1)
铝2 719202.4871
水997.00.6094 179
), ArticleFig(id=1319293769074201254, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=CN, label=表2, caption=

材料物性参数

, figureFileSmall=null, figureFileBig=null, tableContent=
材料密度/(kg·m-3)热导率/(W·m-1·K-1)热容/(J·kg-1·K-1)
铝2 719202.4871
水997.00.6094 179
), ArticleFig(id=1319293769132921511, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=EN, label=Tab.3, caption=

Test structure parameters

, figureFileSmall=null, figureFileBig=null, tableContent=
水平因素
流道深度肋片厚度肋片高度
161.01
271.53
382.05
492.57
), ArticleFig(id=1319293769208418984, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=CN, label=表3, caption=

试验结构参数

, figureFileSmall=null, figureFileBig=null, tableContent=
水平因素
流道深度肋片厚度肋片高度
161.01
271.53
382.05
492.57
), ArticleFig(id=1319293769275527849, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=EN, label=Tab.4, caption=

L16(43) orthogonal array and results

, figureFileSmall=null, figureFileBig=null, tableContent=
试验方案试验因素试验结果
流道
深度/mm
肋片
高度/mm
肋片
厚度/mm
Tjmax/℃∆P/Pa
1611.059.2482 380
2631.557.9321 480
3652.057.9272 080
4672.552.9742 600
5711.558.083870
6731.052.0011 200
7752.557.9271 750
8772.057.6401 910
9812.058.107960
10832.557.8551 390
11851.058.0411 370
12871.557.6931 660
13912.558.231530
14932.057.8921 140
15951.551.8831 200
16971.057.9061 440
), ArticleFig(id=1319293769342636714, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=CN, label=表4, caption=

L16(43)正交阵列及结果

, figureFileSmall=null, figureFileBig=null, tableContent=
试验方案试验因素试验结果
流道
深度/mm
肋片
高度/mm
肋片
厚度/mm
Tjmax/℃∆P/Pa
1611.059.2482 380
2631.557.9321 480
3652.057.9272 080
4672.552.9742 600
5711.558.083870
6731.052.0011 200
7752.557.9271 750
8772.057.6401 910
9812.058.107960
10832.557.8551 390
11851.058.0411 370
12871.557.6931 660
13912.558.231530
14932.057.8921 140
15951.551.8831 200
16971.057.9061 440
), ArticleFig(id=1319293769405551275, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=EN, label=Tab.5, caption=

Range analysis results

, figureFileSmall=null, figureFileBig=null, tableContent=
目标参数项目因素
流道深度肋片高度肋片厚度
Tmax/℃k157.02058.41756.799
k256.41356.42056.398
k357.92456.44457.892
k456.47856.55356.747
R1.5111.9971.494
∆P/Pak11860.000910.0001322.500
k21432.5001302.5001302.500
k31345.0001600.0001522.500
k41077.5001902.5001567.500
R782.500992.500265.000
), ArticleFig(id=1319293769476854444, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=CN, label=表5, caption=

极差分析结果

, figureFileSmall=null, figureFileBig=null, tableContent=
目标参数项目因素
流道深度肋片高度肋片厚度
Tmax/℃k157.02058.41756.799
k256.41356.42056.398
k357.92456.44457.892
k456.47856.55356.747
R1.5111.9971.494
∆P/Pak11860.000910.0001322.500
k21432.5001302.5001302.500
k31345.0001600.0001522.500
k41077.5001902.5001567.500
R782.500992.500265.000
), ArticleFig(id=1319293769573323437, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=EN, label=Tab.6, caption=

Comparison of results before and after optimization

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项目IGBT模块表面最高温度/℃流场压降/Pa
优化前59561
优化后51.91 200
), ArticleFig(id=1319293769636237998, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=CN, label=表6, caption=

优化前后结果对比

, figureFileSmall=null, figureFileBig=null, tableContent=
项目IGBT模块表面最高温度/℃流场压降/Pa
优化前59561
优化后51.91 200
), ArticleFig(id=1319293769694958255, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=EN, label=Tab.7, caption=

Error analysis of test data and simulation results under different boundary conditions

, figureFileSmall=null, figureFileBig=null, tableContent=
不同边界条件表面最高温度/℃
芯片误差/%基板误差/%
功率损耗/W532.41.526.10.8
1533.61.727.51.8
2538.1729.56.7
3542.313317
入口水温/℃2029.36.123.39.4
2533.61.727.51.8
30381.332.75.8
3542.20.737.75
), ArticleFig(id=1319293769778844336, tenantId=1146029695717560320, journalId=1316781260334530699, articleId=1319293633711420407, language=CN, label=表7, caption=

不同边界条件下试验数据及与仿真结果误差分析

, figureFileSmall=null, figureFileBig=null, tableContent=
不同边界条件表面最高温度/℃
芯片误差/%基板误差/%
功率损耗/W532.41.526.10.8
1533.61.727.51.8
2538.1729.56.7
3542.313317
入口水温/℃2029.36.123.39.4
2533.61.727.51.8
30381.332.75.8
3542.20.737.75
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绝缘栅双极型晶体管模块水冷板的优化设计方法研究
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胡静 , 张晓玉
流体机械 | 设计计算 2025,53(7): 30-36
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流体机械 |设计计算 2025 , 53 (7) : 30 -36
绝缘栅双极型晶体管模块水冷板的优化设计方法研究
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胡静(1979),女,副教授,主要从事工程热物理领域的研究工作,通信地址:300384天津市西青区津静公路26号天津城建大学能源与安全工程学院,E-mail:。

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胡静 , 张晓玉
作者信息
  • 天津城建大学 能源与安全工程学院,天津 300384
作者简介:

胡静(1979),女,副教授,主要从事工程热物理领域的研究工作,通信地址:300384天津市西青区津静公路26号天津城建大学能源与安全工程学院,E-mail:。

Research on optimization design method for water‑cooling plate of insulate‑gate bipolar transistor module
Jing HU , Xiaoyu ZHANG
Affiliations
  • School of Energy and Safety Engineering,Tianjin Chengjian University,Tianjin 300384,China
出版时间: 2025-07-30 doi: 10.3969/j.issn.1005-0329.2025.07.005
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针对绝缘栅双极型晶体管(insulate‑gate bipolar transistor,IGBT)模块功率密度增大,导致芯片内部关键区域温度不断升高的问题,建立IGBT与水冷板的流固耦合模型,提出了一种IGBT模块水冷板的优化设计方法,并通过有限元仿真和试验验证其有效性。基于IGBT模块的尺寸和发热功率特性,对3种不同尺寸(122 mm×61 mm×20 mm,122 mm×122 mm×20 mm,122 mm×183 mm×20 mm)的水冷板进行仿真分析与优化设计,系统评估散热面积对散热效率的影响规律。在确定最优尺寸的基础上,通过在流道内焊接平直型肋片,并采用正交试验方法得出关键结构参数(流道深度、肋片高度及肋片厚度)的优化方案。结果表明,当流道深度为9 mm、肋片高度为5 mm、肋片厚度为1.5 mm时,优化后的水冷板可使IGBT最高温度降低7.1 ℃,散热性能得到显著提升。通过不同功率损耗和入口水温条件下的对比试验,得到芯片和基板表面最高温度的变化规律,证实了所提优化方案的有效性。研究为IGBT模块的散热设计提供了新的解决方案,对促进其在新能源发电、智能电网及大功率电力电子系统中的应用具有重要意义。

IGBT模块  /  水冷板  /  流道结构  /  优化设计

To address the issue of the increasing trend of temperature in the key area of the chip rise caused by increasing power density in insulated‑gate bipolar transistor (IGBT) modules,a fluid-solid coupling model of the IGBT module and water‑cooling plate was established,and an optimized design method for the water‑cooling plate of the IGBT module was proposed.The effectiveness of the method was verified through finite element simulation and experiments.Based on the dimensions and heat dissipation power characteristics of the IGBT module,three water‑cooling plates with different heat dissipation areas (122 mm×61 mm×20 mm,122 mm×122 mm×20 mm,122 mm×183 mm×20 mm) were simulated,analyzed,and optimized to systematically evaluate the influence of heat dissipation area on cooling efficiency.After determining the optimal size,straight ribs were welded inside the flow channel,and an orthogonal experimental method was employed to derive the optimal structural parameters(flow channel depth,rib height,and rib thickness).The results show that when the flow channel depth is 9 mm,the rib height is 5 mm,and the rib thickness is 1.5 mm,the optimized water‑cooling plate reduces the maximum temperature of the IGBT by 7.1 ℃,significantly improving thermal performance.Comparative experiments under different power losses and inlet water temperatures verifies the variation patterns of the maximum temperature on the chip and substrate surfaces,confirming the effectiveness of the proposed optimization scheme.This study provides a new solution for the thermal design of IGBT modules,which is of great significance for promoting their applications in renewable energy generation,smart grids,and high‑power electronic systems.

IGBT module  /  water‑cooling plate  /  flow channel structure  /  optimization design
胡静, 张晓玉. 绝缘栅双极型晶体管模块水冷板的优化设计方法研究. 流体机械, 2025 , 53 (7) : 30 -36 . DOI: 10.3969/j.issn.1005-0329.2025.07.005
Jing HU, Xiaoyu ZHANG. Research on optimization design method for water‑cooling plate of insulate‑gate bipolar transistor module[J]. Fluid Machinery, 2025 , 53 (7) : 30 -36 . DOI: 10.3969/j.issn.1005-0329.2025.07.005
绝缘栅双极型晶体管(insulate‑gate bipolar transistor,IGBT)应用领域广泛[1],其作为电力电子装备的核心部件,性能和寿命与温度直接相关[2]。为确保IGBT模块的可靠运行,高效的散热设计至关重要。目前,常见的散热方式主要包括自然风冷式、强迫风式冷、水冷式及热管式等。其中,水冷散热方式在超大功率设备中应用效果较好,性价比高,已成为人们关注的重点[3-4]。
水冷散热方式下,水冷板内部流道结构的形式直接影响散热效果和IGBT模块的热安全性。已有研究表明,通过对水冷板内部流道结构进行优化,可有效提升散热效果,同时降低流体流动阻力,实现更高的能效比[5-8]。为增强散热效果,研究人员在水冷流道内布置了多种类型的扰流结构,结果表明扰流结构的添加能够显著提高散热性能,通过进一步分析比较扰流结构的形状、密度分布和尺寸等参数对散热及流动性能的影响,可以确定最优的结构设计方案[9-11]。特别针对翅片形状的扰流结构研究发现,对其进行打孔处理可有效破坏壁面速度边界层,从而降低热源表面温度[12-13]。在IGBT模块与水冷板的连接方面,采用导热硅脂会产生界面热阻,对散热性能造成不利影响。研究表明,在实际安装过程中,导热硅脂的厚度存在最优值[14]。此外,水冷板进出口的布置方式会显著影响冷却介质的流动特性,进而影响换热性能。因此,在设计过程中需要综合考虑各项因素,以实现最佳散热效果和最小压力损失[15-16]。
基于上述分析,现有研究多集中于固定散热面积条件下的内部结构优化,而较少关注散热面积与热源尺寸之间的协同作用机制。本文根据IGBT模块的实际尺寸,设计3种不同尺寸的水冷板,分别建立相应的几何模型并开展有限元仿真分析。通过系统比较3种水冷板的传热性能和流动特性,确定了适用于文中IGBT模块的最佳水冷板尺寸。在传统串联式水冷板结构的基础上,进一步在流道内部布置平直型肋片,重点分析流道深度、肋片厚度和肋片高度3个关键结构参数对散热性能的影响规律。最后,采用有限元数值模拟与试验测试相结合的研究方法,系统验证不同功率损耗和冷却介质入口水温工况条件下水冷板散热性能的变化规律。
IGBT模块的内部结构及热源分布如图1所示,其DBC层由上层铜层、陶瓷层和下层铜层构成,尺寸为92 mm×32 mm×3 mm。在建立仿真模型时,忽略对仿真结果影响较小的键合线、线圈、螺丝和螺钉等结构。模块内部包含2个IGBT芯片和2个续流二极管(freewheeling diode,FWD)芯片,其中FWD芯片在仿真过程中处于非工作状态,热损耗设定为0。由于IGBT芯片封装界面材料及各部分接触热阻对仿真结果影响较小,这些因素在建模时可忽略[17]。采用导热硅脂来减小IGBT模块与水冷板安装时产生的界面气隙,同时降低两者之间的接触热阻。
在传统IGBT模块的水冷散热设计中,增加水冷板的散热面积能够提供更多的冷却介质接触表面,从而增强热交换能力并有效降低模块工作温度。根据IGBT模块的实际尺寸,选取了3种不同长宽比(1∶0.5,1∶1,1∶1.5)的水冷板进行对比分析,旨在系统研究散热面积变化对水冷板散热效率的影响。具体结构参数见表1示。设计的水冷板采用蛇形流道结构,模型如图2所示。
所有水冷板均为长度122 mm、厚度20 mm。流道设计参数:深度7 mm,进出口直径6 mm,材料选用铝材,其具体物性参数见表2。
流动状态的判定采用雷诺数(Re)作为标准。当Re<2 300时,流体处于层流状态;当2 300<Re<10 000时,流动处于过渡区;当Re>10 000时,流动进入紊流区。Re的计算公式如下:
Re=ρυDhη
式中,ρ为冷却介质的密度,kg/m3;υ为入口流速,m/s;Dh为液冷板流道等效直径,m;η为动力黏度,kg/(m∙s)。
Dh定义如下:
Dh=4A/P
式中,P为湿周周长,m;A为湿表面积,m2。
努谢尔数Nu及对流换热系数h计算式为:
Nu=hDh/k
h=qTave-(Tinlet-Toutlet)/2
式中,h为对流换热系数,W/(m²·K);k为冷却介质传热系数,W/(m∙K);q为施加的功率,W/m2;Tave为水冷板表面平均温度,K;Tinlet,Toutlet分别为冷却介质进、出口平均温度,K。
流体在管道中流动的阻力摩擦系数f如下:
f=ΔPDh2Lρυ2
式中,∆P为流场压降,Pa;L为主流方向流道长度,m。
流动换热总能性能系数HTPE综合考虑了流动阻力、换热强度与流动结构等因素的影响,其表达式为:
HTPE=NuNu0ff0-1/3
式中,Nu0,f0为长宽比为1∶0.5的水冷板的努谢尔数和阻力摩擦系数的基准值。
以122 mm×122 mm×20 mm规格的水冷板为研究对象,采用4种不同的网格划分方案进行仿真分析。如图3所示,网格尺寸的变化对仿真结果产生显著影响。当网格数量分别增加17.6%,31.8%和57.5%时,IGBT模块的最高温度相应降低了0.83%,0.50%和0.17%。经过系统比较分析,最终确定采用141万网格单元进行模型划分,在保证计算精度的同时兼顾了计算效率,实现了最优平衡。该网格划分方案不仅适用于当前模型,对其他类似模型同样具有参考价值。
在数值模拟中采用Couple算法实现压力-速度耦合,能量方程采用二次迎风格式进行离散。冷却介质选用水,其在25 ℃时的物性参数见表2。当入口流速为0.5,1.5 m/s时,根据式(1)计算结果可知,3种尺寸水冷板内的流动均处于湍流状态,因此选用k-epsilon Realizable模型。仿真参数设置如下:单个IGBT芯片的功率损耗设为250 W,冷却水入口流速1.5 m/s,入口水温25 ℃;出口边界条件设为标准大气压;IGBT模块及水冷板四周的对流换热系数设为10 W/(m2∙K),环境温度为25 ℃。收敛准则设置为10-6,迭代步数为200步。
在散热性能方面,热阻值直接影响热量传递效率,进而决定IGBT模块的表面温度。如图4所示,3种尺寸水冷板与IGBT模块耦合模型最高温度表现出高度一致性,其中122 mm×122 mm×20 mm规格水冷板的热阻最大,导致IGBT模块表面温度最高。相比之下,122 mm×61 mm×20 mm规格水冷板由于尺寸较小、散热路径短、热阻低,展现出更好的传热特性。但3种尺寸的温差并不显著,这主要是因为芯片作为主要热源区域,热量产生相对集中,散热面积的影响不明显。以122 mm×61 mm×20 mm规格水冷板为基准,其余2种尺寸水冷板的Nu/Nu0,f/f0及HTPE值如图5所示。Nu/Nu0值始终大于1,表现出良好的传热性能,f/f0值小于1,说明增大尺寸有助于减小流道摩擦,改善流动性能。这主要是由于较小尺寸水冷板的流道较窄,会增加流体阻力,使摩擦系数增大,最终导致水泵能耗显著增加。随着Nu/Nu0值增大和f/f0值减小,HTPE值相应增大,表明增大后的水冷板有利于提升传热和流动性能。此外,在122 mm×122 mm×20 mm规格水冷板基础上继续增大散热面积,散热效果并未明显提升,反而会造成材料浪费。因此,为获得更好的散热效果,建议采用122 mm×122 mm×20 mm规格水冷板进行结构优化,设计合适的散热方案。
以122 mm×122 mm×20 mm规格的水冷板为基础,通过在每条流道内焊接平直型肋片来优化散热效果,肋片的具体结构如图6所示。
针对流道深度、肋片厚度和肋片高度3个关键参数,采用与前文相同的边界条件设计了正交试验。通过极差分析方法,确定了各参数对散热性能的影响程度及最优结构组合。试验设计的结构参数如表3所示。
表4示出相应的试验结果。分析表明,试验15方案在IGBT模块最高温度和流场压降上均表现最优。以IGBT模块最高温度、流场压降为主要指标,极差分析结果见表5。从表可知,肋片高度对两者的影响最为显著,其次为流道深度,而肋片厚度的作用相对较弱。因此,最终确定最优参数组合为:肋片高度5 mm、流道深度9 mm、肋片厚度1.5 mm。该参数组合下,IGBT模块的最高温度可控制在51.883 ℃,表明水冷板能有效传导热量至冷却介质。同时,1 200 Pa的流场压降说明系统保持了良好的流体动力学性能。优化前后的对比数据(见表6)显示,IGBT最高温度降低7.1 ℃,流场压增加639 Pa,实现了散热性能与水泵能耗的最佳平衡。这一结果证明,合理设计的平直型肋片结构能显著提升传热效率,同时对冷却系统的能耗影响在可接受范围内。
在确定水冷板最优结构参数的基础上,针对不同功率损耗和入口水温工况展开分析,同时建立试验平台以验证数值仿真结果的准确性。
选取4组不同的功率损耗工况(5,15,25,35 W)进行分析,试验过程中保持入口水温为25 ℃,冷却水流速设定为0.5 m/s。不同边界条件下芯片及基板的表面最高温度如图7所示。从图7(a)可见,随着功率损耗的增加,芯片和基板表面的最高温度均呈现上升趋势,这主要是由于功率损耗增大导致发热量增加所致。芯片温度的上升幅度明显大于基板,基板温度的变化相对平缓。这一现象表明,功率损耗的增加对芯片表面温度的影响更为显著,而对基板表面温度的影响相对较小。
保持入口流速为0.5 m/s,以15 W功率损耗为例,选取4种不同入口水温(20,25,30,35 ℃)工况进行分析。
从图7(b)可见,芯片与基板表面最高温度随入口水温升高呈现基本一致的线性上升趋势。这种现象的原因在于:
(1)水温升高改变了冷却介质的热物性参数,从而影响其导热性能;
(2)温度降低会增大冷却介质与IGBT模块之间的温差,强化换热效果。
试验数据表明,在实际应用中,适当降低冷却水入口温度可有效提升散热性能,当入口温度过高时,可通过预冷处理来提高系统的散热效率。
为验证仿真结果的准确性,建立以水为冷却介质的试验测试系统,该系统主要由电力供应模块、散热循环模块和监测控制模块组成,如图8所示。试验过程中,冷却水在水泵驱动下流经冷板吸收IGBT模块产生的热量后返回恒温水箱,形成完整的循环回路。系统配置包括:在水泵与冷板之间安装的数显流量计用于监测入口流速和温度;红外摄像机实时记录芯片最高温度;通过导热硅脂固定在芯片中心正下方基板位置的光纤温度传感器,配合专用测温软件实现基板温度的实时监测。
试验采用与仿真完全相同的边界条件,通过调节入口水温和功率损耗来记录芯片及基板的最高温度。试验数据及与仿真结果的误差见表7。
由表可知,随着功率损耗增大,二者误差相应增大,这主要是由于高功率条件下模型中忽略的次要因素影响加剧所致;而不同入口水温条件下的误差波动较小,证实了仿真模型对水温变化的响应具有有效性。所有工况下实验与仿真数据的误差均控制在13%以内,充分验证了仿真模型的准确性。
存在误差的主要原因包括:
(1)仿真模型未考虑热辐射效应,而实际环境中该因素不可避免会产生影响;
(2)实际水冷板流道表面存在加工粗糙度,但仿真中假设流道内壁为理想光滑表面;
(3)仿真过程中对环境条件等因素进行了理想化假设,与实际情况存在一定差异;
(4)网格划分精度和数值计算方法等因素也会对仿真结果产生一定影响。
(1)水冷板散热面积的确定应当基于实际散热需求和系统设计要求进行合理选择和优化。针对92 mm×32 mm×3 mm规格IGBT模块,通过对3种不同尺寸水冷板的对比分析,结果表明,尺寸为122 mm×122 mm×20 mm的水冷板具有最佳的散热效率。
(2)在水冷板流道内布置肋片可有效增强散热效果。针对122 mm×122 mm×20 mm规格的水冷板,通过系统优化得到最佳结构参数组合为:流道深度9 mm、肋片高度5 mm、肋片厚度1.5 mm。该优化设计使IGBT模块的最高工作温度降低了7.1 ℃,同时流场压降增加了639 Pa,在提升散热效率的同时保持了合理的水泵能耗水平,实现了散热性能与系统能耗的最佳平衡。
(3)通过试验与仿真相结合的研究方法发现,随着功率损耗和入口水温的持续增加,芯片与基板表面的最高温度呈现明显的上升趋势,而流场压降则不受功率损耗变化的影响。当功率损耗增大时,系统的热动态特性趋于复杂化,导致试验结果与仿真数据之间的误差相应增大;相比之下,入口水温的变化对试验与仿真结果的吻合度影响较小。

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doi: 10.3969/j.issn.1005-0329.2025.07.005
  • 接收时间:2024-11-19
  • 首发时间:2026-10-20
  • 出版时间:2025-07-30
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  • 收稿日期:2024-11-19
  • 修回日期:2025-05-16
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    天津城建大学 能源与安全工程学院,天津 300384
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2种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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