Article(id=1316695292544659713, tenantId=1146029695717560320, journalId=1308397381743640680, issueId=1316695224617914963, articleNumber=null, orderNo=null, doi=null, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1732204800000, receivedDateStr=2024-11-22, revisedDate=1744128000000, revisedDateStr=2025-04-09, acceptedDate=null, acceptedDateStr=null, onlineDate=1791854220758, onlineDateStr=2026-10-13, pubDate=1768406400000, pubDateStr=2026-01-15, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1791854220758, onlineIssueDateStr=2026-10-13, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1791854220758, creator=13701087609, updateTime=1791854220758, updator=13701087609, issue=Issue{id=1316695224617914963, tenantId=1146029695717560320, journalId=1308397381743640680, year='2026', volume='44', issue='1', pageStart='1', pageEnd='224', issueExtLink='null', onlineDate='null', pubDate='1768406400000', pubDateStr='2026-01-15', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1791854204563, creator='13701087609', updateTime=1791854713654, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext={EN=IssueExt(id=1316697359963239159, tenantId=1146029695717560320, journalId=1308397381743640680, issueId=1316695224617914963, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1316697359963239160, tenantId=1146029695717560320, journalId=1308397381743640680, issueId=1316695224617914963, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null, downloadFileDto=null}, startPage=154, endPage=165, ext={EN=ArticleExt(id=1316695292985061634, articleId=1316695292544659713, tenantId=1146029695717560320, journalId=1308397381743640680, language=EN, title=Research on the dynamic evolution paths of key core technologies from the perspective of root technology: A case study of chip lithography, columnId=1309226334803550422, journalTitle=Studies in Science of Science, columnName=Innovation Explorations, runingTitle=null, highlight=null, articleAbstract=

Chip lithography technology is a pivotal component in the semiconductor manufacturing domain and exemplifies the “root-trunk-branch” characteristics of a complex technology cluster. Its relevance extends beyond individual processes, influencing a country’s comprehensive technological capabilities and industrial competitiveness. However, existing research has offered only limited insight into how these multifaceted core technologies evolve in clusters over time. In an effort to address this knowledge gap, researchers introduced the concept of “root technology,” employing both explicit and implicit relationships derived from patent data to explore the dynamic evolution of key core technologies. By incorporating terminology extraction, clustering analysis, and related methods, they developed an analytical model that delineates the way crucial lithography innovations emerge and transform.

The findings of this study highlight four principal root technologies within the broader chip lithography system—projection exposure technology, direct-write lithography technology, photoresist materials, and photomask manufacturing. Together, they form the backbone of chip lithography’s evolution and diverge into distinct pathways of development. While projection exposure technology tends to merge features from various domains (reflecting a fusion-oriented path), direct-write lithography gradually contracts into more specialized niches, signaling a pattern of consolidation. Photoresist materials expand and diversify to accommodate evolving demands and technical frontiers, illustrating a path of sustained growth. By contrast, photomask manufacturing branches out into multiple subfields, capturing a split-type trajectory that underscores the complexity and range of potential innovations in that area.

This comparative perspective on distinct evolutionary paths accentuates the defining traits of root technologies: they provide a fundamental foundation for subsequent developments; they exhibit high levels of complexity and intricate integration with complementary domains; and they impose significant barriers to entry, owing to their specialized expertise, substantial R&D requirements, and stringent quality standards. Such insights contribute to a deeper understanding of the unique nature of root technologies, advance theoretical frameworks on complex innovation clustering, and add practical value for policymakers and industry leaders.

In particular, these outcomes offer concrete guidance for China’s chip lithography sector, which faces urgent demands for technological breakthroughs. By pinpointing the specific root technologies and clarifying how each one evolves, researchers and practitioners can formulate strategies to distribute resources more effectively, foster targeted collaborations, and stimulate ongoing innovation in lithography manufacturing. Ultimately, appreciating the interconnected yet distinct evolution paths of projection exposure, direct-write lithography, photoresist materials, and photomask manufacturing helps lay the groundwork for robust policy decisions and industrial strategies that will shape the future of semiconductor fabrication.

, authors=Bi-xiang SHI1, 2, Jin CHEN2, 3, Ya-dong LI4, Hong-si ZHANG1, Fen-fen WEI5, authorsList=Bi-xiang SHI, Jin CHEN, Ya-dong LI, Hong-si ZHANG, Fen-fen WEI, authorCompany=null, correspAuthors=Hong-si ZHANG, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1316695296659271951, articleId=1316695292544659713, tenantId=1146029695717560320, journalId=1308397381743640680, language=CN, title=根技术视角下关键核心技术动态演化路径研究——以芯片光刻技术为例, columnId=1309226334996488408, journalTitle=科学学研究, columnName=创新探索, runingTitle=null, highlight=null, articleAbstract=

芯片光刻技术是半导体制造领域的关键核心技术,具有典型的“根—干—叶”错综交杂的技术簇特征,深刻决定着国家综合科技水平和产业竞争力。但现有研究对“复杂成簇”的关键核心技术体系如何动态演化仍然知之甚少。为此,引入根技术的研究视角,采用专利数据中的显性和隐性关系识别工具,以及术语抽取、聚类分析等方法,构建出根技术视角下关键核心技术动态演化路径的分析模型。实证结果表明:(1)芯片光刻技术体系中的根技术主要包括投影式曝光技术、直写式光刻技术、光刻胶材料以及光掩膜制造技术,共同支撑了芯片光刻技术体系的动态演化,使其分别呈现出融合型、收缩型、增长型和分裂型四种演化路径;(2)芯片光刻技术演化的不同路径也分别展现出根技术所具有的基础性、复杂性、集成性、高壁垒性等突出特征。研究结果深化了对根技术独特内涵的理解与认识,丰富了关键核心技术系统动态演化的相关研究,同时也为系统推进我国芯片光刻技术的创新突破提供了针对性与可操作性的参考与借鉴。

, authors=施必翔1, 2, 陈劲2, 3, 李亚东4, 张闳肆1, 魏芬芬5, authorsList=施必翔, 陈劲, 李亚东, 张闳肆, 魏芬芬, authorCompany=null, correspAuthors=张闳肆, authorNote=

施必翔(1993-),男,助理研究员,博士后。

陈劲(1968-),男,教授、博士生导师。

李亚东(1992-),男,中级经济师。

魏芬芬(1992-),女,讲师。

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张闳肆(1994-),男,助理研究员,博士后, E-mail:。
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陈劲(1968-),男,教授、博士生导师。

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陈劲(1968-),男,教授、博士生导师。

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李亚东(1992-),男,中级经济师。

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魏芬芬(1992-),女,讲师。

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language=CN, label=图6, caption=芯片光刻技术体系中的根技术, figureFileSmall=+JimYuFiZfv5UtGUYSNHvw==, figureFileBig=E5SzbdzSBcfqLpAbFPr8SA==, tableContent=null), ArticleFig(id=1316695305156931924, tenantId=1146029695717560320, journalId=1308397381743640680, articleId=1316695292544659713, language=EN, label=Table 1, caption=

Comparative analysis between root technology and key core technology

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对比维度 根技术 关键核心技术
定义 底层支撑技术,为技术系统提供基础性支持,通常具有跨领域的适用性 领域内具有核心支撑地位和战略意义的技术,主要解决行业内关键问题
作用 支撑整个技术体系的稳定性和扩展性 提升产业链的竞争力、创新能力和国际地位
适用范围 广泛适用于多个领域或技术体系,具有高度普适性 主要应用于特定行业或领域,具有较强的行业专用性
核心特征 基础性、难以替代性、广泛适用性 高度复杂性、高度集成性、非均匀性、高壁垒性与高价值性
支撑方式 通过底层技术支持整个技术生态的稳定发展 通过核心应用和创新提升产业链的技术水平和竞争优势
相互关联 为关键核心技术提供底层支撑,奠定基础框架 对根技术提出更高需求,推动根技术的创新和完善
), ArticleFig(id=1316695305261789525, tenantId=1146029695717560320, journalId=1308397381743640680, articleId=1316695292544659713, language=CN, label=表1, caption=

根技术与关键核心技术的比较分析

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对比维度 根技术 关键核心技术
定义 底层支撑技术,为技术系统提供基础性支持,通常具有跨领域的适用性 领域内具有核心支撑地位和战略意义的技术,主要解决行业内关键问题
作用 支撑整个技术体系的稳定性和扩展性 提升产业链的竞争力、创新能力和国际地位
适用范围 广泛适用于多个领域或技术体系,具有高度普适性 主要应用于特定行业或领域,具有较强的行业专用性
核心特征 基础性、难以替代性、广泛适用性 高度复杂性、高度集成性、非均匀性、高壁垒性与高价值性
支撑方式 通过底层技术支持整个技术生态的稳定发展 通过核心应用和创新提升产业链的技术水平和竞争优势
相互关联 为关键核心技术提供底层支撑,奠定基础框架 对根技术提出更高需求,推动根技术的创新和完善
), ArticleFig(id=1316695305362452822, tenantId=1146029695717560320, journalId=1308397381743640680, articleId=1316695292544659713, language=EN, label=Table 2, caption=

The selection for core patents

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筛选依据 筛选条件 专利数量
专利检索 关键词、时间、IPC分类号 55375
技术先进性 引用专利数量>2 43262
专利技术宽度>1 22610
市场价值性 同族专利数量>2 13600
公开国家/地区/组织(七国二组织) 13457
法律排他性 权利要求数量>5 11340
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核心专利筛选

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筛选依据 筛选条件 专利数量
专利检索 关键词、时间、IPC分类号 55375
技术先进性 引用专利数量>2 43262
专利技术宽度>1 22610
市场价值性 同族专利数量>2 13600
公开国家/地区/组织(七国二组织) 13457
法律排他性 权利要求数量>5 11340
), ArticleFig(id=1316695305509253464, tenantId=1146029695717560320, journalId=1308397381743640680, articleId=1316695292544659713, language=EN, label=Table 3, caption=

The evolutionary pathways and features of chip lithography from the perspective of root technology

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根技术 动态演化路径 路径描述与解释 路径演化趋势 特征 特征解释
投影式曝光技术 投影对准系统→物镜及成像系统→投影式曝光→投影曝光系统→CIS成像系统 早期采用接触式、接近式光刻→亚微米级后,投影式光刻成为主流→精确对准掩膜、镜头和晶圆 对应新技术(如AI、无人驾驶)需提高曝光精度与生产效率 融合型 结合多种技术,形成综合系统,推动新应用
直写式光刻技术 电子束曝光→电子束检测装置及检测系统 早期关注基础电子束曝光→逐步转向集成电路缺陷检测技术→分辨率可达10nm 提高检测效率以适应规模化检测,克服检测速度较慢的问题 收缩型 随着技术的演变,逐渐聚焦于特定应用,减少复杂性
光刻胶材料 光刻胶成分及光化学反应→多重曝光光刻胶→先进光刻胶材料 早期研究基本成分和反应→新工艺要求更高光刻胶性能→EUV技术推动材料更新,出现液态固体氧化物光刻胶等 解决传统光刻胶在EUV下的问题,满足更小制程需求 增长型 随着新技术需求,材料性能不断提升,市场需求上升
光掩膜制造技术 光掩膜制造→硬掩膜技术→新型掩膜材料与图形对准技术 早期重基础工艺流程→硬掩膜技术适应多重光刻→新型材料研发(如合成石英) 提高对准系统稳定性与精确性,以达到1-2nm的套刻精度 分裂型 技术发展过程中出现多样化,形成多个新方向与材料
演化总体特征 芯片光刻技术历经融合型、收缩型、增长型和分裂型四种演化路径
演化路径趋势 为满足新兴技术的需求,光刻技术的发展需实现更高的曝光精度和生产效率,同时扩大应用领域
根技术的作用 基础性和战略性作用,作为技术基础逐步衍生出多个技术簇,推动其经历新生→增长→融合→收缩→分裂的过程,并最终支持芯片光刻等产业链上下游的整体发展
), ArticleFig(id=1316695305584750937, tenantId=1146029695717560320, journalId=1308397381743640680, articleId=1316695292544659713, language=CN, label=表3, caption=

根技术视角下的芯片光刻技术演化路径及特征

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根技术 动态演化路径 路径描述与解释 路径演化趋势 特征 特征解释
投影式曝光技术 投影对准系统→物镜及成像系统→投影式曝光→投影曝光系统→CIS成像系统 早期采用接触式、接近式光刻→亚微米级后,投影式光刻成为主流→精确对准掩膜、镜头和晶圆 对应新技术(如AI、无人驾驶)需提高曝光精度与生产效率 融合型 结合多种技术,形成综合系统,推动新应用
直写式光刻技术 电子束曝光→电子束检测装置及检测系统 早期关注基础电子束曝光→逐步转向集成电路缺陷检测技术→分辨率可达10nm 提高检测效率以适应规模化检测,克服检测速度较慢的问题 收缩型 随着技术的演变,逐渐聚焦于特定应用,减少复杂性
光刻胶材料 光刻胶成分及光化学反应→多重曝光光刻胶→先进光刻胶材料 早期研究基本成分和反应→新工艺要求更高光刻胶性能→EUV技术推动材料更新,出现液态固体氧化物光刻胶等 解决传统光刻胶在EUV下的问题,满足更小制程需求 增长型 随着新技术需求,材料性能不断提升,市场需求上升
光掩膜制造技术 光掩膜制造→硬掩膜技术→新型掩膜材料与图形对准技术 早期重基础工艺流程→硬掩膜技术适应多重光刻→新型材料研发(如合成石英) 提高对准系统稳定性与精确性,以达到1-2nm的套刻精度 分裂型 技术发展过程中出现多样化,形成多个新方向与材料
演化总体特征 芯片光刻技术历经融合型、收缩型、增长型和分裂型四种演化路径
演化路径趋势 为满足新兴技术的需求,光刻技术的发展需实现更高的曝光精度和生产效率,同时扩大应用领域
根技术的作用 基础性和战略性作用,作为技术基础逐步衍生出多个技术簇,推动其经历新生→增长→融合→收缩→分裂的过程,并最终支持芯片光刻等产业链上下游的整体发展
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根技术视角下关键核心技术动态演化路径研究——以芯片光刻技术为例
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施必翔 1, 2 , 陈劲 2, 3 , 李亚东 4 , 张闳肆 1 , 魏芬芬 5
科学学研究 | 创新探索 2026,44(1): 154-165
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科学学研究 |创新探索 2026 , 44 (1) : 154 -165
根技术视角下关键核心技术动态演化路径研究——以芯片光刻技术为例
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魏芬芬(1992-),女,讲师。

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魏芬芬(1992-),女,讲师。

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施必翔1, 2, 陈劲2, 3, 李亚东4, 张闳肆1 , 魏芬芬5
作者信息
  • 1 中国工程院战略咨询中心, 北京 100088
  • 2 清华大学经济管理学院, 北京 100084
  • 3 清华大学技术创新研究中心, 北京 100084
  • 4 国家新能源汽车技术创新中心, 北京 100176
  • 5 南京邮电大学管理学院, 江苏南京 210003
通讯作者:
张闳肆(1994-),男,助理研究员,博士后, E-mail:。
作者简介:

施必翔(1993-),男,助理研究员,博士后。

陈劲(1968-),男,教授、博士生导师。

李亚东(1992-),男,中级经济师。

魏芬芬(1992-),女,讲师。

Research on the dynamic evolution paths of key core technologies from the perspective of root technology: A case study of chip lithography
Bi-xiang SHI1, 2, Jin CHEN2, 3, Ya-dong LI4, Hong-si ZHANG1 , Fen-fen WEI5
Affiliations
  • 1 Center for Strategic Studies, Chinese Academy of Engineering, Beijing 100088, China
  • 2 School of Economics and;Management, Tsinghua University, Beijing 100084, China
  • 3 Research Center for Technological Innovation, Tsinghua University, Beijing 100084, China
  • 4 National New Energy Vehicle Technology Innovation Center, Beijing 100176, China
  • 5 School of Management, Nanjing University of Posts and Telecommunications, Nanjing 210003, China
出版时间: 2026-01-15
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芯片光刻技术是半导体制造领域的关键核心技术,具有典型的“根—干—叶”错综交杂的技术簇特征,深刻决定着国家综合科技水平和产业竞争力。但现有研究对“复杂成簇”的关键核心技术体系如何动态演化仍然知之甚少。为此,引入根技术的研究视角,采用专利数据中的显性和隐性关系识别工具,以及术语抽取、聚类分析等方法,构建出根技术视角下关键核心技术动态演化路径的分析模型。实证结果表明:(1)芯片光刻技术体系中的根技术主要包括投影式曝光技术、直写式光刻技术、光刻胶材料以及光掩膜制造技术,共同支撑了芯片光刻技术体系的动态演化,使其分别呈现出融合型、收缩型、增长型和分裂型四种演化路径;(2)芯片光刻技术演化的不同路径也分别展现出根技术所具有的基础性、复杂性、集成性、高壁垒性等突出特征。研究结果深化了对根技术独特内涵的理解与认识,丰富了关键核心技术系统动态演化的相关研究,同时也为系统推进我国芯片光刻技术的创新突破提供了针对性与可操作性的参考与借鉴。

根技术  /  动态演化路径  /  技术关联度  /  关键核心技术  /  芯片光刻

Chip lithography technology is a pivotal component in the semiconductor manufacturing domain and exemplifies the “root-trunk-branch” characteristics of a complex technology cluster. Its relevance extends beyond individual processes, influencing a country’s comprehensive technological capabilities and industrial competitiveness. However, existing research has offered only limited insight into how these multifaceted core technologies evolve in clusters over time. In an effort to address this knowledge gap, researchers introduced the concept of “root technology,” employing both explicit and implicit relationships derived from patent data to explore the dynamic evolution of key core technologies. By incorporating terminology extraction, clustering analysis, and related methods, they developed an analytical model that delineates the way crucial lithography innovations emerge and transform.

The findings of this study highlight four principal root technologies within the broader chip lithography system—projection exposure technology, direct-write lithography technology, photoresist materials, and photomask manufacturing. Together, they form the backbone of chip lithography’s evolution and diverge into distinct pathways of development. While projection exposure technology tends to merge features from various domains (reflecting a fusion-oriented path), direct-write lithography gradually contracts into more specialized niches, signaling a pattern of consolidation. Photoresist materials expand and diversify to accommodate evolving demands and technical frontiers, illustrating a path of sustained growth. By contrast, photomask manufacturing branches out into multiple subfields, capturing a split-type trajectory that underscores the complexity and range of potential innovations in that area.

This comparative perspective on distinct evolutionary paths accentuates the defining traits of root technologies: they provide a fundamental foundation for subsequent developments; they exhibit high levels of complexity and intricate integration with complementary domains; and they impose significant barriers to entry, owing to their specialized expertise, substantial R&D requirements, and stringent quality standards. Such insights contribute to a deeper understanding of the unique nature of root technologies, advance theoretical frameworks on complex innovation clustering, and add practical value for policymakers and industry leaders.

In particular, these outcomes offer concrete guidance for China’s chip lithography sector, which faces urgent demands for technological breakthroughs. By pinpointing the specific root technologies and clarifying how each one evolves, researchers and practitioners can formulate strategies to distribute resources more effectively, foster targeted collaborations, and stimulate ongoing innovation in lithography manufacturing. Ultimately, appreciating the interconnected yet distinct evolution paths of projection exposure, direct-write lithography, photoresist materials, and photomask manufacturing helps lay the groundwork for robust policy decisions and industrial strategies that will shape the future of semiconductor fabrication.

root technology  /  dynamic evolution paths  /  technological Interrelatedness  /  key core technologies  /  chip lithography
施必翔, 陈劲, 李亚东, 张闳肆, 魏芬芬. 根技术视角下关键核心技术动态演化路径研究——以芯片光刻技术为例. 科学学研究, 2026 , 44 (1) : 154 -165 .
Bi-xiang SHI, Jin CHEN, Ya-dong LI, Hong-si ZHANG, Fen-fen WEI. Research on the dynamic evolution paths of key core technologies from the perspective of root technology: A case study of chip lithography[J]. Studies in Science of Science, 2026 , 44 (1) : 154 -165 .
党的二十届四中全会通过的《中共中央关于制定国民经济和社会发展第十五个五年规划的建议》提出:“全链条推动集成电路、工业母机、高端仪器、基础软件、先进材料、生物制造等重点领域关键核心技术攻关取得决定性突破”。当前,科技革命与大国博弈相互交织的形势错综复杂,以芯片光刻为代表的关键核心技术领域已成为国际竞争的主要战场,深刻决定着国家综合科技水平与竞争优势[1,2]。事实上,关键核心技术是一个涉及基础工艺、生产设备、关键材料等子技术分支的复杂技术体系[3],具有典型的“根—干—叶”层次交织的复杂技术簇特征。其中,根技术(root technology)可以理解为支撑技术簇底层的核心技术,不仅决定了整个技术体系的稳定性和可扩展性,还能为上层技术的不断创新和演化提供支撑[4,5]。同时,与其他技术相似的是,关键核心技术本身也处于不断演化发展的过程中,并大致遵循了一定路径[6,7]。由此,深入挖掘并识别关键核心技术伴随时间发展的动态路径,不仅有助于明确关键核心技术突破的重点方向,更对于优化配置科技资源,推进高水平科技自立自强具有重要意义[8]。
围绕技术演化路径的相关主题,已有研究结合专利数据开展分析,取得了一些值得借鉴的研究成果。但总体而言,现有研究对技术主题的动态演化特征理解仍然较为局限,无法为技术主题的新生、融合、分裂以及消亡等提供更为深入的洞见[8]。同时,现有研究大多只围绕专利数据的某一方面特征开展分析,不仅难以全面刻画具有高度复杂性的关键核心技术系统,还可能导致分析结果出现偏差[9]。此外,虽然已有少量研究逐渐关注到关键核心技术演化议题[6,10],但遗憾的是,对该技术体系本身具有的“复杂成簇”结构特征关注不足[11],尤其是还未充分认识“根技术”在关键核心技术系统演化分析中具有的独特价值,这限制了对关键核心技术演化方向及其内在规律的深入理解。
基于上述分析,本文引入根技术的视角,围绕“如何科学识别、把握关键核心技术动态演化路径”这一研究问题,采用术语抽取、文本聚类的分析方法,结合技术工艺的深度解析,综合考虑文本相似度、IPC相似度、专利引用因素,构建出关键核心技术动态演化路径的分析模型,并以集成电路领域具有代表性的关键核心技术——芯片光刻技术为例进行了实证分析。相关结论弥补了现有研究的不足之处,并为相关产业实践提供了具有针对性与可操作性的参考与借鉴。
(1)关键核心技术
关键核心技术是一组特有的技术体系,占据并控制着行业或领域的制高点,在企业转型升级、参与全球价值链竞争以及构建科技话语权等方面发挥着至关重要的作用[12]。回顾已有研究发现,伴随相关产业实践的不断推进,学者们从不同角度对关键核心技术的内涵进行了积极刻画与探索。但就整体而言,理论界对关键核心技术的概念与内涵尚未形成统一认识[2]。在此基础上,本文认为:关键核心技术是占据特定领域制高点的技术体系,只被极少数企业垄断控制且难以被模仿、替代。
关键核心技术的主要特征包括:①高度复杂性。关键核心技术本质上是一个整合研发全过程中众多底层基础知识的体系,从属于复杂性知识的技术实现[2]。②高度集成性。关键核心技术的实现需要技术网络、技术集群等不同组成要素或底层技术的高度集成,以实现更高层次的系统功能[10]。③非均匀性。关键核心技术不同组成要素间因内部结构、连接方式等因素呈现不同的能量密度,导致特定部分会处于更重要、更活跃的地位,呈现出非均匀特征。④高壁垒性与高价值性。关键核心技术难以短期内被模仿或超越,这促使领域内技术拥有者具有明显先发优势,并在技术竞争过程中占据绝对的垄断统治地位,进而获取超额利润,甚至能助推企业与产业在全球价值链中获取更有力的战略地位[13]。
(2)根技术
根技术的概念较常见于科技政策文件中。一般认为,根技术能看作“技术树”的“根系”,是能够为技术体系提供基础性支撑的核心技术,其能为上层技术的发展和应用提供必要的支持[4]。也有学者提出,根技术可以衍生并支撑多个技术簇,其作用涵盖了技术系统的各个层次,对系统的稳定性、可持续性和竞争力具有决定性影响[5]。综合现有研究,本文提出:根技术是关键核心技术体系的底层支撑,具有跨领域的通用性和广泛适用性,是整个技术系统稳定运行的保障。
根技术的主要特征包括:①基础性。根技术位于技术体系的底层,决定了上层应用技术的稳定性和发展潜力,起到“技术底座”的作用[4]。②难以替代性。根技术开发周期长、替代难度较大,短期内难以被模仿或替代,只有通过长期投入和积累才能形成成熟的根技术体系[14]。③广泛适用性。根技术通常具有高度的集成性和普适性,能够支持多个领域和技术簇的发展[5]。总而言之,根技术在现代技术生态体系中占据重要地位,特别是在智能制造和信息技术加持下,根技术具备了新的数字化特征,能够为现代化产业链的健康稳定运行提供有力保障[15]。
综上所述,作为现代技术体系中的两个重要构念,根技术和关键核心技术虽然在概念上存在交集,但其本质、定位和作用有所不同,如表1所示。
技术演化路径的本质是一种技术分析活动,旨在描述由产生到当前阶段,技术伴随时间持续发展的动态轨迹,是技术创新过程的长期积累[8]。现有技术演化路径的相关研究主要依托专利数据展开分析,并且可以根据技术路径识别方法的差异,大致将已有研究划分为以下两类。
第一,基于专利指标显性关系的技术路径识别,即通过分析专利关键指标以直观描述技术的演化发展过程。一方面,有学者利用专利分类号构建得出专利共现网络,进而借助算法或关键路径分析等方法,挖掘出技术发展的演化路径[16,17];另一方面,还有学者选择构建出专利引文网络,结合社会网络分析法、针对网络结构的算法等,探索专利知识的流动,进而提取网络中的技术演化主路径[18,19]。
第二,基于专利文本隐性关系的技术路径识别,即通过对专利文本的信息挖掘,得到技术之间的隐性关联关系,进而展现技术的渐进式演化发展过程。已有研究主要采用关键词词频结合共词、时间序列等方法开展分析[8]。值得注意的是,伴随自然语言处理技术的快速发展,有学者开始利用新型无监督学习模型来识别技术演化关系,其中具有代表性的模型包括LDA主题模型[20,21]、SAO语义分析技术[22,23]、word2vec词嵌入模型[24]等。
已有研究围绕技术演化路径的识别与刻画,形成了一系列值得借鉴的研究成果。但现有研究对技术主题的动态演化特征理解仍然较为局限,无法为技术主题的新生、融合、分裂以及消亡等提供更为深入的洞见[8]。同时,已有研究大多只围绕专利数据的某一方面特征开展分析,不仅难以全面刻画具有高度复杂性的关键核心技术系统,还可能导致分析结果出现偏差[9]。此外,虽然已有少量研究逐渐关注起关键核心技术演化议题[6,10],但对“复杂成簇”的技术体系结构关注仍有不足[11]。事实上,以芯片光刻为代表的关键核心技术具有典型的“根—干—叶”庞杂的技术簇特征,根技术视角下的关键核心技术动态演化呈现为一个系统性的变迁过程,涉及到知识的多层级传播和跨领域交互,这无疑能为深入理解关键核心技术演化方向及其内在规律带来新的洞见。
为准确识别、把握关键核心技术的动态演化路径,本研究在对专利数据进行收集、清洗、预处理的基础上,进一步划分出关键核心技术的发展阶段,筛选出核心专利,进而采用术语抽取、聚类分析等方法,结合该技术工艺的深度解析,综合考虑文本相似度、IPC相似度、专利引用数量等因素,识别出关键核心技术不同发展阶段的技术主题,并通过引入根技术视角,最终勾勒出根技术视角下该技术的动态演化路径,研究框架如图1所示。
(1)专利术语抽取
通过提取专利术语并进行演化分析,能客观地揭示技术发展的脉络。在前人研究基础上,本研究采用了YAKE!算法进行术语抽取,主要围绕大写形式、位置信息、文本频率等5个文本特征对专利关键词开展评价分析[25]。
(2)技术主题聚类
基于专利的技术主题分析能反映领域内技术发展方向和趋势[8]。本文借鉴李乾瑞等[26]的研究,采用专利术语的TF-IDF值构建向量空间模型,并融入技术发展的动态分析与最优聚类数量识别,以最终完成技术主题的聚类。
(3)技术关联度测算
为更加准确、全面地度量技术主题的动态演化过程,本文采用余弦相似度对IPC相似度、文本相似度进行计算,并融入专利引用数量,进而测算出技术关联度指标,以全面反映出专利指标的显性关系与专利文本的隐性关系[8]。
在已有研究基础上,本文依据典型性、数据可获得性等原则[10],选取半导体制造领域中关键核心技术——芯片光刻为实证分析对象。如图2所示,芯片光刻技术系统由若干个具有特定功能的子系统相互作用所构成,其核心组成主要包括光源子系统、投影光学子系统、工作台子系统、掩膜台子系统以及晶圆子系统。
本文采用德温特专利情报数据库(DII)作为检索系统,以获取与芯片光刻技术相关的专利数据。通过参照已有研究的检索策略[27],结合国家标准《集成电路制造设备术语》(GB/T 40577-2021)和《微电子学微光刻技术术语(征求意见稿)》中规定的芯片光刻工艺的专业术语,最终确定用于芯片光刻技术专利检索的表达式。本文将检索时间范围设定在1955年至2021年之间,剔除标题和摘要缺失的数据,最终收集了55375件专利数据作为初始专利集。
(1)技术阶段划分
如图3所示,全球光刻专利的年度申请数量逐步增长,并在2007年左右达到年度峰值,随后逐渐呈现出平稳下滑的趋势。进一步,本文结合技术专利申请趋势、技术应用发展实际情况,大致将光刻技术的发展历程划分为2001年之前的萌芽期,2002-2011年的成长期,以及2011年至今的成熟期。
(2)核心专利筛选
为了有效抑制低价值的冗余信息对演化路径识别的影响,本文借鉴杨武等[28]的做法,以技术先进性、市场价值性、法律排他性为重点,最终筛选得出11340件光刻技术的核心专利,如表2所示。
(1)技术主题聚类
在专利术语抽取的基础上,本文利用术语TF-IDF值构建出向量空间模型,并通过将聚类数量的取值范围设定为[10,20],得出不同技术阶段的轮廓系数曲线,如图4所示。进一步,基于轮廓系数曲线的峰值,本文得出光刻技术萌芽期、成长期、成熟期的最优聚类数量分别为14、16、15,并将上述结果引入K-means模型,完成光刻技术主题的聚类。
(2)技术工艺解析
根据TF-IDF值排序,本文进一步识别出各个技术主题中排名前5位的关键术语,并深入挖掘关键术语的技术信息,结合技术主题排名前3位IPC号,解析出不同阶段光刻技术各个技术主题所对应的具体工艺。
(3)技术关联度测算
本文引入文本相似度、IPC相似度,以及专利引用数量3项指标,计算得出技术关联度,进而生成芯片光刻技术的动态演化路径图谱,如图5所示。其中,节点大小表示技术主题包含专利的数量,反映了技术主题的研究热度;曲线宽度则表示技术关联度的强度。
(4)分析结果
第一,在技术萌芽期,技术主题包括激光光源调制(T1_2)、投影式曝光(T1_13),这两项技术是芯片光刻技术体系的基础和关键。可见,芯片光刻技术发展初期的研究焦点主要集中在共性基础技术的研发。
第二,在技术成长期,技术主题包括PCB制造(T2_3)、CIS电路(T2_14),其中涉及到的PCB电路板、CMOS图像传感器皆属于光刻机制备的核心元器件。可见,伴随技术不断进步,芯片光刻的研究焦点逐渐转向光刻技术的应用。
第三,在技术成熟期,技术主题有CMOS成像器件(T3_2)、SPAD器件制造(T3_6)、图像传感器结构(T3_8)、晶圆成像技术(T3_11)。可见,伴随技术不断成熟,围绕新型工艺、新型元器件的研究逐渐成为主流。
根技术是支撑多个技术簇发展的基础性技术,涉及到广泛的知识和技术领域。显而易见的是,芯片光刻技术具有典型的“根—干—叶”庞杂的技术簇特征。因此,在上述分析结果基础上,本文进一步引入根技术为理论视角,进而分析得出芯片光刻技术体系中的四类根技术,即投影式曝光技术、直写式光刻技术、光刻胶材料以及光掩模制造技术,如图6所示。
通过与芯片光刻技术的产业实践进行反复比对、迭代,本文进一步提炼出根技术视角下芯片光刻技术的演化路径及特征,如表3所示。结果显示:芯片光刻技术的动态演化经历了融合型、收缩型、增长型和分裂型四种不同的演化路径,并主要表现为光刻技术体系中根技术主题的融合、收缩、增长以及分裂。同时,芯片光刻技术的不同演化路径也分别展现出根技术所具有的不同突出特性。
(1)投影式曝光技术
该根技术主题首先经过投影对准系统(T1_4)、物镜及成像系统(T1_10)、投影式曝光(T1_13)发生技术融合,形成投影曝光系统(T2_9),随后演化为CIS成像系统(T3_12),呈现出融合型特征。事实上,在光刻技术发展初期,接触式、接近式光刻是主要的技术工艺,在工艺节点达到亚微米级之后,投影式光刻逐步发展为主流技术工艺,即通过成像物镜组成的投影光学系统进行曝光,以极高的精度对准掩膜、镜头和晶圆,使电路图形无损地正确投影至涂覆光刻胶的晶圆上。随后投影式曝光技术在CMOS图像传感器制造中得到普遍应用,典型制造工艺包括像素隔离、晶圆堆叠等。
可见,芯片光刻技术的动态演化呈现出“融合型”路径,并展现出根技术具有的基础性和集成性特征,即通过多种技术整合形成高度协同的技术系统,以满足不断提升的技术需求,同时也验证了根技术在关键技术领域的支撑作用。
(2)直写式光刻技术
该根技术主题经历了由电子束曝光(T1_7)发展演化至电子束检测装置及检测系统(T2_13、T3_4)的演化过程,强度逐渐减弱,呈现出收缩型特征。事实上,电子束光刻是一种通过聚焦电子束,将电路图形直接投射在晶圆上的直写式光刻技术,在曝光过程中无需光掩膜、光学物镜组。早期研究主要关注于基础电子束曝光技术,后期逐渐转向对基于标准图像的集成电路缺陷检测技术开展研究,相比传统的光学检测,电子束检测可以达到10nm以内分辨率,未来技术提升方向是提高检测效率以适应规模化检测,以克服检测速度较慢的问题。
可见,芯片光刻技术的动态演化呈现出“收缩型”路径,表现为逐渐聚焦于特定的核心应用领域的专业化过程,展现了根技术具有的高壁垒性特征,并进一步验证了根技术在保障关键工艺和产品独特性的作用。
(3)光刻胶材料
该根技术主题由研究光刻胶成分及光化学反应(T1_1)演化为多重曝光光刻胶(T2_12),进一步增长为先进光刻胶材料(T3_5),呈现出增长型特征。事实上,光刻胶材料的早期研究主要面向基本成分和化学反应,随着浸没式光刻、多重曝光等新型光刻工艺的出现,对光刻胶提出了更加严苛的要求,例如在双重曝光LELE技术中,非曝光区域光刻胶可能受衍射影响超过曝光阈值,进而造成光刻图形误差,因此对光刻胶的阈值精度的要求更高。此外,近年来,随着EUV光刻技术推动芯片制程逐渐向3nm以下发展,液态固体氧化物光刻胶、EUV干式光刻胶等先进解决方案也不断涌现。
可见,芯片光刻技术的动态演化呈现出“增长型”路径,表现为在技术需求推动下,光刻胶材料从基础化学成分逐步演进为适应新型工艺(如EUV光刻)的先进材料,体现了根技术随需求变化不断演进的突出特性。
(4)光掩膜制造技术
该根技术主题由光掩膜制造(T1_12)发展演化为硬掩膜技术(T2_2),然后分裂为新型掩膜材料(T3_14)、图形对准技术(T3_15),呈现出分裂型特征。事实上,光掩膜制造技术的早期研究更加注重基础的工艺流程,根据预先设计的电路图形,在基板的感光材料上进行曝光、显影。随着光刻技术不断进步,适应多重光刻工艺的硬掩膜技术出现,通过将设计图形拆分进行多次光刻,在硬掩膜上得到完整电路图形,以获得更高分辨率。当前,新型基板材料的主要研发方向是合成石英,具有透光率高、化学性质稳定的优势,掩膜表面使用的光学膜材料也受到一定关注。同时随着工艺节点的提升,通过机械控制系统进行掩膜图形对准技术也更加精密化,不断强化对准系统的稳定性和精确性以为图形正确曝光提供有力支撑。
可见,芯片光刻技术的动态演化呈现出“分裂型”路径,反映了根技术在发展过程中的分化与多样性。同时,通过新的掩膜材料和图形对准技术也拓展了根技术的应用领域,符合其适应复杂多样应用场景的特征。
本文围绕“如何科学识别、把握关键核心技术动态演化路径”这一问题,引入根技术视角,采用专利术语抽取、聚类分析等方法,结合对技术工艺的深度解析,测算技术关联度指标,识别出关键核心技术不同发展阶段的技术主题,提炼出根技术视角下关键核心技术动态演化路径的分析模型,并以芯片光刻技术为例开展了实证分析。研究结论如下:
第一,芯片光刻技术体系中的根技术主要包括投影式曝光技术、直写式光刻技术、光刻胶材料以及光掩膜制造技术,这些根技术共同支撑了芯片光刻技术的动态演化,使其分别呈现出融合型、收缩型、增长型和分裂型四种演化路径,并主要表现为根技术主题的融合、收缩、增长以及分裂(如表3所示)。
第二,芯片光刻技术的演化路径也分别展现出根技术所具有的不同突出特性。其中,“融合型”路径显示出多种技术整合形成的高度协同的技术系统,以满足不断提升的技术需求,展现了根技术具有的基础性和集成性,并验证了根技术在关键技术领域的支撑作用;“收缩型”路径显示出逐渐聚焦于特定的核心应用领域的技术专注化过程,展现了根技术的高壁垒性特征,并反映出根技术在保障关键工艺和产品独特性的作用;“增长型”路径则体现了根技术伴随技术需求变化而不断演进的特性;“分裂型”路径则反映出根技术在发展过程中的分化与多样性,不仅拓展了根技术的应用领域,也符合其适应复杂多样应用场景的显著特征。
本研究主要贡献在于以下几方面:
(1)通过引入根技术视角开展关键核心技术动态演化路径的分析,进一步厘清了根技术与关键核心技术间的联系与区别,深化了对根技术独特内涵的理解与认识,为完善根技术的概念体系提供了一定的参考与借鉴。已有少量研究虽然从理论层面对根技术的概念与内涵进行了一定的有益探索[5,15],但对于根技术的理解仍较为局限,致使其理论定位略显模糊。本文从内涵、特征、相互关联等维度对根技术与关键核心技术开展了比较分析,并以芯片光刻技术为例开展了实证分析,研究结论揭示了两类技术间的协同关系,深化了对根技术具有的基础支撑作用与突出应用价值的认识。
(2)通过构建关键核心技术动态演化路径的分析模型,揭示了关键核心技术演化中技术主题的增长、收缩、融合、分裂特征,为深入理解技术主题的动态演化提供了新洞见。已有研究对技术主题的动态演化认识较为局限,仍无法深入刻画技术演化中技术主题的新生、融合、分裂以及消亡特征[8]。本研究一定程度上突破了这一局限,还从增长、收缩两个维度拓展了技术主题的动态演化特征[29],并强化了对关键核心技术系统的认识[11]。
(3)本文综合考虑了技术主题动态演化中的显性与隐性关系,通过应用前沿技术模型,构建出技术关联度指标,提升了技术演化路径分析结果的科学性和可靠性,同时兼具理论上的稳健性与实践上的可操作性[30]。现有研究大多围绕专利数据的某一方面特征开展分析,不仅难以刻画具有高度复杂性的关键核心技术系统,还可能导致分析结果出现偏差[9]。本文在分析过程中综合考虑了文本相似度、IPC相似度和专利引证等因素,较为全面地度量了技术主题演化中的显性、隐性关系,整合了现有技术路径识别方法具有的不同优势,为科学探寻技术演化路径与规律提供了方法论启示。
第一,企业在构建技术生态时,应关注对技术链条和产业链具有深远影响的根技术,确保上层应用的稳定性和可持续发展。同时,根技术的发展需长期投入和跨学科协作,为此,企业应加强基础研究投入[31],不断夯实基础知识储备与技术原理积累。
第二,由于不同子系统对复杂技术系统的重要性不同,关键核心技术呈现出非均匀性特征。因此,实现关键核心技术突破需明确技术子系统的演化路径并集中相关研发资源。例如,在芯片光刻技术体系中,应持续加大对投影式曝光、光刻胶材料、光掩膜制造等子系统的研发投入,增强其在战略布局中的影响力,系统推进整个技术体系的突破进程。
第三,本研究揭示的“根—干—叶”技术簇特征,印证了关键核心技术的高度复杂性和集成性,应加强产学研一体化,以学科会聚促技术创新,加快构建高水平创新联合体,加快适应高水平创新平台积聚成“势”的复杂特征[32],促进不同技术主题间的融合创新、高维迭代,不断提升多学科交叉融合和多技术领域的集成创新水平。
本文研究数据主要来源于芯片光刻技术的专利,研究模型对于其他关键核心技术的适用性有待进一步验证。此外,考虑研究主题匹配与研究篇幅的限制,本文主要引入了YAKE!算法与向量空间模型开展分析,后续研究可以尝试引入RoBERTa结合条件随机场(CRF)等新兴模型深入开展技术演化路径的分析。
  • 国家社会科学基金重大项目(23ZDA062)
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2026年第44卷第1期
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  • 接收时间:2024-11-22
  • 首发时间:2026-10-13
  • 出版时间:2026-01-15
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  • 收稿日期:2024-11-22
  • 修回日期:2025-04-09
基金
国家社会科学基金重大项目(23ZDA062)
作者信息
    1 中国工程院战略咨询中心, 北京 100088
    2 清华大学经济管理学院, 北京 100084
    3 清华大学技术创新研究中心, 北京 100084
    4 国家新能源汽车技术创新中心, 北京 100176
    5 南京邮电大学管理学院, 江苏南京 210003

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张闳肆(1994-),男,助理研究员,博士后, E-mail:。
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