硅酸盐学报

面向金刚石材料高质量激光加工方法和研究进展

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张晓宇 ¹^,² , 王子昂 ¹^,² , 胡秀飞 ¹^,² , 葛磊 ¹^,² , 王英楠 ¹^,² , 韩赛斌 ¹^,² , 彭燕 ¹^,² , 徐明升 ¹^,² , 徐现刚 ¹^,²

硅酸盐学报 | 综合评述 2025,53(8): 2388-2409

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硅酸盐学报 |综合评述 2025 , 53 (8) : 2388 -2409

面向金刚石材料高质量激光加工方法和研究进展

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张晓宇¹^,², 王子昂¹^,², 胡秀飞¹^,², 葛磊¹^,², 王英楠¹^,², 韩赛斌¹^,², 彭燕¹^,², 徐明升¹^,², 徐现刚¹^,²

作者信息

^1．山东大学新一代半导体材料研究院，济南 250100

^2．山东大学晶体材料国家重点实验室，济南 250100

通讯作者:

葛磊（1994—），男，博士；

胡秀飞（1997—），女，博士。

作者简介:

张晓宇（2000—），男，硕士研究生。

Methods and Research Progress for High-Quality Laser Processing of Diamond Materials

Xiaoyu ZHANG¹^,², Ziang WANG¹^,², Xiufei HU¹^,², Lei GE¹^,², Yingnan WANG¹^,², Saibin HAN¹^,², Yan PENG¹^,², Mingsheng XU¹^,², Xiangang XU¹^,²

Affiliations

^1.Institute of Novel Semiconductors, Shandong University, Jinan 250100, China

^2.State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China

Corresponding Author:

GE Lei (1994-), male, Ph.D. E-mail: leige@sdu.edu.cn;

HU Xiufei (1997-), female, Ph.D. huxf@sdu.edu.cn

ZHANG Xiaoyu (2000-), male, Master Candidate. E-mail: 202334111@mail.sdu.edu.cn

出版时间: 2025-08-20 doi: 10.14062/j.issn.0454-5648.20250078

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摘要

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随着金刚石生长工艺的提升，金刚石加工面临更高要求，传统机械加工难以满足部分高精度需求。激光加工以其高精度、高效率、广泛适用性和可控性，已成为金刚石加工的主流技术。当前，激光在金刚石加工中的主要应用包括激光抛光、微通道、微孔加工、激光切割和激光剥离。本文系统阐述了激光与金刚石的加工机理，分析了不同类型激光的作用特点与优势，总结了近年来激光技术的发展现状，探讨了当前技术瓶颈与挑战，并展望了其未来发展方向。

关键词

金刚石 / 激光加工 / 激光抛光 / 激光切割 / 激光剥离

Abstract

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As an ultra-wide bandgap semiconductor, diamond stands out with its exceptional properties: Mohs hardness up to 10, thermal conductivity exceeding 2000 W/(m·K), a 5.47 eV bandgap, and chemical inertness. These attributes make diamond indispensable in high-power electronics, optoelectronics, quantum computing, and aerospace engineering. With the rapid growth of diamond synthesis technology, traditional mechanical machining faces insurmountable limitations in achieving sub-micron precision and fabricating complex micro-nano structures. Laser processing, leveraging non-contact ablation, localized energy deposition, and precise parameter control, has emerged as a transformative solution for diamond machining.

The mechanism of laser interaction with diamond involves two primary steps. Initially, diamond is transformed into the graphite phase through laser induction. After that, the graphitized layer is removed via vaporization and chemical etching to complete the material processing. Surface graphitization occurs as a result of photon energy exciting the transition of sp³ bonds between carbon atoms to sp² bonds. This process is influenced and directed to a certain extent by laser parameters and the thermal gradients in the laser - irradiated area. Regarding the mechanism of laser - induced graphite removal, lasers with different pulse widths, ranging from continuous lasers to extremely short femtosecond pulses, behave differently. Laser pulses having pulse width exceeding one picosecond can heat both the lattice and electrons simultaneously. In contrast, laser pulses with a width less than 1 ps mainly excite electrons through nonlinear ionization. Nanosecond or longer - pulse lasers typically cause lattice heating, which can induce solid-solid phase transitions, amorphization, melting, or evaporation. On the other hand, femtosecond lasers remove material through expanding plasma, which helps reduce damage to the remaining surface. Based on these differences, each type of laser has its own set of advantages and limitations in specific applications.

Regarding surface treatment and polishing, while laser processing outperforms mechanical methods in efficiency and material loss, its final surface roughness traditionally lagged behind mechanical polishing. Recent advancements in multi-laser source polishing, laser-assisted polishing, and pulse burst mode have demonstrated transformative potential. High-power lasers with pulse burst mode (energy density <5 J/cm²) reduced surface roughness by 50% while maintaining minimal HAZ (<3 μm). Furthermore, a hybrid process combining laser trimming and plasma-assisted polishing (PAP) achieved atomic-scale flatness (R_a <10 nm). This method uses laser pretreatment to remove macroscopic defects followed by plasma etching for nanoscale smoothing.

In surface treatment and polishing, while laser processing outperforms mechanical methods in efficiency and material loss, its final surface roughness traditionally lags behind conventional mechanical polishing. Recent advancements in multi-laser source polishing, laser-assisted polishing, and pulse burst mode have demonstrated transformative potential. Sequential polishing with hybrid laser sources (e.g., nanosecond + femtosecond lasers) combines ablation effects and defocused beam strategies to reduce peak-valley height differences while maintaining laser energy near the ablation threshold (<5 J/cm²). This approach minimizes thermal damage, ensures optical surface quality, and enables precision material removal. High-power lasers with pulse burst mode achieve 50% roughness reduction (e.g., from 0.41 μm to 0.2 μm S_a) through energy density optimization (<5 J/cm²), resulting in minimal heat-affected zones (<3 μm). Additionally, a hybrid process integrating laser trimming and plasma-assisted polishing (PAP) achieves atomic-scale flatness (R_a <10 nm). This method uses laser pretreatment to eliminate macroscopic defects followed by plasma etching for nanoscale smoothing.

Summary and prospects

Laser processing has demonstrated transformative potential in diamond machining. However, current technologies face several challenges. Laser polishing of diamond requires further roughness reduction, with sequential multi-laser polishing, pulse burst mode processing, and laser-assisted polishing representing viable next steps. Mitigating thermal damage from long-pulse lasers and improving efficiency of short-pulse lasers are critical for widespread adoption. Future research should integrate short- and long-pulse laser advantages through process design or source selection to achieve high-precision, high-quality, and low-defect machining. In recent years, innovative technologies such as Bessel beam shaping, femtosecond laser direct writing, and laser microjet have further broken through the limitations of traditional processes, providing brand new solutions for the manufacturing of quantum devices, optical components, and high-precision microstructures. In conclusion, while challenges persist, continuous advancements in laser technology promise to address these bottlenecks, enabling scalable diamond machining for next-generation applications.

Key words

diamond / laser processing / laser polishing / laser cutting / laser peeling

引用本文

张晓宇, 王子昂, 胡秀飞, 葛磊, 王英楠, 韩赛斌, 彭燕, 徐明升, 徐现刚. 面向金刚石材料高质量激光加工方法和研究进展. 硅酸盐学报, 2025 , 53 (8) : 2388 -2409 . DOI: 10.14062/j.issn.0454-5648.20250078

Xiaoyu ZHANG, Ziang WANG, Xiufei HU, Lei GE, Yingnan WANG, Saibin HAN, Yan PENG, Mingsheng XU, Xiangang XU. Methods and Research Progress for High-Quality Laser Processing of Diamond Materials[J]. Journal of the Chinese Ceramic Society, 2025 , 53 (8) : 2388 -2409 . DOI: 10.14062/j.issn.0454-5648.20250078

基金

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山东省自然基金(ZR2023ZD04; ZR2022QF129)
国家自然科学基金(U23A20569; 62305189)
山东省重点研发(2022ZLGX02)
山东省高等学校青创科技支持计划(2022KJ032)

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2025年第53卷第8期

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文章信息

doi: 10.14062/j.issn.0454-5648.20250078

接收时间：2025-02-08
首发时间：2026-10-21
出版时间：2025-08-20

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出版历史

收稿日期：2025-02-08
修回日期：2025-03-07

基金

山东省自然基金(ZR2023ZD04; ZR2022QF129)

国家自然科学基金(U23A20569; 62305189)

山东省重点研发(2022ZLGX02)

山东省高等学校青创科技支持计划(2022KJ032)

作者信息

^1．山东大学新一代半导体材料研究院，济南 250100

^2．山东大学晶体材料国家重点实验室，济南 250100

通讯作者:

葛磊（1994—），男，博士；

胡秀飞（1997—），女，博士。

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https://castjournals.cast.org.cn/joweb/gsyxb/CN/10.14062/j.issn.0454-5648.20250078

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2种不同金属材料的力学参数

科 Family	属数 Number of genus	种数 Number of species	占总种数比例 Percentage of total species (%)	属 Genus	种数 Number of species	占总种数比例 Percentage of total species (%)
鹅膏菌科Amanitaceae	2	11	5.26	鹅膏菌属 Amanita	10	4.78
小菇科 Mycenaceae	2	12	5.74	丝盖伞属 Inocybe	5	2.39
多孔菌科 Polyporaceae	8	14	6.70	蜡蘑属 Laccaria	5	2.39
红菇科 Russulaceae	3	23	11.00	小皮伞属 Marasmius	6	2.87
				小菇属 Mycena	11	5.26
				光柄菇属 Pluteus	5	2.39
				红菇属 Russula	17	8.13
				栓菌属 Trametes	5	2.39

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