Article(id=1319222669699039719, tenantId=1146029695717560320, journalId=1263187385517883426, issueId=1319222618356559896, articleNumber=null, orderNo=null, doi=10.14062/j.issn.0454-5648.20220687, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1661184000000, receivedDateStr=2022-08-23, revisedDate=1664380800000, revisedDateStr=2022-09-29, acceptedDate=null, acceptedDateStr=null, onlineDate=1792456794427, onlineDateStr=2026-10-20, pubDate=1681920000000, pubDateStr=2023-04-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1792456794427, onlineIssueDateStr=2026-10-20, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1792456794427, creator=13701087609, updateTime=1792456794427, updator=13701087609, issue=Issue{id=1319222618356559896, tenantId=1146029695717560320, journalId=1263187385517883426, year='2023', volume='51', issue='4', pageStart='831', pageEnd='1090', issueExtLink='null', onlineDate='null', pubDate='1681920000000', pubDateStr='2023-04-20', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=0, createTime=1792456782187, creator='13701087609', updateTime=1792456947953, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext={EN=IssueExt(id=1319223313692472320, tenantId=1146029695717560320, journalId=1263187385517883426, issueId=1319222618356559896, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1319223313692472321, tenantId=1146029695717560320, journalId=1263187385517883426, issueId=1319222618356559896, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null, downloadFileDto=null}, startPage=934, endPage=948, ext={EN=ArticleExt(id=1319222669912949224, articleId=1319222669699039719, tenantId=1146029695717560320, journalId=1263187385517883426, language=EN, title=Recent Progress on Low-Permittivity LTCC for Microwave/Millimeter Wave Applications, columnId=1321891294297829430, journalTitle=Journal of the Chinese Ceramic Society, columnName=Special Issue on 5G/6G Materials—Review, runingTitle=null, highlight=null, articleAbstract=

With the development of a high-speed wireless technology, low-temperature co-fired ceramics (LTCC) technology becomes popular. The high-speed, low-delay and high-reliable wireless transmission could be achieved by using LTCC substrates with a low-permittivity (K), a low-loss and a stable-temperature of resonant frequency, as one of functional materials. This review introduced the current situation of commercial substrate materials and alternative LTCCs reported, i.e., ceramic/glass, oxide-assisted sintering, fluoride-assisted sintering and intrinsic low-sintering ceramic systems. The composition, structural characteristics, dielectric properties, coefficient of thermal expansion of low-K LTCCs, as well as the advantages and disadvantages, were also discussed. Some studies of commercial substrates were further described, and their performances in millimeter-wave application were represented. In addition, the development trend of low-K LTCCs was also proposed.

, authors=Wei WANG¹, Ling ZHANG^{1, 2}, Yaguang WU³, Feng QIAO^{1, 2}, Zhongqi SHI⁴, Wenfeng LIU⁵, Di ZHOU¹, authorsList=Wei WANG, Ling ZHANG, Yaguang WU, Feng QIAO, Zhongqi SHI, Wenfeng LIU, Di ZHOU, authorCompany=null, correspAuthors=Di ZHOU, authorNote=, correspAuthorsNote=, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1319222670303019497, articleId=1319222669699039719, tenantId=1146029695717560320, journalId=1263187385517883426, language=CN, title=微波毫米波用低介电常数低温共烧陶瓷研究进展, columnId=1321891294482378807, journalTitle=硅酸盐学报, columnName=5G/6G材料专题—综合评述, runingTitle=null, highlight=null, articleAbstract=

在新一代高速无线通信技术推动下，低温共烧陶瓷技术（LTCC）正处于重大变革时期。采用低介电常数（K）、低损耗、谐振频率温度稳定型LTCC作为高频基板材料，可以满足无线技术高速率、低延时、高可靠的需求，是当前热点研究之一。因此商用基板材料的现状和一些候选材料的研究工作被主要评述，重点对玻璃/陶瓷体系、氧化物助烧体系、氟化物助烧体系、本征低温烧结体系等低K值LTCC材料的组成、结构特征、介电性能、热膨胀系数等具体指标及相应优缺点进行了讨论。同时介绍了一些热门体系的改性工作及其毫米波适用性，最后对未来低K值LTCC材料的发展进行展望。

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WANG Wei (1994-), male, Doctoral candidate. E-mail: wangwei666@stu.xjtu.edu.cn

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WANG Wei (1994-), male, Doctoral candidate. E-mail: wangwei666@stu.xjtu.edu.cn

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王威（1994—），男，博士。

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王威（1994—），男，博士。

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