首页 期刊 论文 学科刊群 资讯 加盟 关于
EN
image
Article(id=1251830034189730474, tenantId=1146029695717560320, journalId=1251234171981443176, issueId=1251830032927244964, articleNumber=null, orderNo=null, doi=10.19659/j.issn.1008-5300.20250911001, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1757520000000, receivedDateStr=2025-09-11, revisedDate=null, revisedDateStr=null, acceptedDate=null, acceptedDateStr=null, onlineDate=1776389138028, onlineDateStr=2026-04-17, pubDate=null, pubDateStr=null, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1776389138028, onlineIssueDateStr=2026-04-17, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1776389138028, creator=13701087609, updateTime=1776389138028, updator=13701087609, issue=Issue{id=1251830032927244964, tenantId=1146029695717560320, journalId=1251234171981443176, year='2025', volume='41', issue='5', pageStart='1', pageEnd='78', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=1, specialIssue=null, createTime=1776389137727, creator=13701087609, updateTime=1776389447642, updator=13701087609, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1251831332897243625, tenantId=1146029695717560320, journalId=1251234171981443176, issueId=1251830032927244964, language=EN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=), CN=IssueExt(id=1251831332897243626, tenantId=1146029695717560320, journalId=1251234171981443176, issueId=1251830032927244964, language=CN, specialIssueTitle=, coverIllustrator=null, specialIssueEditor=, specialIssueAbout=)}, issueFiles=null}, startPage=27, endPage=33, ext={EN=ArticleExt(id=1251830034529469102, articleId=1251830034189730474, tenantId=1146029695717560320, journalId=1251234171981443176, language=EN, title=A Review on Additive Manufacturing of Low Temperature Co-fired Ceramics, columnId=1251830034466554540, journalTitle=Electro-Mechanical Engineering, columnName=Expert Forum, runingTitle=null, highlight=null, articleAbstract=

Low temperature co-fired ceramics (LTCC) possess outstanding dielectric properties， thermal stability and multi-functional integration capabilities， and have been widely applied in 5G/6G communications， millimeter-wave radars， satellite payloads and system-level packaging. However， traditional processes have two significant limitations: first， constrained by the forming methods， it's difficult to achieve high-precision fabrication of curved multi-layer substrates;second， the complex process flows and strong dependence on batch scale make it difficult to meet the rapid verification requirment for single-piece and small-batch substrates. Additive manufacturing， based on the unique technical path of layer-by-layer stacking and on-demand deposition， provides an innovative solution to break through the above bottlenecks. In this paper， the research trends in material preparation and forming processes involved in LTCC additive manufacturing are systematically reviewed， the existing key issues are analyzed in depth， and the future development directions are prospected.

, correspAuthors=null, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, authorCompany=null, fund=null, authors=null, authorsList=Jin HUANG, Yunna PU, Chaoyu LIANG), CN=ArticleExt(id=1251830036131693295, articleId=1251830034189730474, tenantId=1146029695717560320, journalId=1251234171981443176, language=CN, title=低温共烧陶瓷的增材制造技术综述, columnId=1251830034592383664, journalTitle=电子机械工程, columnName=专家论坛, runingTitle=null, highlight=null, articleAbstract=

低温共烧陶瓷（Low Temperature Co-fired Ceramics， LTCC）具有优异的介电性能、热稳定性和多功能集成能力，在5G/6G通信、毫米波雷达、卫星载荷、系统级封装等领域得到广泛应用。然而，传统工艺存在两方面显著局限：一是受成型方式制约，难以实现曲面多层基板的高精度制造；二是工艺流程复杂且对批次规模依赖性强，难以满足单件、小批基板的快速验证需求。增材制造基于逐层堆叠、按需沉积的独特技术路径，为突破上述瓶颈提供了创新性解决方案。文中系统综述了LTCC 增材制造所涉及的材料制备、成型工艺方面的研究动态，分析了当前存在的关键问题，并展望了未来发展方向。

, correspAuthors=null, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=+DAuLlwgMvwzr5gaFtm5yg==, magXml=vbNNocEKHAXI9S3rCyKktA==, pdfUrl=null, pdf=0BxgAoyNaiBc1BQ3b84yoA==, pdfFileSize=1810212, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=xhTAs8k52AhN0JD/q3nVaQ==, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=2zyWorHnwjwnvXA6y6I77g==, mapNumber=null, authorCompany=null, fund=null, authors=

黄进 男，1975 年生，博士，教授，主要从事机电系统建模与控制、电子装备智能制造研究。

蒲芸娜 女，1998 年生，博士研究生，主要从事LTCC增材制造研究。

, authorsList=黄进, 蒲芸娜, 梁超余)}, authors=[Author(id=1251830036635009803, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, orderNo=0, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=null, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1251830036723090195, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, authorId=1251830036635009803, language=EN, stringName=Jin HUANG, firstName=Jin, middleName=null, lastName=HUANG, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1251830036840530715, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, authorId=1251830036635009803, language=CN, stringName=黄进, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=西安电子科技大学高性能电子装备机电集成制造全国重点实验室，陕西 西安 710071, bio={"content":"

黄进 男，1975 年生，博士，教授，主要从事机电系统建模与控制、电子装备智能制造研究。

"}, bioImg=null, bioContent=

黄进 男，1975 年生，博士，教授，主要从事机电系统建模与控制、电子装备智能制造研究。

, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1251830036492403454, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, xref=null, ext=[AuthorCompanyExt(id=1251830036496597759, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, companyId=1251830036492403454, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China), AuthorCompanyExt(id=1251830036504986369, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, companyId=1251830036492403454, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=西安电子科技大学高性能电子装备机电集成制造全国重点实验室，陕西 西安 710071)])]), Author(id=1251830036932805406, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, orderNo=1, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=null, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1251830037008302884, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, authorId=1251830036932805406, language=EN, stringName=Yunna PU, firstName=Yunna, middleName=null, lastName=PU, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1251830037087994662, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, authorId=1251830036932805406, language=CN, stringName=蒲芸娜, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=西安电子科技大学高性能电子装备机电集成制造全国重点实验室，陕西 西安 710071, bio={"content":"

蒲芸娜 女，1998 年生，博士研究生，主要从事LTCC增材制造研究。

"}, bioImg=null, bioContent=

蒲芸娜 女，1998 年生，博士研究生，主要从事LTCC增材制造研究。

, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1251830036492403454, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, xref=null, ext=[AuthorCompanyExt(id=1251830036496597759, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, companyId=1251830036492403454, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China), AuthorCompanyExt(id=1251830036504986369, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, companyId=1251830036492403454, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=西安电子科技大学高性能电子装备机电集成制造全国重点实验室，陕西 西安 710071)])]), Author(id=1251830037171880749, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, orderNo=2, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=null, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1251830037243183921, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, authorId=1251830037171880749, language=EN, stringName=Chaoyu LIANG, firstName=Chaoyu, middleName=null, lastName=LIANG, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1251830037335458613, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, authorId=1251830037171880749, language=CN, stringName=梁超余, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=西安电子科技大学高性能电子装备机电集成制造全国重点实验室，陕西 西安 710071, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1251830036492403454, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, xref=null, ext=[AuthorCompanyExt(id=1251830036496597759, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, companyId=1251830036492403454, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China), AuthorCompanyExt(id=1251830036504986369, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, companyId=1251830036492403454, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=西安电子科技大学高性能电子装备机电集成制造全国重点实验室，陕西 西安 710071)])])], keywords=[Keyword(id=1251830037457093437, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, orderNo=1, keyword=low temperature co-fired ceramics), Keyword(id=1251830037553562434, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, orderNo=2, keyword=additive manufacturing), Keyword(id=1251830037629059911, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, orderNo=3, keyword=material preparation), Keyword(id=1251830037696168777, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, orderNo=4, keyword=forming process), Keyword(id=1251830037767471949, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, orderNo=1, keyword=低温共烧陶瓷), Keyword(id=1251830037851358034, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, orderNo=2, keyword=增材制造), Keyword(id=1251830037926855509, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, orderNo=3, keyword=材料制备), Keyword(id=1251830038014935896, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, orderNo=4, keyword=成型工艺)], refs=[Reference(id=1251830039927538617, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2016, volume=20, issue=3, pageStart=151, pageEnd=170, url=null, language=null, rfNumber=[1], rfOrder=0, authorNames=SEBASTIAN M T, WANG H, JANTUNEN H, journalName=Current Opinion in Solid State & Materials Science, refType=null, unstructuredReference=SEBASTIAN M T, WANG H, JANTUNEN H. Low temperature co-fired ceramics with ultra-low sintering temperature: a review[J]. Current Opinion in Solid State & Materials Science, 2016, 20(3): 151-170., articleTitle=Low temperature co-fired ceramics with ultra-low sintering temperature: a review, refAbstract=null), Reference(id=1251830040024007614, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2022, volume=42, issue=13, pageStart=5684, pageEnd=5690, url=null, language=null, rfNumber=[2], rfOrder=1, authorNames=LI S, LI C, MAO M M, journalName=Journal of the European Ceramic Society, refType=null, unstructuredReference=LI S, LI C, MAO M M, et al. High Q×f values of ZnNi co-modified LiMg0.9Zn0.1-xNixPO4 microwave dielectric ceramics for 5G/6G LTCC modules[J]. Journal of the European Ceramic Society, 2022, 42(13): 5684-5690., articleTitle=High Q×f values of ZnNi co-modified LiMg0.9Zn0.1-xNixPO4 microwave dielectric ceramics for 5G/6G LTCC modules, refAbstract=null), Reference(id=1251830040124670914, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2021, volume=68, issue=3, pageStart=878, pageEnd=882, url=null, language=null, rfNumber=[3], rfOrder=2, authorNames=SHI Y R, FENG W J, WANG H, journalName=IEEE Transactions on Circuits and Systems Ⅱ: Express Briefs, refType=null, unstructuredReference=SHI Y R, FENG W J, WANG H, et al. Compact planar W-band front-end module based on EBG packaging and LTCC circuits[J]. IEEE Transactions on Circuits and Systems Ⅱ: Express Briefs, 2021, 68(3):878-882., articleTitle=Compact planar W-band front-end module based on EBG packaging and LTCC circuits, refAbstract=null), Reference(id=1251830040204362694, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2017, volume=19, issue=1, pageStart=36, pageEnd=47, url=null, language=null, rfNumber=[4], rfOrder=3, authorNames=WOIFF I, GUNNER C, KASSNER J, journalName=IEEE Microwave Magazine, refType=null, unstructuredReference=WOIFF I, GUNNER C, KASSNER J, et al. New heights for satellites: LTCC multilayer technology for future satellites[J]. IEEE Microwave Magazine, 2017, 19(1): 36-47., articleTitle=New heights for satellites: LTCC multilayer technology for future satellites, refAbstract=null), Reference(id=1251830040292443081, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2013, volume=null, issue=null, pageStart=null, pageEnd=null, url=null, language=null, rfNumber=[5], rfOrder=4, authorNames=RIDA K H, journalName=Packaging of microwave integrated circuits in LTCC technology, refType=null, unstructuredReference=RIDA K H. Packaging of microwave integrated circuits in LTCC technology[D]. Brest, France:University of Western Brittany, 2013., articleTitle=null, refAbstract=null), Reference(id=1251830040367940559, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2022, volume=15, issue=5, pageStart=1, pageEnd=11, url=null, language=null, rfNumber=[6], rfOrder=5, authorNames=GAO Y J, FENG J J, LIU F, journalName=Materials, refType=null, unstructuredReference=GAO Y J, FENG J J, LIU F, et al. Effects of organic vehicle on the rheological and screen-printing characteristics of silver paste for LTCC thick film electrodes[J]. Materials, 2022, 15(5): 1-11., articleTitle=Effects of organic vehicle on the rheological and screen-printing characteristics of silver paste for LTCC thick film electrodes, refAbstract=null), Reference(id=1251830040435049426, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2018, volume=270, issue=null, pageStart=433, pageEnd=442, url=null, language=null, rfNumber=[7], rfOrder=6, authorNames=TAN Q L, LYU W, JI Y H, journalName=Sensors and Actuators B: Chemical, refType=null, unstructuredReference=TAN Q L, LYU W, JI Y H, et al. A LC wireless passive temperature-pressure-humidity (TPH) sensor integrated on LTCC ceramic for harsh monitoring[J]. Sensors and Actuators B: Chemical, 2018, 270: 433-442., articleTitle=A LC wireless passive temperature-pressure-humidity (TPH) sensor integrated on LTCC ceramic for harsh monitoring, refAbstract=null), Reference(id=1251830040539907029, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2020, volume=40, issue=3, pageStart=759, pageEnd=767, url=null, language=null, rfNumber=[8], rfOrder=7, authorNames=RAYNAUD J, PATELOUP V, BERNARD M, journalName=Journal of the European Ceramic Society, refType=null, unstructuredReference=RAYNAUD J, PATELOUP V, BERNARD M, et al. Hybridization of additive manufacturing processes to build ceramic/metal parts: example of LTCC[J]. Journal of the European Ceramic Society, 2020, 40(3):759-767., articleTitle=Hybridization of additive manufacturing processes to build ceramic/metal parts: example of LTCC, refAbstract=null), Reference(id=1251830040623793112, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2020, volume=40, issue=6, pageStart=2382, pageEnd=2389, url=null, language=null, rfNumber=[9], rfOrder=8, authorNames=WANG F L, ZHANG W J, CHEN X Y, journalName=Journal of the European Ceramic Society, refType=null, unstructuredReference=WANG F L, ZHANG W J, CHEN X Y, et al. Low temperature sintering and characterization of La2O3-B2O3-CaO glass-ceramic/LaBO3 composites for LTCC application[J]. Journal of the European Ceramic Society, 2020, 40(6): 2382-2389., articleTitle=Low temperature sintering and characterization of La2O3-B2O3-CaO glass-ceramic/LaBO3 composites for LTCC application, refAbstract=null), Reference(id=1251830040716067803, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2025, volume=16, issue=1, pageStart=1, pageEnd=11, url=null, language=null, rfNumber=[10], rfOrder=9, authorNames=ZHANG G M, YU Z H, SONG D S, journalName=Nature Communications, refType=null, unstructuredReference=ZHANG G M, YU Z H, SONG D S, et al. Directly printed standing ceramic circuit boards for rapid prototyping of miniaturization and high-power of electronics[J]. Nature Communications, 2025, 16(1):1-11., articleTitle=Directly printed standing ceramic circuit boards for rapid prototyping of miniaturization and high-power of electronics, refAbstract=null), Reference(id=1251830040808342495, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=37, issue=20, pageStart=28, pageEnd=43, url=null, language=null, rfNumber=[11], rfOrder=10, authorNames=陈国华, 黄冰虹, journalName=材料导报, refType=null, unstructuredReference=陈国华,黄冰虹.低温共烧低介电常数微波介质陶瓷的研究进展[J].材料导报, 2023, 37(20): 28-43., articleTitle=低温共烧低介电常数微波介质陶瓷的研究进展, refAbstract=null), Reference(id=1251830040888034274, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2022, volume=42, issue=13, pageStart=5789, pageEnd=5800, url=null, language=null, rfNumber=[12], rfOrder=11, authorNames=HAJIAN A, ARTEMENKO A, KROMKA A, journalName=Journal of the European Ceramic Society, refType=null, unstructuredReference=HAJIAN A, ARTEMENKO A, KROMKA A, et al. Impact of sintering temperature on phase composition, microstructure, and porosification behavior of LTCC substrates[J]. Journal of the European Ceramic Society, 2022, 42(13): 5789-5800., articleTitle=Impact of sintering temperature on phase composition, microstructure, and porosification behavior of LTCC substrates, refAbstract=null), Reference(id=1251830040963531750, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=51, issue=4, pageStart=934, pageEnd=948, url=null, language=null, rfNumber=[13], rfOrder=12, authorNames=王威, 张玲, 吴亚光, journalName=硅酸盐学报, refType=null, unstructuredReference=王威,张玲,吴亚光,等.微波毫米波用低介电常数低温共烧陶瓷研究进展[J].硅酸盐学报, 2023, 51(4): 934-948., articleTitle=微波毫米波用低介电常数低温共烧陶瓷研究进展, refAbstract=null), Reference(id=1251830041047417835, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2024, volume=123, issue=null, pageStart=20, pageEnd=27, url=null, language=null, rfNumber=[14], rfOrder=13, authorNames=LIANG C Y, HUANG J, PU Y N, journalName=Journal of Manufacturing Processes, refType=null, unstructuredReference=LIANG C Y, HUANG J, PU Y N, et al. Nano-borosilicate glass-silica ceramic material jetting technology for additive manufacturing of multilayer LTCC substrates[J]. Journal of Manufacturing Processes, 2024, 123: 20-27., articleTitle=Nano-borosilicate glass-silica ceramic material jetting technology for additive manufacturing of multilayer LTCC substrates, refAbstract=null), Reference(id=1251830041118721002, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2025, volume=15, issue=1, pageStart=1, pageEnd=14, url=null, language=null, rfNumber=[15], rfOrder=14, authorNames=SUMMERS J M, VU A, MALDONADO J, journalName=Scientific Reports, refType=null, unstructuredReference=SUMMERS J M, VU A, MALDONADO J, et al. 3D printing and pressureless sintering of Li2TiO3 for next generation dielectric resonator antennas[J]. Scientific Reports, 2025, 15(1): 1-14., articleTitle=3D printing and pressureless sintering of Li2TiO3 for next generation dielectric resonator antennas, refAbstract=null), Reference(id=1251830041206801389, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2025, volume=97, issue=null, pageStart=104627, pageEnd=null, url=null, language=null, rfNumber=[16], rfOrder=15, authorNames=SUN H W, ZOU B, QUAN T, journalName=Additive Manufacturing, refType=null, unstructuredReference=SUN H W, ZOU B, QUAN T, et al. Multi-material ceramic hybrid additive manufacturing based on vat photopolymerization and material extrusion compound process[J]. Additive Manufacturing, 2025, 97:104627., articleTitle=Multi-material ceramic hybrid additive manufacturing based on vat photopolymerization and material extrusion compound process, refAbstract=null), Reference(id=1251830041290687472, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2022, volume=48, issue=19, pageStart=27312, pageEnd=27323, url=null, language=null, rfNumber=[17], rfOrder=16, authorNames=WANG M X, ZHANG S R, YANG Z Y, journalName=Ceramics International, refType=null, unstructuredReference=WANG M X, ZHANG S R, YANG Z Y, et al. Sintering behaviors and thermal properties of Li2TiO3-based ceramics for LTCC applications[J]. Ceramics International, 2022, 48(19): 27312-27323., articleTitle=Sintering behaviors and thermal properties of Li2TiO3-based ceramics for LTCC applications, refAbstract=null), Reference(id=1251830041378767860, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2021, volume=47, issue=20, pageStart=28675, pageEnd=28684, url=null, language=null, rfNumber=[18], rfOrder=17, authorNames=WANG D, LI L X, DU M K, journalName=Ceramics International, refType=null, unstructuredReference=WANG D, LI L X, DU M K, et al. A low-sintering temperature microwave dielectric ceramic for 5G LTCC applications with ultralow loss[J]. Ceramics International, 2021, 47(20): 28675-28684., articleTitle=A low-sintering temperature microwave dielectric ceramic for 5G LTCC applications with ultralow loss, refAbstract=null), Reference(id=1251830041450071033, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2001, volume=84, issue=12, pageStart=2900, pageEnd=2904, url=null, language=null, rfNumber=[19], rfOrder=18, authorNames=VALANT M, SUVOROV D, journalName=Journal of the American Ceramic Society, refType=null, unstructuredReference=VALANT M, SUVOROV D. Processing and dielectric properties of sillenite compounds Bi12MO20-δ (M= Si, Ge, Ti, Pb, Mn, B1/2P1/2)[J]. Journal of the American Ceramic Society, 2001, 84(12): 2900-2904., articleTitle=Processing and dielectric properties of sillenite compounds Bi12MO20-δ (M= Si, Ge, Ti, Pb, Mn, B1/2P1/2), refAbstract=null), Reference(id=1251830041575900157, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2017, volume=37, issue=9, pageStart=3073, pageEnd=3077, url=null, language=null, rfNumber=[20], rfOrder=19, authorNames=PANG L X, ZHOU D, LI W B, journalName=Journal of the European Ceramic Society, refType=null, unstructuredReference=PANG L X, ZHOU D, LI W B, et al. High quality microwave dielectric ceramic sintered at extreme-low temperature below 200° and co-firing with base metal[J]. Journal of the European Ceramic Society, 2017, 37(9): 3073-3077., articleTitle=High quality microwave dielectric ceramic sintered at extreme-low temperature below 200° and co-firing with base metal, refAbstract=null), Reference(id=1251830041668174848, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2024, volume=50, issue=1, pageStart=143, pageEnd=149, url=null, language=null, rfNumber=[21], rfOrder=20, authorNames=LIU W, LI Y X, LIU X Y, journalName=Ceramics International, refType=null, unstructuredReference=LIU W, LI Y X, LIU X Y, et al. A novel NaMg(1-x) Znx(PO3)3 microwave dielectric ceramic with an ultralow dielectric constant for LTCC application[J]. Ceramics International, 2024, 50(1): 143-149., articleTitle=A novel NaMg(1-x) Znx(PO3)3 microwave dielectric ceramic with an ultralow dielectric constant for LTCC application, refAbstract=null), Reference(id=1251830041760448514, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2025, volume=1010, issue=null, pageStart=177261, pageEnd=null, url=null, language=null, rfNumber=[22], rfOrder=21, authorNames=REN Y X, WANG J X, GUO Y F, journalName=Journal of Alloys and Compounds, refType=null, unstructuredReference=REN Y X, WANG J X, GUO Y F, et al. Sintering behavior, lattice vibrational characteristics and dielectric properties of B-site ion substituted BaWO4 ceramics for LTCC applications[J]. Journal of Alloys and Compounds, 2025, 1010: 177261., articleTitle=Sintering behavior, lattice vibrational characteristics and dielectric properties of B-site ion substituted BaWO4 ceramics for LTCC applications, refAbstract=null), Reference(id=1251830041848528901, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2019, volume=45, issue=6, pageStart=7203, pageEnd=7209, url=null, language=null, rfNumber=[23], rfOrder=22, authorNames=WANG F L, ZHANG W J, CHEN X Y, journalName=Ceramics International, refType=null, unstructuredReference=WANG F L, ZHANG W J, CHEN X Y, et al. Synthesis and characterization of low CTE value La2O3-B2O3-CaO-P2O5 glass/cordierite composites for LTCC application[J]. Ceramics International, 2019, 45(6): 7203-7209., articleTitle=Synthesis and characterization of low CTE value La2O3-B2O3-CaO-P2O5 glass/cordierite composites for LTCC application, refAbstract=null), Reference(id=1251830041915637765, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2017, volume=33, issue=5, pageStart=52, pageEnd=55, url=null, language=null, rfNumber=[24], rfOrder=23, authorNames=游韬, 谢廉忠, journalName=电子机械工程, refType=null, unstructuredReference=游韬,谢廉忠.国产LTCC浆料的应用研究[J].电子机械工程, 2017, 33(5): 52-55., articleTitle=国产LTCC浆料的应用研究, refAbstract=null), Reference(id=1251830041999523848, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2025, volume=46, issue=4, pageStart=23, pageEnd=25, url=null, language=null, rfNumber=[25], rfOrder=24, authorNames=于卫龙, 王亚东, 任耀华, journalName=电子工艺技术, refType=null, unstructuredReference=于卫龙,王亚东,任耀华. LTCC银浆电迁移特性的抑制方法[J].电子工艺技术, 2025, 46(4): 23-25., articleTitle=LTCC银浆电迁移特性的抑制方法, refAbstract=null), Reference(id=1251830042070827020, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2022, volume=33, issue=15, pageStart=12002, pageEnd=12015, url=null, language=null, rfNumber=[26], rfOrder=25, authorNames=WANG W W, HU Y C, LI L J, journalName=Journal of Materials Science:Materials in Electronics, refType=null, unstructuredReference=WANG W W, HU Y C, LI L J, et al. Effect of various polymer additives on the rheology and thixotropy of organic vehicles[J]. Journal of Materials Science:Materials in Electronics, 2022, 33(15): 12002-12015., articleTitle=Effect of various polymer additives on the rheology and thixotropy of organic vehicles, refAbstract=null), Reference(id=1251830042146324495, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2021, volume=32, issue=null, pageStart=14368, pageEnd=14384, url=null, language=null, rfNumber=[27], rfOrder=26, authorNames=HU Y C, DU Z F, YAO Y B, journalName=Journal of Materials Science: Materials in Electronics, refType=null, unstructuredReference=HU Y C, DU Z F, YAO Y B, et al. Effects of organic additives on the microstructural, rheological and electrical properties of silver paste for LTCC applications[J]. Journal of Materials Science: Materials in Electronics, 2021, 32: 14368-14384., articleTitle=Effects of organic additives on the microstructural, rheological and electrical properties of silver paste for LTCC applications, refAbstract=null), Reference(id=1251830042205044754, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2008, volume=206, issue=1, pageStart=56, pageEnd=61, url=null, language=null, rfNumber=[28], rfOrder=27, authorNames=LIN H W, HWU W H, GER M D, journalName=Journal of Materials Processing Technology, refType=null, unstructuredReference=LIN H W, HWU W H, GER M D. The dispersion of silver nanoparticles with physical dispersal procedures[J]. Journal of Materials Processing Technology, 2008, 206(1): 56-61., articleTitle=The dispersion of silver nanoparticles with physical dispersal procedures, refAbstract=null), Reference(id=1251830042280542228, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2020, volume=46, issue=1, pageStart=493, pageEnd=499, url=null, language=null, rfNumber=[29], rfOrder=28, authorNames=YAN T N, ZHANG W J, CHEN X Y, journalName=Ceramics International, refType=null, unstructuredReference=YAN T N, ZHANG W J, CHEN X Y, et al. Improvement of gold electrode conductivity after cofiring with CaO-B2O3-SiO2 green tapes for LTCC application[J]. Ceramics International, 2020, 46(1): 493-499., articleTitle=Improvement of gold electrode conductivity after cofiring with CaO-B2O3-SiO2 green tapes for LTCC application, refAbstract=null), Reference(id=1251830042393788441, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2022, volume=33, issue=null, pageStart=17814, pageEnd=17827, url=null, language=null, rfNumber=[30], rfOrder=29, authorNames=LIU Z F, LIANG W X, ZHANG W J, journalName=Journal of Materials Science: Materials in Electronics, refType=null, unstructuredReference=LIU Z F, LIANG W X, ZHANG W J, et al. Effects of Pb-B-Si-O glass on the microstructures and electrical properties of silver electrode for LTCC application[J]. Journal of Materials Science: Materials in Electronics, 2022, 33: 17814-17827., articleTitle=Effects of Pb-B-Si-O glass on the microstructures and electrical properties of silver electrode for LTCC application, refAbstract=null), Reference(id=1251830042486063129, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2020, volume=46, issue=8, pageStart=10729, pageEnd=10733, url=null, language=null, rfNumber=[31], rfOrder=30, authorNames=WANG Y, ZHU H K, BIAN W J, journalName=Ceramics International, refType=null, unstructuredReference=WANG Y, ZHU H K, BIAN W J, et al. Inhibition of silver diffusion in LTCC by MgTiO3 addition[J]. Ceramics International, 2020, 46(8): 10729-10733., articleTitle=Inhibition of silver diffusion in LTCC by MgTiO3 addition, refAbstract=null), Reference(id=1251830042582532122, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2021, volume=215, issue=null, pageStart=109013, pageEnd=null, url=null, language=null, rfNumber=[32], rfOrder=31, authorNames=YANG G Y, SUN Y Y, LI M M, journalName=Composites Science and Technology, refType=null, unstructuredReference=YANG G Y, SUN Y Y, LI M M, et al. Direct-ink-writing (DIW) 3D printing functional composite materials based on supra-molecular interaction[J]. Composites Science and Technology, 2021, 215:109013., articleTitle=Direct-ink-writing (DIW) 3D printing functional composite materials based on supra-molecular interaction, refAbstract=null), Reference(id=1251830042674806814, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2018, volume=44, issue=5, pageStart=5673, pageEnd=5682, url=null, language=null, rfNumber=[33], rfOrder=32, authorNames=REVELO C F, COLORADO H A, journalName=Ceramics International, refType=null, unstructuredReference=REVELO C F, COLORADO H A. 3D printing of kaolinite clay ceramics using the direct ink writing (DIW) technique[J]. Ceramics International, 2018, 44(5): 5673-5682., articleTitle=3D printing of kaolinite clay ceramics using the direct ink writing (DIW) technique, refAbstract=null), Reference(id=1251830042775470114, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2017, volume=7, issue=1, pageStart=6017, pageEnd=6029, url=null, language=null, rfNumber=[34], rfOrder=33, authorNames=MBARKI A, BOCQUET L, STEVENSON A, journalName=Scientific Reports, refType=null, unstructuredReference=MBARKI A, BOCQUET L, STEVENSON A. Linking rheology and printability for dense and strong ceramics by direct ink writing[J]. Scientific Reports, 2017, 7(1): 6017-6029., articleTitle=Linking rheology and printability for dense and strong ceramics by direct ink writing, refAbstract=null), Reference(id=1251830042876133412, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=14, issue=1, pageStart=2381, pageEnd=2397, url=null, language=null, rfNumber=[35], rfOrder=34, authorNames=ZHAO Y Q, ZHU J Z, HE W Y, journalName=Nature Communications, refType=null, unstructuredReference=ZHAO Y Q, ZHU J Z, HE W Y, et al. 3D printing of unsupported multi-scale and large-span ceramic via near-infrared assisted direct ink writing[J]. Nature Communications, 2023, 14(1): 2381-2397., articleTitle=3D printing of unsupported multi-scale and large-span ceramic via near-infrared assisted direct ink writing, refAbstract=null), Reference(id=1251830042955825188, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=235, issue=null, pageStart=112398, pageEnd=null, url=null, language=null, rfNumber=[36], rfOrder=35, authorNames=ZHAO Y Q, SHI G H, MIAO J T, journalName=Materials & Design, refType=null, unstructuredReference=ZHAO Y Q, SHI G H, MIAO J T, et al. Near-infrared photothermal dual crosslinking strategy for precise and efficient direct ink writing of high solids ceramic slurries[J]. Materials & Design, 2023, 235:112398., articleTitle=Near-infrared photothermal dual crosslinking strategy for precise and efficient direct ink writing of high solids ceramic slurries, refAbstract=null), Reference(id=1251830043069071399, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=78, issue=null, pageStart=103856, pageEnd=null, url=null, language=null, rfNumber=[37], rfOrder=36, authorNames=LIANG C Y, HUANG J, WANG J J, journalName=Additive Manufacturing, refType=null, unstructuredReference=LIANG C Y, HUANG J, WANG J J, et al. Additive manufacturing of low-temperature co-fired ceramic substrates and surface conductors based on material jetting[J]. Additive Manufacturing, 2023, 78: 103856., articleTitle=Additive manufacturing of low-temperature co-fired ceramic substrates and surface conductors based on material jetting, refAbstract=null), Reference(id=1251830043152957483, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2010, volume=40, issue=1, pageStart=395, pageEnd=414, url=null, language=null, rfNumber=[38], rfOrder=37, authorNames=DERBY B, journalName=Annual Review of Materials Research, refType=null, unstructuredReference=DERBY B. Inkjet printing of functional and structural materials: fluid property requirements, feature stability, and resolution[J]. Annual Review of Materials Research, 2010, 40(1): 395-414., articleTitle=Inkjet printing of functional and structural materials: fluid property requirements, feature stability, and resolution, refAbstract=null), Reference(id=1251830043220066349, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=8, issue=5, pageStart=1083, pageEnd=1102, url=null, language=null, rfNumber=[39], rfOrder=38, authorNames=MAMATHA S, BISWAS P, JOHNSON R, journalName=Progress in Additive Manufacturing, refType=null, unstructuredReference=MAMATHA S, BISWAS P, JOHNSON R. Digital light processing of ceramics: an overview on process, materials and challenges[J]. Progress in Additive Manufacturing, 2023, 8(5): 1083-1102., articleTitle=Digital light processing of ceramics: an overview on process, materials and challenges, refAbstract=null), Reference(id=1251830043278786608, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2021, volume=47, issue=11, pageStart=15931, pageEnd=15938, url=null, language=null, rfNumber=[40], rfOrder=39, authorNames=FERNANDES J G, BARCELONA P, BLANES M, journalName=Ceramics International, refType=null, unstructuredReference=FERNANDES J G, BARCELONA P, BLANES M, et al. Study of mixing process of low temperature cofired ceramics photocurable suspension for digital light processing stereolithography[J]. Ceramics International, 2021, 47(11): 15931-15938., articleTitle=Study of mixing process of low temperature cofired ceramics photocurable suspension for digital light processing stereolithography, refAbstract=null), Reference(id=1251830043366866995, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2016, volume=42, issue=9, pageStart=10711, pageEnd=10718, url=null, language=null, rfNumber=[41], rfOrder=40, authorNames=LIU K, SUN H J, SHI Y S, journalName=Ceramics International, refType=null, unstructuredReference=LIU K, SUN H J, SHI Y S, et al. Research on selective laser sintering of Kaolin-epoxy resin ceramic powders combined with cold isostatic pressing and sintering[J]. Ceramics International, 2016, 42(9):10711-10718., articleTitle=Research on selective laser sintering of Kaolin-epoxy resin ceramic powders combined with cold isostatic pressing and sintering, refAbstract=null), Reference(id=1251830043454947381, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2017, volume=23, issue=3, pageStart=611, pageEnd=623, url=null, language=null, rfNumber=[42], rfOrder=41, authorNames=SING S L, YEONG W Y, WIRIA F E, journalName=Rapid Prototy Journal, refType=null, unstructuredReference=SING S L, YEONG W Y, WIRIA F E, et al. Direct selective laser sintering and melting of ceramics: a review[J]. Rapid Prototy Journal, 2017, 23(3): 611-623., articleTitle=Direct selective laser sintering and melting of ceramics: a review, refAbstract=null), Reference(id=1251830043526250551, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2019, volume=29, issue=null, pageStart=100802, pageEnd=null, url=null, language=null, rfNumber=[43], rfOrder=42, authorNames=HUANG S J, YE C S, ZHAO H P, journalName=Additive Manufacturing, refType=null, unstructuredReference=HUANG S J, YE C S, ZHAO H P, et al. Additive manufacturing of thin alumina ceramic cores using binder-jetting[J]. Additive Manufacturing, 2019, 29:100802., articleTitle=Additive manufacturing of thin alumina ceramic cores using binder-jetting, refAbstract=null), Reference(id=1251830043593359417, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=70, issue=null, pageStart=103564, pageEnd=null, url=null, language=null, rfNumber=[44], rfOrder=43, authorNames=KWON M, CHOI J H, KIM J H, journalName=Additive Manufacturing, refType=null, unstructuredReference=KWON M, CHOI J H, KIM J H, et al. Optimization of inorganic powder properties for manufacturing ceramic filter using binder jetting process[J]. Additive Manufacturing, 2023, 70: 103564., articleTitle=Optimization of inorganic powder properties for manufacturing ceramic filter using binder jetting process, refAbstract=null), Reference(id=1251830043685634107, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=107, issue=null, pageStart=88, pageEnd=97, url=null, language=null, rfNumber=[45], rfOrder=44, authorNames=DUAN P K, ZHU X Y, ZHANG H H, journalName=Journal of Manufacturing Processes, refType=null, unstructuredReference=DUAN P K, ZHU X Y, ZHANG H H, et al. Cost-effective fabrication of customized LTCC devices with multilayer using multi-material 3D printing[J]. Journal of Manufacturing Processes, 2023, 107: 88-97., articleTitle=Cost-effective fabrication of customized LTCC devices with multilayer using multi-material 3D printing, refAbstract=null), Reference(id=1251830043748548669, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=43, issue=5, pageStart=2289, pageEnd=2294, url=null, language=null, rfNumber=[46], rfOrder=45, authorNames=LIANG C Y, HUANG J, WANG J J, journalName=Journal of the European Ceramic Society, refType=null, unstructuredReference=LIANG C Y, HUANG J, WANG J J, et al. Three-dimensional inkjet printing and low temperature sintering of silica-based ceramics[J]. Journal of the European Ceramic Society, 2023, 43(5): 2289-2294., articleTitle=Three-dimensional inkjet printing and low temperature sintering of silica-based ceramics, refAbstract=null), Reference(id=1251830043840823359, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2017, volume=13, issue=null, pageStart=746, pageEnd=753, url=null, language=null, rfNumber=[47], rfOrder=46, authorNames=MUGURUZA A, BO J B, GOMEZ A, journalName=Procedia Manufacturing, refType=null, unstructuredReference=MUGURUZA A, BO J B, GOMEZ A, et al. Development of a multi-material additive manufacturing process for electronic devices[J]. Procedia Manufacturing, 2017, 13: 746-753., articleTitle=Development of a multi-material additive manufacturing process for electronic devices, refAbstract=null), Reference(id=1251830043916320833, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2018, volume=null, issue=null, pageStart=1, pageEnd=4, url=null, language=null, rfNumber=[48], rfOrder=47, authorNames=IHLE M, ZIESCHE S, ZECH C, journalName=null, refType=null, unstructuredReference=IHLE M, ZIESCHE S, ZECH C, et al. Compact LTCC packaging and printing technologies for sub-THz modules[C]//2018 7th Electronic System-integration Technology Conference (ESTC). Dresden, Germany: IEEE Press, 2018: 1-4., articleTitle=Compact LTCC packaging and printing technologies for sub-THz modules, refAbstract=null), Reference(id=1251830043979235395, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, doi=null, pmid=null, pmcid=null, year=2023, volume=49, issue=23, pageStart=38139, pageEnd=38147, url=null, language=null, rfNumber=[49], rfOrder=48, authorNames=ZHAO J Y, CHEN N, LIU J W, journalName=Ceramics International, refType=null, unstructuredReference=ZHAO J Y, CHEN N, LIU J W, et al. Fabrication of CaSiO3 LTCC high aspect ratio microstructure by laser chemical assisted micro-milling[J]. Ceramics International, 2023, 49(23): 38139-38147., articleTitle=Fabrication of CaSiO3 LTCC high aspect ratio microstructure by laser chemical assisted micro-milling, refAbstract=null)], funds=null, companyList=[AuthorCompany(id=1251830036492403454, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, xref=null, ext=[AuthorCompanyExt(id=1251830036496597759, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, companyId=1251830036492403454, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China), AuthorCompanyExt(id=1251830036504986369, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, companyId=1251830036492403454, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=西安电子科技大学高性能电子装备机电集成制造全国重点实验室，陕西 西安 710071)])], figs=[ArticleFig(id=1251830038165930846, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, label=null, caption=null, figureFileSmall=E2ZOfwYLz4nmIkdlq56OXQ==, figureFileBig=xhTAs8k52AhN0JD/q3nVaQ==, tableContent=null), ArticleFig(id=1251830038254011235, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, label=图1, caption=LTCC传统工艺与增材制造对比, figureFileSmall=E2ZOfwYLz4nmIkdlq56OXQ==, figureFileBig=xhTAs8k52AhN0JD/q3nVaQ==, tableContent=null), ArticleFig(id=1251830038446949228, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, label=null, caption=null, figureFileSmall=xFRc7R9S4Qfoosq2KrP0kg==, figureFileBig=vaN6EiLxy+IXObswYQrq8w==, tableContent=null), ArticleFig(id=1251830038518252402, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, label=图2, caption=增材制造LTCC基板材料组成和烧结过程, figureFileSmall=xFRc7R9S4Qfoosq2KrP0kg==, figureFileBig=vaN6EiLxy+IXObswYQrq8w==, tableContent=null), ArticleFig(id=1251830038610527095, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, label=null, caption=null, figureFileSmall=Hcx2Vpga5u/4wd6SAj5/Jw==, figureFileBig=Q7RpgeP4KRQdhOgmtas7eQ==, tableContent=null), ArticleFig(id=1251830038715384700, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, label=图3, caption=挤出直写成型过程与典型应用[35-36], figureFileSmall=Hcx2Vpga5u/4wd6SAj5/Jw==, figureFileBig=Q7RpgeP4KRQdhOgmtas7eQ==, tableContent=null), ArticleFig(id=1251830038811853697, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, label=null, caption=null, figureFileSmall=KyYD4vtqemsdSzrPdRo46Q==, figureFileBig=S4AjCZ15jS7/wX4KANc96A==, tableContent=null), ArticleFig(id=1251830038920905607, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, label=图4, caption=曲面基板与表面导体的一体化喷射成型[37], figureFileSmall=KyYD4vtqemsdSzrPdRo46Q==, figureFileBig=S4AjCZ15jS7/wX4KANc96A==, tableContent=null), ArticleFig(id=1251830039008985996, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, label=null, caption=null, figureFileSmall=I1a7jQNXebXHLqvi5kTntw==, figureFileBig=nDUdwj6Gxsx4HX9e1O3kcg==, tableContent=null), ArticleFig(id=1251830039118037906, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, label=图5, caption=光固化成型过程与典型应用[40], figureFileSmall=I1a7jQNXebXHLqvi5kTntw==, figureFileBig=nDUdwj6Gxsx4HX9e1O3kcg==, tableContent=null), ArticleFig(id=1251830039206118295, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, label=null, caption=null, figureFileSmall=6C9Atp6e5fv28VkwIqdYGw==, figureFileBig=z/j47jOdbMytglkVQcAhBQ==, tableContent=null), ArticleFig(id=1251830039319364505, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, label=图6, caption=选择性激光烧结制备的陶瓷样品, figureFileSmall=6C9Atp6e5fv28VkwIqdYGw==, figureFileBig=z/j47jOdbMytglkVQcAhBQ==, tableContent=null), ArticleFig(id=1251830039428416415, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, label=null, caption=null, figureFileSmall=xHLQcvk/uuH8/gWav8Fbkw==, figureFileBig=wVpRmFtvIZUPwsVWzTLQ/A==, tableContent=null), ArticleFig(id=1251830039516496804, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, label=图7, caption=选择性激光熔化效果展示, figureFileSmall=xHLQcvk/uuH8/gWav8Fbkw==, figureFileBig=wVpRmFtvIZUPwsVWzTLQ/A==, tableContent=null), ArticleFig(id=1251830039591994279, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, label=null, caption=null, figureFileSmall=/zwWmg/O84cCdQF/uGovOg==, figureFileBig=dGIeQWLyTHbb7LINgbfi8g==, tableContent=null), ArticleFig(id=1251830039688463274, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, label=图8, caption=粘结剂喷射成型的复杂形状氧化铝陶瓷芯胚体, figureFileSmall=/zwWmg/O84cCdQF/uGovOg==, figureFileBig=dGIeQWLyTHbb7LINgbfi8g==, tableContent=null), ArticleFig(id=1251830039742989231, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=EN, label=null, caption=null, figureFileSmall=null, figureFileBig=null, tableContent=
成型路径成型工艺成型精度/μm优势不足
基于浆料DIW15～80高效率基板与导体同步成型精度低，易变形
MJ10～80高精度基板与导体同步成型材料难制备，机械性能弱
SLA、DLP5～50成型精度高，效率高基板与导体无法同步成型
基于粉末床SLM、SLS40～200导体机械性能、电性能优异精度低，表面粗糙
基板与导体无法同步成型
BJ50～150成型效率高，适用于复杂结构精度低，烧结收缩率大
), ArticleFig(id=1251830039839458228, tenantId=1146029695717560320, journalId=1251234171981443176, articleId=1251830034189730474, language=CN, label=表1, caption=

典型LTCC增材制造成型工艺对比

, figureFileSmall=null, figureFileBig=null, tableContent=
成型路径成型工艺成型精度/μm优势不足
基于浆料DIW15～80高效率基板与导体同步成型精度低，易变形
MJ10～80高精度基板与导体同步成型材料难制备，机械性能弱
SLA、DLP5～50成型精度高，效率高基板与导体无法同步成型
基于粉末床SLM、SLS40～200导体机械性能、电性能优异精度低，表面粗糙
基板与导体无法同步成型
BJ50～150成型效率高，适用于复杂结构精度低，烧结收缩率大
)], attaches=null, journal=Journal(id=1251231494320992353, delFlag=0, nameCn=电子机械工程, nameEn=Electro-Mechanical Engineering, nameHistory1=null, nameHistory2=null, issn=1008-5300, eissn=, cn=32-1539/TN, coden=null, periodic=双月刊, language=CN, oaType=1, ccby=null, superviseOffice=null, ownerOffice=null, pubOffice=null, editorOffice=null, officeType=null, aims=null, clcCode=null, officeProv=null, officeCity=null, officeAddr=null, officeZip=null, officeEmail=, officePhone=, editDirector=null, officeDirector=null, officeDirectorPhone=null, officeStaffNum=null, officeEmpNum=null, coverPicUrl=OewrmlOM+6jB7jgH2f9GTg==, journalPrice=null, startedYear=null, abbrevIsoEn=Electro-Mechanical Engineering, journalRemark=null, publicationField=null, createdTime=1776246435006, updatedTime=1776252003789, createdBy=18614031015, updatedBy=13701087609, firstLetterCn=E, firstLetterEn=E, subjectCode=Engineering, subjectName=工程, subjectCodeEn=Engineering, subjectNameEn=null, picCn=OewrmlOM+6jB7jgH2f9GTg==, picEn=sXdSUD6P8X2NZ0meTOF8qg==, jcr=null, cjcr=null, exts=[JournalExt(id=1251254853075415366, language=CN, name=电子机械工程, nameHistory1=null, nameHistory2=null, managedBy=, sponsoredBy=, publishedBy=, editorOffice=, officeProv=null, officeCity=null, officeAddr=, officeZip=, editDirector=, officeDirector=null, officePhone=null, coverPicUrl=null, journalRemark=, submitArticleUrl=null, websiteUrl=, createdTime=1776252004164, updatedTime=1776252004164, createdBy=13701087609, updatedBy=13701087609, submissionGuidelinesUrl=, submissionAuthorUrl=https://www.manuscripts.com.cn/dzjxgc, submissionEditorUrl=https://www.manuscripts.com.cn/dzjxgc, submissionReviewUrl=https://www.manuscripts.com.cn/dzjxgc, submissionCeEditorUrl=, submissionAeEditorUrl=, option={"copyright":""}), JournalExt(id=1251254853155107143, language=EN, name=Electro-Mechanical Engineering, nameHistory1=null, nameHistory2=null, managedBy=, sponsoredBy=, publishedBy=, editorOffice=, officeProv=null, officeCity=null, officeAddr=, officeZip=, editDirector=, officeDirector=null, officePhone=null, coverPicUrl=null, journalRemark=, submitArticleUrl=null, websiteUrl=, createdTime=1776252004183, updatedTime=1776252004183, createdBy=13701087609, updatedBy=13701087609, submissionGuidelinesUrl=, submissionAuthorUrl=https://www.manuscripts.com.cn/dzjxgc, submissionEditorUrl=https://www.manuscripts.com.cn/dzjxgc, submissionReviewUrl=https://www.manuscripts.com.cn/dzjxgc, submissionCeEditorUrl=, submissionAeEditorUrl=, option={"copyright":""})], databaseList=null, tenantJournalId=1251234171981443176, websiteList=[Website(id=1251257283490037805, webName=null, webTitle=null, webDomain=null, webCopyrigh=null, webIpcNo=null, seoTitle=null, seoKeywords=null, seoDescription=null, tenantJournalId=null, journalId=1251234171981443176, journalNameCn=null, journalNameEn=null, grayFlag=null, tenantId=1146029695717560320, platformId=null, journalGroupId=null, journalGroupNameCn=null, journalGroupNameEn=null, type=1, domain=https://castjournals.cast.org.cn/joweb/dzjxgc/CN, language=CN, createTime=1776252583620, createBy=18614031015, updateTime=1776253506778, updateBy=18614031015, name=电子机械工程-中文, tplId=1146099689490845704, title=电子机械工程, delFlag=0, indexPage=/home, props=[WebsiteProps(id=1251261268376629814, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=articleTextType, value=kx, createTime=1776253533692, updateTime=1776253533692, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261268359852595, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=banner, value=null, createTime=1776253533687, updateTime=1776253533687, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261268397601337, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=grayFlag, value=0, createTime=1776253533696, updateTime=1776253533696, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261268351463986, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=logo, value=https://castjournals.cast.org.cn/joweb/dzjxgc/CN/file/pic?fileId=s984NMebQa47+vgVZGx5yQ==, createTime=1776253533685, updateTime=1776253533685, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261268414378555, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=minRunFlag, value=0, createTime=1776253533700, updateTime=1776253533700, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261268368241205, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=picServerUrl, value=https://castjournals.cast.org.cn/joweb/dzjxgc/CN/file/pic, createTime=1776253533689, updateTime=1776253533689, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261268401795642, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=silenceFlag, value=0, createTime=1776253533697, updateTime=1776253533697, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261268364046900, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=staticResourcePath, value=https://castjournals.cast.org.cn/joweb/cast_kjdb_cn_619/, createTime=1776253533688, updateTime=1776253533688, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261268385018423, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=themeColor, value=null, createTime=1776253533693, updateTime=1776253533693, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261268389212728, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283490037805, code=themeStyle, value=null, createTime=1776253533694, updateTime=1776253533694, creator=18614031015, updator=18614031015)]), Website(id=1251257283603284023, webName=null, webTitle=null, webDomain=null, webCopyrigh=null, webIpcNo=null, seoTitle=null, seoKeywords=null, seoDescription=null, tenantJournalId=null, journalId=1251234171981443176, journalNameCn=null, journalNameEn=null, grayFlag=null, tenantId=1146029695717560320, platformId=null, journalGroupId=null, journalGroupNameCn=null, journalGroupNameEn=null, type=1, domain=https://castjournals.cast.org.cn/joweb/dzjxgc/EN, language=EN, createTime=1776252583647, createBy=18614031015, updateTime=1776253502485, updateBy=18614031015, name=电子机械工程-英文, tplId=1146101810881728533, title=Electro-Mechanical Engineering, delFlag=0, indexPage=/home, props=[WebsiteProps(id=1251261237825323274, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=articleTextType, value=kx, createTime=1776253526407, updateTime=1776253526407, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261237808546055, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=banner, value=null, createTime=1776253526403, updateTime=1776253526403, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261237842100493, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=grayFlag, value=0, createTime=1776253526411, updateTime=1776253526411, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261237800157446, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=logo, value=https://castjournals.cast.org.cn/joweb/dzjxgc/EN/file/pic?fileId=s984NMebQa47+vgVZGx5yQ==, createTime=1776253526401, updateTime=1776253526401, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261237854683407, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=minRunFlag, value=0, createTime=1776253526414, updateTime=1776253526414, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261237821128969, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=picServerUrl, value=https://castjournals.cast.org.cn/joweb/dzjxgc/EN/file/pic, createTime=1776253526406, updateTime=1776253526406, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261237846294798, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=silenceFlag, value=0, createTime=1776253526412, updateTime=1776253526412, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261237812740360, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=staticResourcePath, value=https://castjournals.cast.org.cn/joweb/cast_kjdb_en_623/, createTime=1776253526404, updateTime=1776253526404, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261237829517579, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=themeColor, value=null, createTime=1776253526408, updateTime=1776253526408, creator=18614031015, updator=18614031015), WebsiteProps(id=1251261237837906188, tenantId=1146029695717560320, journalId=null, journalGroupId=null, siteId=1251257283603284023, code=themeStyle, value=null, createTime=1776253526410, updateTime=1776253526410, creator=18614031015, updator=18614031015)])], journalTitle=电子机械工程, weixinUrl=null, journalUrl=http://dzjxgc.xml-journal.net/, iacademicId=null, status=1, seqNo=null, journalTitleEn=Electro-Mechanical Engineering, journalPhotoCn=OewrmlOM+6jB7jgH2f9GTg==, journalPhotoEn=sXdSUD6P8X2NZ0meTOF8qg==, journalFirstLetter=E, journalRecommend=null, journalNew=null, journalCollection=null, jcrJf=null, cjcrJf=null, jcrJfStr=null, cjcrJfStr=null, submissionFirstDecision=null, sciSubjectClassification=null, casSubjectClassification=null, citeScore=null, totalCitationFrequency=null, icpCode=null, psCode=null, advertisingLicenseCode=null, copyrightInformation=null, country=null, option=, provinceCode=null, provinceName=null, collectFlag=false), detailUrlCn=https://castjournals.cast.org.cn/joweb/dzjxgc/CN/10.19659/j.issn.1008-5300.20250911001, detailUrlEn=https://castjournals.cast.org.cn/joweb/dzjxgc/EN/10.19659/j.issn.1008-5300.20250911001, pdfUrlCn=https://castjournals.cast.org.cn/joweb/dzjxgc/CN/PDF/10.19659/j.issn.1008-5300.20250911001, pdfUrlEn=https://castjournals.cast.org.cn/joweb/dzjxgc/EN/PDF/10.19659/j.issn.1008-5300.20250911001, aliStartDate=null, aliEndDate=null, collectionFlag=false, citedCount=null, citedUrl=null, reference=null)
收藏切换
低温共烧陶瓷的增材制造技术综述
收藏切换
PDF下载
黄进 , 蒲芸娜 , 梁超余
电子机械工程 | 专家论坛 2025,41(5): 27-33
收起
收藏切换
电子机械工程 | 专家论坛 2025, 41(5): 27-33
低温共烧陶瓷的增材制造技术综述
全屏
黄进, 蒲芸娜, 梁超余
作者信息
  • 西安电子科技大学高性能电子装备机电集成制造全国重点实验室，陕西 西安 710071

    • 黄进 男，1975 年生，博士，教授，主要从事机电系统建模与控制、电子装备智能制造研究。

    蒲芸娜 女，1998 年生，博士研究生，主要从事LTCC增材制造研究。

A Review on Additive Manufacturing of Low Temperature Co-fired Ceramics
Jin HUANG, Yunna PU, Chaoyu LIANG
Affiliations
  • State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China
doi: 10.19659/j.issn.1008-5300.20250911001
文章导航
收藏切换
摘要
收起

低温共烧陶瓷（Low Temperature Co-fired Ceramics， LTCC）具有优异的介电性能、热稳定性和多功能集成能力，在5G/6G通信、毫米波雷达、卫星载荷、系统级封装等领域得到广泛应用。然而，传统工艺存在两方面显著局限：一是受成型方式制约，难以实现曲面多层基板的高精度制造；二是工艺流程复杂且对批次规模依赖性强，难以满足单件、小批基板的快速验证需求。增材制造基于逐层堆叠、按需沉积的独特技术路径，为突破上述瓶颈提供了创新性解决方案。文中系统综述了LTCC 增材制造所涉及的材料制备、成型工艺方面的研究动态，分析了当前存在的关键问题，并展望了未来发展方向。

低温共烧陶瓷  /  增材制造  /  材料制备  /  成型工艺

Low temperature co-fired ceramics (LTCC) possess outstanding dielectric properties， thermal stability and multi-functional integration capabilities， and have been widely applied in 5G/6G communications， millimeter-wave radars， satellite payloads and system-level packaging. However， traditional processes have two significant limitations: first， constrained by the forming methods， it's difficult to achieve high-precision fabrication of curved multi-layer substrates;second， the complex process flows and strong dependence on batch scale make it difficult to meet the rapid verification requirment for single-piece and small-batch substrates. Additive manufacturing， based on the unique technical path of layer-by-layer stacking and on-demand deposition， provides an innovative solution to break through the above bottlenecks. In this paper， the research trends in material preparation and forming processes involved in LTCC additive manufacturing are systematically reviewed， the existing key issues are analyzed in depth， and the future development directions are prospected.

low temperature co-fired ceramics  /  additive manufacturing  /  material preparation  /  forming process
黄进, 蒲芸娜, 梁超余. 低温共烧陶瓷的增材制造技术综述. 电子机械工程, 2025 , 41 (5) : 27 -33 . DOI: 10.19659/j.issn.1008-5300.20250911001
Jin HUANG, Yunna PU, Chaoyu LIANG. A Review on Additive Manufacturing of Low Temperature Co-fired Ceramics[J]. Electro-Mechanical Engineering, 2025 , 41 (5) : 27 -33 . DOI: 10.19659/j.issn.1008-5300.20250911001
正文
收起
引言
收起
低温共烧陶瓷（Low Temperature Co-fired Ceramics, LTCC）是一种在较低温度下将多层陶瓷基板与导体电路一次共烧成型的电子基板制造技术，可同时实现结构致密化与高可靠性的三维互连[1]。凭借优异的高频电性能、热稳定性及与高导电金属的良好兼容性，LTCC 已在 5G/6G 通信[2]、毫米波雷达[3]、卫星载荷[4]和高密度系统级封装[5]中得到了广泛应用。
长期以来，LTCC 主要采用“带材铸膜-打孔-丝网印刷-层压-共烧”工艺，具备稳定的工艺控制能力和批量化生产优势[6]。然而，传统工艺一方面难以实现曲面多层基板及复杂异形基板的制造，另一方面因工艺复杂，难以满足单件、小批基板快速验证需求[7]。增材制造凭借“逐层构建、按需沉积”的数字化制造特征，为 LTCC 的曲面结构、异形器件以及个性化制备提供了新的解决思路[8]。
在LTCC增材制造过程中，材料体系设计对打印过程、产品性能及生产成本具有决定性影响，是实现高性能和高可靠性LTCC增材制造的基础；成型工艺优化则通过精准调控打印过程中的参数，成为提高成型精度、打印效率和最终产品性能的关键。近年来， LTCC 增材制造在材料体系设计、成型工艺优化两方面取得了重要进展，本文将系统综述其研究现状与发展方向。
1　LTCC增材制造材料体系设计
收起
相较于传统工艺，增材制造技术无需模具与掩膜，可实现三维基板的一体化成型[9-10]，如图1所示。
LTCC增材制造材料包括基板成型材料和导体成型材料。前者用于成型陶瓷基板，根据玻璃相与晶体相的构成及其烧结过程又可细分为结晶玻璃体系、玻璃陶瓷复合体系及无玻璃相陶瓷体系；后者用于成型基板电路和垂直互连结构，以金、银、铜等高导电性材料为主。
1.1　增材制造LTCC基板成型材料
为实现LTCC基板的增材制造，要求成型材料具有良好的流动性、优异的介电性能、高致密度和低烧结温度，符合条件的材料包括结晶玻璃、玻璃陶瓷复合体及无玻璃相陶瓷。其组成及烧结过程如图2所示。
结晶玻璃以非晶玻璃为前驱体，在烧结过程中通过受控析晶形成晶体相并实现结构致密化，兼具良好的流动黏性与致密化能力，但在烧结过程中易出现结晶不均或孔隙残留，导致介电和热稳定性不高[11]；玻璃陶瓷复合体通过混合晶体相与玻璃相，借助玻璃相的熔融流动辅助晶体颗粒的重排和致密化，从而兼顾了陶瓷的稳定性与玻璃的低温烧结性能[12]，但其中的玻璃相会导致介电损耗增大、化学稳定性下降，且晶体与玻璃的热膨胀系数差异易引发界面应力[13]；无玻璃相陶瓷完全由晶体相构成，依赖固相烧结实现致密化，纯晶体结构赋予了其优异的介电性能、热稳定性与化学惰性，但烧结温度普遍偏高，难以与低熔点金属电路共烧。
为提升可打印性，LIANG等采用射频等离子球化技术制备纳米球形玻璃粉末，并在二氧化硅表面接枝甲基丙烯酰氧丙基三甲氧基硅烷分子，从而有效提高玻璃陶瓷复合浆料的分散稳定性[14]。SUMMERS等将粉末与支化聚乙烯亚胺结合，使Li2TiO3颗粒表面带正电荷，并利用稀 HCl调控表面电荷与体系pH值，可显著减少颗粒团聚[15]。SUN等引入亲水性的聚乙二醇二丙烯酸酯预聚物，提升了浆料在光固化成型过程中的光敏性与固化稳定性[16]。
为有效降低烧结温度，WANG等在基体中引入质量分数为0.03的钾硼硅酸盐玻璃，提升了体积密度，并通过降低结晶活化能将烧结温度由1 020 ℃降至900 ℃[17]。此外，还可通过引入 TeO2、 Bi2O3、B2O3、Li2O、V2O5、MoO3等低熔点氧化物降低烧结温度。例如，天津大学的王东通过调控B2O3-CuO助剂比例，将Li2Ti0.98Mg0.02O2.96F0.04-0.01Nb2O6陶瓷的烧结温度从1 120 ℃降低至750 ℃[18]。在此基础上，超低温共烧陶瓷（Ultra-Low Temperature Co-fired Ceramics, ULTCC）逐渐成为研究热点，其烧结温度可控制在 700 ℃以下。 VALANT和 SUVOROV最早报道了基于Bi12PbO19 的ULTCC材料，可以在680 ℃条件下实现97%的致密度[19]；PANG等提出的新型HBO2 陶瓷甚至能够在低于 200 ℃的极低温条件下实现致密化，大大拓展了ULTCC的发展空间[20]。
离子掺杂可有效提升介电性能。电子科技大学LIU等通过在 NaMg（PO3）3 陶瓷中引入 Zn2+ 离子[21]，制备了 NaMg0.9625Zn0.0375（PO3）3，其介电常数为4.49。REN等提出掺杂Mo6+离子可改善 BaWO4 陶瓷的介电特性，通过制备BaW1-xMoxO4 样品，发现其介电常数为 17.5，损耗角正切为 0.000 22@10 MHz，显著优于纯 BaWO4 陶瓷[22]。WANG等发现提高La2O3/B2O3 比例能提升 La2O3-B2O3-CaO-P2O3 玻璃陶瓷的结晶质量[23]，其相对密度为 95.26%，热膨胀系数为 4.12×10-6 ℃-1，介电常数为 4.52，损耗角正切为0.002 5@12.8 GHz。
1.2　增材制造LTCC导体成型材料
在LTCC增材制造材料体系中，导体材料不仅影响器件的导电性能，还是决定烧结过程中的结构完整性和界面结合稳定性的关键因素，目前最常用的导体材料是金、银、铜等高导电金属及合金[24]。在增材制造过程中，导体材料通常以纳米颗粒的形式分散于有机载体中构成浆料，因此，除具备高导电性外，还要兼顾优异的可打印性，即低黏度、低沸点和稳定的流变特性，同时在低温下保持与陶瓷基体的共烧兼容性[25]，以保证结构的致密化与电性能的稳定。
在提升可打印性方面，WANG等通过调控银浆有机载体中不同聚合物助剂的比例，分析了增稠剂、增塑剂和触变剂对浆料黏度及触变特性的影响[26]。HU等的研究结果表明，聚乙烯吡咯烷酮与Span-85构成的表面活性剂具有优异的性能，采用此表面活性剂后可以制备出电阻率为0.11 mΩ·mm的银浆[27]。此外，掺入氢化蓖麻油触变剂可增加触变指数，提高了成型稳定性。LIN等通过机械混合、三辊研磨和超声处理获得了高度分散的银浆，降低了堵塞喷头的概率[28]。
在提升共烧兼容性方面，YAN等发现当钙硼硅酸盐玻璃添加剂掺量的质量分数为0.03时，金电极的导电性能最佳[29]，其表面电阻率可达2.4 mΩ/sq。LIU等发现，随着玻璃中铅含量的增加，其软化点和黏度显著降低，促进银电极膜与陶瓷层之间的致密共烧和界面结合，在875 ℃下共烧所得银电极的表面电阻率达到 1.21 mΩ/sq[30]。WANG等发现MgTiO3 可与玻璃反应生成新的晶相，并与未反应的 MgTiO3 共同形成扩散阻挡层，进而有效限制银在陶瓷基体中的迁移[31]：以900 ℃高温烧结30 min后，银的扩散系数由6.07×10-13 cm2/s 降低至 3.50×10-13 cm2/s，相应的扩散活化能由 89.4 kJ/mol 提升至 117.2 kJ/mol，扩散系数的降低与扩散活化能的提升共同作用，显著抑制银离子迁移的能力。
2　LTCC增材成型工艺优化
收起
LTCC增材成型工艺主要包括基于浆料的成型工艺和基于粉末床的成型工艺两大类，前者依赖流变可控的浆料体系实现高精度沉积与固化成型，后者则通过粉末铺展与能量选择性作用成型致密结构。
2.1　基于浆料的成型工艺
基于浆料的增材成型工艺充分利用浆料在流体态下所具备的可打印性与成型适应性，包括挤出直写（Direct Ink Writing, DIW） 、材料喷射（ Material Jetting, MJ）以及以立体光刻（ Stereolithography Apparatus, SLA）和数字光处理（Digital Light Processing, DLP）为代表的光固化成型技术。DIW技术通过控制喷头运动与材料挤出率，利用浆料剪切稀化与快速恢复的特性实现浆料的逐层堆叠成型[32]。然而，该技术面临喷头直径限制、路径响应延迟、高纵横比结构在打印过程中易发生坍塌或变形等挑战[33-34]。为此，ZHAO等将DIW与近红外诱导转换颗粒辅助光聚合相结合，实现了无支撑多尺度与大跨度陶瓷的成型[35]，并有效降低烧结收缩率[36]，如图3所示。MJ技术则以压电或热气泡喷头产生微米级液滴，通过高频滴落与即时固化实现高精度图案化成型。LIANG等利用MJ技术实现了曲面基板与表面导体的一体化喷射成型[37]，如图4所示。然而，微滴喷射只能使用低黏度的材料，因此浆料的固含量较低，导致打印效率较低[38]。SLA与DLP同属光固化成型技术，依靠紫外光引发浆料中的光敏树脂进行交联反应，逐层固化生成三维结构[39]。SLA采用点扫描方式进行固化，而 DLP通过面曝光实现整层同时成型，后者具备更快的打印速度和数十微米的分辨率，但在制备厚壁或大尺寸零件时，光在浆料中的穿透和散射效应易造成固化深度不一致，从而引发内部应力集中，导致零件发生翘曲甚至开裂。针对该问题， FERNANDES等通过优化 LTCC光固化浆料的配方，显著提升了DLP打印的一致性与缺陷控制水平[40]，如图5所示。
2.2　基于粉末床的成型工艺
基于粉末床的典型成型工艺包括选择性激光烧结（Selective Laser Sintering, SLS）、选择性激光熔化（Selective Laser Melting, SLM）以及粘结剂喷射（Binder Jetting, BJ）等，如图6～图8所示。
SLS通过激光在预铺粉末层中实现局部软化或表面熔融并粘结来逐层构建三维结构，无需采用支撑结构，可以实现复杂内部通道，但在成型过程中易产生翘曲、边缘毛刺及层间孔隙[41]。SLM采用高功率激光实现粉体完全熔融与再凝固，可获得更高的致密度与力学完整性[42]，但低热导率与热应力集中易引起熔池不稳定、裂纹扩展等问题，其在LTCC器件中的应用仍处于探索阶段。BJ则利用打印头选择性喷射有机粘结剂，在粉末床中形成初步结合结构，随后经脱脂与烧结实现致密化[43]，成型速度快，无热源诱导变形，但脱脂过程中易出现结构塌陷或尺寸收缩不均[44]。典型LTCC增材制造成型工艺对比如表1 所示。
在现有的 LTCC 增材成型工艺中，能够同时实现陶瓷基板与导体线路一体化成型的主要是DIW与MJ工艺。DUAN等基于多材料集成DIW 技术实现了陶瓷基板与导体电路的一体化成型[45]，获得表面粗糙度约 1.43 μm、厚度约 173 μm的陶瓷生胚，以及线宽约 500 μm、厚度约 120 μm的导体图案，经共烧与后处理后，成功制备出多层发光二极管电路和无源湿度传感器。LIANG等采用 MJ 技术集成制造陶瓷基板与表面导体，利用压电喷头分别沉积纳米陶瓷墨水与纳米银墨水，实现了LTCC的一体化成型[46]，基板的烧结收缩率约为 21.5%，表面粗糙度约为 4.3 μm，导电线路的线宽约为 150 μm、厚度约为 27 μm。同时，该工艺可用于制造曲率半径达 50 mm的柔性LTCC基板与电路。然而，目前工艺所能实现的导体线宽仍难以满足高频高速电路所需的精细布线要求，同时线宽一致性与层间对准精度不足，限制了其在高密度集成器件中的应用。未来亟须通过提升喷嘴分辨率、结合原位光学监测与数值补偿算法实现线宽缩减及多层结构的高精度对准。
混合增材制造路径可兼顾成型效率与结构精度。在光固化成型工艺中，SLA与DLP技术能够高效制备陶瓷基板，但其逐层光固化的特性限制了多材料一体化沉积的能力。MUGURUZA等通过将数字光处理与喷墨工艺相结合实现了芯片制造[47]。气溶胶喷射精度较高，已应用于导体打印，例如，IHLE等通过在成型陶瓷带上喷射纳米银，成功制备出共面波导结构[48]，但由于气溶胶喷射为连续喷射模式，难以实现点阵结构的成型。基于粉末床成型的技术，如SLM、SLS和BJ，虽然在金属成型应用中已较为成熟，但在陶瓷-导体一体化制造中仍面临表面粗糙度高和精度较低的问题。
在 LTCC 增材制造过程中，若陶瓷基板与导体线路无法实现同步沉积与固化，则需要进行多次定位操作。此时定位偏差会在层间堆叠过程中逐步累积，最终导致通孔错位、互连缺陷，甚至引发整体结构形变。针对这一问题，ZHAO等通过纳秒激光与化学铣削辅助微铣削工艺，实现了多余材料的高效去除，从而提升了层间对准精度[49]；SUMMERS等提出基于挤压厚度参数的工艺补偿策略，有效改善了多材料界面的结合质量[15]。
3　LTCC增材制造关键问题
收起
当前，增材制造面临的关键问题主要包括材料、工艺和设备研发三个方面。
在材料方面，虽然结晶玻璃体系与玻璃陶瓷复合体系可以通过玻璃相在烧结过程中的流动作用有效促进致密化，但结晶玻璃体系会因晶相析出及玻璃相残余导致介电稳定性下降，而玻璃陶瓷复合体系则面临界面结合不足的问题。现有研究在兼顾二者低温烧结特性的同时提升其介电性能，通过调控浆料的流变特性与分散性保障稳定成型，取得重要进展。首先，通过多相调控引入功能性陶瓷相，实现热膨胀系数匹配与晶相约束，从而抑制热失配和性能波动；其次，借助界面工程手段（如表面改性与梯度过渡结构设计），强化陶瓷/玻璃界面结合并缓解应力集中；最后，通过优化颗粒粒径分布与表面改性，配合合理的分散剂和有机载体体系，实现浆料的可控调节。
在工艺方面，在LTCC多层打印过程中，导体通孔与介质层容易出现层间错位、通孔填充不足、烧结收缩不匹配等问题，从而导致垂直互连失效。后续研究重点为探索有效的打印路径规划与打印参数优化方法以提高多层结构的成型位置精度，并在随后的脱脂烧结过程中抑制孔隙与应力集中，以显著改善互连的一致性与可靠性。
在设备研发方面，现有设备系统普遍依赖开环控制，缺乏对浆料流变特性、沉积厚度及烧结收缩过程的实时监测，导致尺寸偏差累积进而引发器件性能波动。未来需引入成型质量在线监控技术，实现对沉积精度、界面缺陷和性能演化的实时捕捉，并在此基础上引入人工智能方法，逐步构建智能闭环调控机制。随着监测与控制技术的完善，LTCC增材制造装备正朝着高精度、大规模及高可靠性的工程化应用方向发展。
4　结束语
收起
增材制造为曲面、异形及单件、小批量LTCC电路基板的制备提供了一种新的技术途径，本文综述了LTCC 增材制造所涉及的材料体系和制造工艺方面的研究进展，分析了存在的关键问题，探讨了在材料制备、工艺创新以及制造装备研发等方面的发展趋势，以期为 LTCC增材制造的工程化应用提供借鉴与参考。综述研究结果表明，当前的LTCC增材制造技术过于侧重单一参数的优化，未能充分考虑材料、工艺和装备的协同作用，仍面临诸如多材料协同工作、高精度打印、功能一体化设计的挑战。未来可以聚焦于多材料设计与烧结工艺的精细化优化、高性能材料的开发以及智能化制造系统的实现等方面进行研究。通过更深入的研究和技术创新，LTCC增材制造将在高频电子、传感器以及微波器件等领域展现更大的应用潜力。
文献
收起
参考文献 引证文献
排序方式：
[1]
SEBASTIAN M T, WANG H, JANTUNEN H. Low temperature co-fired ceramics with ultra-low sintering temperature: a review[J]. Current Opinion in Solid State & Materials Science, 2016, 20(3): 151-170.
[2]
LI S, LI C, MAO M M, et al. High Q×f values of ZnNi co-modified LiMg0.9Zn0.1-xNixPO4 microwave dielectric ceramics for 5G/6G LTCC modules[J]. Journal of the European Ceramic Society, 2022, 42(13): 5684-5690.
[3]
SHI Y R, FENG W J, WANG H, et al. Compact planar W-band front-end module based on EBG packaging and LTCC circuits[J]. IEEE Transactions on Circuits and Systems Ⅱ: Express Briefs, 2021, 68(3):878-882.
[4]
WOIFF I, GUNNER C, KASSNER J, et al. New heights for satellites: LTCC multilayer technology for future satellites[J]. IEEE Microwave Magazine, 2017, 19(1): 36-47.
[5]
RIDA K H. Packaging of microwave integrated circuits in LTCC technology[D]. Brest, France:University of Western Brittany, 2013.
[6]
GAO Y J, FENG J J, LIU F, et al. Effects of organic vehicle on the rheological and screen-printing characteristics of silver paste for LTCC thick film electrodes[J]. Materials, 2022, 15(5): 1-11.
[7]
TAN Q L, LYU W, JI Y H, et al. A LC wireless passive temperature-pressure-humidity (TPH) sensor integrated on LTCC ceramic for harsh monitoring[J]. Sensors and Actuators B: Chemical, 2018, 270: 433-442.
[8]
RAYNAUD J, PATELOUP V, BERNARD M, et al. Hybridization of additive manufacturing processes to build ceramic/metal parts: example of LTCC[J]. Journal of the European Ceramic Society, 2020, 40(3):759-767.
[9]
WANG F L, ZHANG W J, CHEN X Y, et al. Low temperature sintering and characterization of La2O3-B2O3-CaO glass-ceramic/LaBO3 composites for LTCC application[J]. Journal of the European Ceramic Society, 2020, 40(6): 2382-2389.
[10]
ZHANG G M, YU Z H, SONG D S, et al. Directly printed standing ceramic circuit boards for rapid prototyping of miniaturization and high-power of electronics[J]. Nature Communications, 2025, 16(1):1-11.
[11]
陈国华,黄冰虹.低温共烧低介电常数微波介质陶瓷的研究进展[J].材料导报, 2023, 37(20): 28-43.
[12]
HAJIAN A, ARTEMENKO A, KROMKA A, et al. Impact of sintering temperature on phase composition, microstructure, and porosification behavior of LTCC substrates[J]. Journal of the European Ceramic Society, 2022, 42(13): 5789-5800.
[13]
王威,张玲,吴亚光,等.微波毫米波用低介电常数低温共烧陶瓷研究进展[J].硅酸盐学报, 2023, 51(4): 934-948.
[14]
LIANG C Y, HUANG J, PU Y N, et al. Nano-borosilicate glass-silica ceramic material jetting technology for additive manufacturing of multilayer LTCC substrates[J]. Journal of Manufacturing Processes, 2024, 123: 20-27.
[15]
SUMMERS J M, VU A, MALDONADO J, et al. 3D printing and pressureless sintering of Li2TiO3 for next generation dielectric resonator antennas[J]. Scientific Reports, 2025, 15(1): 1-14.
[16]
SUN H W, ZOU B, QUAN T, et al. Multi-material ceramic hybrid additive manufacturing based on vat photopolymerization and material extrusion compound process[J]. Additive Manufacturing, 2025, 97:104627.
[17]
WANG M X, ZHANG S R, YANG Z Y, et al. Sintering behaviors and thermal properties of Li2TiO3-based ceramics for LTCC applications[J]. Ceramics International, 2022, 48(19): 27312-27323.
[18]
WANG D, LI L X, DU M K, et al. A low-sintering temperature microwave dielectric ceramic for 5G LTCC applications with ultralow loss[J]. Ceramics International, 2021, 47(20): 28675-28684.
[19]
VALANT M, SUVOROV D. Processing and dielectric properties of sillenite compounds Bi12MO20-δ (M= Si, Ge, Ti, Pb, Mn, B1/2P1/2)[J]. Journal of the American Ceramic Society, 2001, 84(12): 2900-2904.
[20]
PANG L X, ZHOU D, LI W B, et al. High quality microwave dielectric ceramic sintered at extreme-low temperature below 200° and co-firing with base metal[J]. Journal of the European Ceramic Society, 2017, 37(9): 3073-3077.
[21]
LIU W, LI Y X, LIU X Y, et al. A novel NaMg(1-x) Znx(PO3)3 microwave dielectric ceramic with an ultralow dielectric constant for LTCC application[J]. Ceramics International, 2024, 50(1): 143-149.
[22]
REN Y X, WANG J X, GUO Y F, et al. Sintering behavior, lattice vibrational characteristics and dielectric properties of B-site ion substituted BaWO4 ceramics for LTCC applications[J]. Journal of Alloys and Compounds, 2025, 1010: 177261.
[23]
WANG F L, ZHANG W J, CHEN X Y, et al. Synthesis and characterization of low CTE value La2O3-B2O3-CaO-P2O5 glass/cordierite composites for LTCC application[J]. Ceramics International, 2019, 45(6): 7203-7209.
[24]
游韬,谢廉忠.国产LTCC浆料的应用研究[J].电子机械工程, 2017, 33(5): 52-55.
[25]
于卫龙,王亚东,任耀华. LTCC银浆电迁移特性的抑制方法[J].电子工艺技术, 2025, 46(4): 23-25.
[26]
WANG W W, HU Y C, LI L J, et al. Effect of various polymer additives on the rheology and thixotropy of organic vehicles[J]. Journal of Materials Science:Materials in Electronics, 2022, 33(15): 12002-12015.
[27]
HU Y C, DU Z F, YAO Y B, et al. Effects of organic additives on the microstructural, rheological and electrical properties of silver paste for LTCC applications[J]. Journal of Materials Science: Materials in Electronics, 2021, 32: 14368-14384.
[28]
LIN H W, HWU W H, GER M D. The dispersion of silver nanoparticles with physical dispersal procedures[J]. Journal of Materials Processing Technology, 2008, 206(1): 56-61.
[29]
YAN T N, ZHANG W J, CHEN X Y, et al. Improvement of gold electrode conductivity after cofiring with CaO-B2O3-SiO2 green tapes for LTCC application[J]. Ceramics International, 2020, 46(1): 493-499.
[30]
LIU Z F, LIANG W X, ZHANG W J, et al. Effects of Pb-B-Si-O glass on the microstructures and electrical properties of silver electrode for LTCC application[J]. Journal of Materials Science: Materials in Electronics, 2022, 33: 17814-17827.
[31]
WANG Y, ZHU H K, BIAN W J, et al. Inhibition of silver diffusion in LTCC by MgTiO3 addition[J]. Ceramics International, 2020, 46(8): 10729-10733.
[32]
YANG G Y, SUN Y Y, LI M M, et al. Direct-ink-writing (DIW) 3D printing functional composite materials based on supra-molecular interaction[J]. Composites Science and Technology, 2021, 215:109013.
[33]
REVELO C F, COLORADO H A. 3D printing of kaolinite clay ceramics using the direct ink writing (DIW) technique[J]. Ceramics International, 2018, 44(5): 5673-5682.
[34]
MBARKI A, BOCQUET L, STEVENSON A. Linking rheology and printability for dense and strong ceramics by direct ink writing[J]. Scientific Reports, 2017, 7(1): 6017-6029.
[35]
ZHAO Y Q, ZHU J Z, HE W Y, et al. 3D printing of unsupported multi-scale and large-span ceramic via near-infrared assisted direct ink writing[J]. Nature Communications, 2023, 14(1): 2381-2397.
[36]
ZHAO Y Q, SHI G H, MIAO J T, et al. Near-infrared photothermal dual crosslinking strategy for precise and efficient direct ink writing of high solids ceramic slurries[J]. Materials & Design, 2023, 235:112398.
[37]
LIANG C Y, HUANG J, WANG J J, et al. Additive manufacturing of low-temperature co-fired ceramic substrates and surface conductors based on material jetting[J]. Additive Manufacturing, 2023, 78: 103856.
[38]
DERBY B. Inkjet printing of functional and structural materials: fluid property requirements, feature stability, and resolution[J]. Annual Review of Materials Research, 2010, 40(1): 395-414.
[39]
MAMATHA S, BISWAS P, JOHNSON R. Digital light processing of ceramics: an overview on process, materials and challenges[J]. Progress in Additive Manufacturing, 2023, 8(5): 1083-1102.
[40]
FERNANDES J G, BARCELONA P, BLANES M, et al. Study of mixing process of low temperature cofired ceramics photocurable suspension for digital light processing stereolithography[J]. Ceramics International, 2021, 47(11): 15931-15938.
[41]
LIU K, SUN H J, SHI Y S, et al. Research on selective laser sintering of Kaolin-epoxy resin ceramic powders combined with cold isostatic pressing and sintering[J]. Ceramics International, 2016, 42(9):10711-10718.
[42]
SING S L, YEONG W Y, WIRIA F E, et al. Direct selective laser sintering and melting of ceramics: a review[J]. Rapid Prototy Journal, 2017, 23(3): 611-623.
[43]
HUANG S J, YE C S, ZHAO H P, et al. Additive manufacturing of thin alumina ceramic cores using binder-jetting[J]. Additive Manufacturing, 2019, 29:100802.
[44]
KWON M, CHOI J H, KIM J H, et al. Optimization of inorganic powder properties for manufacturing ceramic filter using binder jetting process[J]. Additive Manufacturing, 2023, 70: 103564.
[45]
DUAN P K, ZHU X Y, ZHANG H H, et al. Cost-effective fabrication of customized LTCC devices with multilayer using multi-material 3D printing[J]. Journal of Manufacturing Processes, 2023, 107: 88-97.
[46]
LIANG C Y, HUANG J, WANG J J, et al. Three-dimensional inkjet printing and low temperature sintering of silica-based ceramics[J]. Journal of the European Ceramic Society, 2023, 43(5): 2289-2294.
[47]
MUGURUZA A, BO J B, GOMEZ A, et al. Development of a multi-material additive manufacturing process for electronic devices[J]. Procedia Manufacturing, 2017, 13: 746-753.
[48]
IHLE M, ZIESCHE S, ZECH C, et al. Compact LTCC packaging and printing technologies for sub-THz modules[C]//2018 7th Electronic System-integration Technology Conference (ESTC). Dresden, Germany: IEEE Press, 2018: 1-4.
[49]
ZHAO J Y, CHEN N, LIU J W, et al. Fabrication of CaSiO3 LTCC high aspect ratio microstructure by laser chemical assisted micro-milling[J]. Ceramics International, 2023, 49(23): 38139-38147.
2025年第41卷第5期
PDF下载
142
62
引用本文
BibTeX
文章信息
doi: 10.19659/j.issn.1008-5300.20250911001
  • 接收时间：2025-09-11
  • 首发时间：2026-04-17
补充材料
相关文章
文章信息
作者
出版历史
  • 收稿日期：2025-09-11
基金
作者信息
    西安电子科技大学高性能电子装备机电集成制造全国重点实验室，陕西 西安 710071
参考文献
分享链接
https://castjournals.cast.org.cn/joweb/dzjxgc/CN/10.19659/j.issn.1008-5300.20250911001
分享至
全文二维码

扫描看全文

引用本文
BibTeX
本文的引用情况
2种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
相关链接
论文
最新文章
热读文章
热点专题
内参
蓝皮书
产业发展报告
传播力报告
期刊分级目录
资讯
学术新闻
行业新闻
学术会议
行业会议
关于
关于我们
联系我们
北京市海淀区学院南路86号
100081
010-62199257
qkjq@cast.org.cn

中国科学技术协会版权所有 京ICP 备10216604号-4 海淀分局备案 1101084647
科技导报社主办 中国科协信息中心技术支持