Article(id=1322531804729430886, tenantId=1146029695717560320, journalId=1146031654075715584, issueId=1322531709363536798, articleNumber=null, orderNo=null, doi=10.13234/j.issn.2095-2805.2026.6.1, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1712246400000, receivedDateStr=2024-04-05, revisedDate=1719936000000, revisedDateStr=2024-07-03, acceptedDate=1721577600000, acceptedDateStr=2024-07-22, onlineDate=1793245753699, onlineDateStr=2026-10-29, pubDate=1782748800000, pubDateStr=2026-06-30, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1793245753699, onlineIssueDateStr=2026-10-29, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1793245753699, creator=13701087609, updateTime=1793245753699, updator=13701087609, issue=Issue{id=1322531709363536798, tenantId=1146029695717560320, journalId=1146031654075715584, year='2026', volume='24', issue='6', pageStart='1', pageEnd='368', issueExtLink='null', onlineDate='null', pubDate='1782748800000', pubDateStr='2026-06-30', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1793245730962, creator='13701087609', updateTime=1793245730962, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext=null, issueFiles=null, downloadFileDto=null}, startPage=1, endPage=10, ext={EN=ArticleExt(id=1322531804930757479, articleId=1322531804729430886, tenantId=1146029695717560320, journalId=1146031654075715584, language=EN, title=Optimization Method for Cauer Model Considering Deformation and Offset Characteristics of Dynamic Thermal Diffusion Boundary, columnId=1321491639659516540, journalTitle=Journal of Power Supply, columnName=Power Semiconductor Devices and Drive Circuits, runingTitle=null, highlight=null, articleAbstract=

At present, most of the traditional Cauer models assume that the shape of the effective thermal conduction surface of each layer in an insulated gate bipolar transistor (IGBT) module is square or circular, which leads to large errors of the calculation results of IGBT module junction temperature. On this basis, the shape of the effective thermal conduction surface of each layer in the IGBT module are studied, and a Cauer model considering the deformation characteristics of thermal diffusion boundary is proposed to make it more suitable for the actual situation. It is found that a phenomenon of offset occurs at the thermal diffusion boundary of the IGBT module. By capturing the diameter of the selected dynamic thermal diffusion boundary and modifying the parameters of the Cauer model which considerers the deformation and offset characteristics of dynamic thermal diffusion boundary, the junction temperature of the IGBT module can be accurately estimated. The correctness and feasibility of the proposed optimization method for Cauer model consideringthe deformation and offset characteristics of dynamic thermal diffusion boundary were verified by simulation and experimental results.

, authors=Aoyang LI1, Jinlei XIN2, Mingxing DU1, authorsList=Aoyang LI, Jinlei XIN, Mingxing DU, authorCompany=null, correspAuthors=Mingxing DU, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1322531807115989866, articleId=1322531804729430886, tenantId=1146029695717560320, journalId=1146031654075715584, language=CN, title=计及动态热扩散边界形变和偏移特性的Cauer模型优化方法, columnId=1321491641425318526, journalTitle=电源学报, columnName=功率半导体器件与驱动, runingTitle=null, highlight=null, articleAbstract=

传统Cauer模型的绝缘栅双极晶体管IGBT(insulated gate bipolar transistor)模块各层有效传热面形状为方形或者圆形,这使得IGBT模块结温计算结果误差较大。基于此,通过对IGBT模块各层有效传热面形状规律进行深入研究,提出了考虑热扩散边界形变特性的Cauer模型,使其更加符合实际情况。研究发现IGBT模块热扩散边界存在偏移现象,进而提出了通过捕捉选定的动态热扩散边界的直径,对动态热扩散边界形变偏移特性的Cauer模型参数进行修正,从而实现IGBT模块结温精确估计的方法。通过仿真和实验验证了提出的计及动态热扩散边界形变和偏移特性的Cauer模型优化方法的正确性和可行性。

, authors=李澳阳1, 信金蕾2, 杜明星中国电源学会会员1, authorsList=李澳阳, 信金蕾, 杜明星中国电源学会会员, authorCompany=null, correspAuthors=杜明星中国电源学会会员, authorNote=

李澳阳(1999— ),男,硕士研究生。研究方向:电力电子器件可靠性。E-mail:。

信金蕾(1996— ),男,硕士研究生,工程师。研究方向:电力电子器件可靠性。E-mail:。

, correspAuthorsNote=
杜明星(1980— ),男,中国电源学会会员,通信作者,博士,教授。研究方向:电力电子器件可靠性等。E-mail:。
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李澳阳(1999— ),男,硕士研究生。研究方向:电力电子器件可靠性。E-mail:。

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李澳阳(1999— ),男,硕士研究生。研究方向:电力电子器件可靠性。E-mail:。

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信金蕾(1996— ),男,硕士研究生,工程师。研究方向:电力电子器件可靠性。E-mail:。

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信金蕾(1996— ),男,硕士研究生,工程师。研究方向:电力电子器件可靠性。E-mail:。

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计及动态热扩散边界形变和偏移特性的Cauer模型优化方法
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李澳阳 1 , 信金蕾 2 , 杜明星中国电源学会会员 1
电源学报 | 功率半导体器件与驱动 2026,24(6): 1-10
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电源学报 |功率半导体器件与驱动 2026 , 24 (6) : 1 -10
计及动态热扩散边界形变和偏移特性的Cauer模型优化方法
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信金蕾(1996— ),男,硕士研究生,工程师。研究方向:电力电子器件可靠性。E-mail:。

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李澳阳1 , 信金蕾2 , 杜明星中国电源学会会员1
作者信息
  • 1.天津市新能源电力变换传输与智能控制重点实验室,天津 300384
  • 2.国网天津市电力公司城东供电分公司,天津 300250
通讯作者:
杜明星(1980— ),男,中国电源学会会员,通信作者,博士,教授。研究方向:电力电子器件可靠性等。E-mail:。
作者简介:

李澳阳(1999— ),男,硕士研究生。研究方向:电力电子器件可靠性。E-mail:。

信金蕾(1996— ),男,硕士研究生,工程师。研究方向:电力电子器件可靠性。E-mail:。

Optimization Method for Cauer Model Considering Deformation and Offset Characteristics of Dynamic Thermal Diffusion Boundary
Aoyang LI1 , Jinlei XIN2 , Mingxing DU Member, CPSS1
Affiliations
  • 1.Tianjin Key Laboratory of New Energy Power Conversion, Transmission and Intelligent Control, Tianjin 300384, China
  • 2.Chengdong Power Supply Branch Company, State Grid Tianjin Electric Power Company, Tianjin 300250, China
出版时间: 2026-06-30 doi: 10.13234/j.issn.2095-2805.2026.6.1
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传统Cauer模型的绝缘栅双极晶体管IGBT(insulated gate bipolar transistor)模块各层有效传热面形状为方形或者圆形,这使得IGBT模块结温计算结果误差较大。基于此,通过对IGBT模块各层有效传热面形状规律进行深入研究,提出了考虑热扩散边界形变特性的Cauer模型,使其更加符合实际情况。研究发现IGBT模块热扩散边界存在偏移现象,进而提出了通过捕捉选定的动态热扩散边界的直径,对动态热扩散边界形变偏移特性的Cauer模型参数进行修正,从而实现IGBT模块结温精确估计的方法。通过仿真和实验验证了提出的计及动态热扩散边界形变和偏移特性的Cauer模型优化方法的正确性和可行性。

IGBT模块  /  有效传热面形状  /  Cauer模型  /  热边界偏移  /  结温

At present, most of the traditional Cauer models assume that the shape of the effective thermal conduction surface of each layer in an insulated gate bipolar transistor (IGBT) module is square or circular, which leads to large errors of the calculation results of IGBT module junction temperature. On this basis, the shape of the effective thermal conduction surface of each layer in the IGBT module are studied, and a Cauer model considering the deformation characteristics of thermal diffusion boundary is proposed to make it more suitable for the actual situation. It is found that a phenomenon of offset occurs at the thermal diffusion boundary of the IGBT module. By capturing the diameter of the selected dynamic thermal diffusion boundary and modifying the parameters of the Cauer model which considerers the deformation and offset characteristics of dynamic thermal diffusion boundary, the junction temperature of the IGBT module can be accurately estimated. The correctness and feasibility of the proposed optimization method for Cauer model consideringthe deformation and offset characteristics of dynamic thermal diffusion boundary were verified by simulation and experimental results.

Insulated gate bipolar transistor (IGBT) module  /  shape of effective thermal conduction surface  /  Cauer model  /  thermal boundary offset  /  junction temperature
李澳阳, 信金蕾, 杜明星中国电源学会会员. 计及动态热扩散边界形变和偏移特性的Cauer模型优化方法. 电源学报, 2026 , 24 (6) : 1 -10 . DOI: 10.13234/j.issn.2095-2805.2026.6.1
Aoyang LI, Jinlei XIN, Mingxing DU. Optimization Method for Cauer Model Considering Deformation and Offset Characteristics of Dynamic Thermal Diffusion Boundary[J]. Journal of Power Supply, 2026 , 24 (6) : 1 -10 . DOI: 10.13234/j.issn.2095-2805.2026.6.1

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2026年第24卷第6期
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doi: 10.13234/j.issn.2095-2805.2026.6.1
  • 接收时间:2024-04-05
  • 首发时间:2026-10-29
  • 出版时间:2026-06-30
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  • 收稿日期:2024-04-05
  • 修回日期:2024-07-03
  • 录用日期:2024-07-22
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    1.天津市新能源电力变换传输与智能控制重点实验室,天津 300384
    2.国网天津市电力公司城东供电分公司,天津 300250

通讯作者:

杜明星(1980— ),男,中国电源学会会员,通信作者,博士,教授。研究方向:电力电子器件可靠性等。E-mail:。
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