Article(id=1322531884001767987, tenantId=1146029695717560320, journalId=1146031654075715584, issueId=1322531779840426416, articleNumber=null, orderNo=null, doi=10.13234/j.issn.2095-2805.2026.7.305, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1725811200000, receivedDateStr=2024-09-09, revisedDate=1731427200000, revisedDateStr=2024-11-13, acceptedDate=1732550400000, acceptedDateStr=2024-11-26, onlineDate=1793245772599, onlineDateStr=2026-10-29, pubDate=1785340800000, pubDateStr=2026-07-30, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1793245772599, onlineIssueDateStr=2026-10-29, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1793245772599, creator=13701087609, updateTime=1793245772599, updator=13701087609, issue=Issue{id=1322531779840426416, tenantId=1146029695717560320, journalId=1146031654075715584, year='2026', volume='24', issue='7', pageStart='1', pageEnd='368', issueExtLink='null', onlineDate='null', pubDate='1785340800000', pubDateStr='2026-07-30', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1793245747766, creator='13701087609', updateTime=1793245747766, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext=null, issueFiles=null, downloadFileDto=null}, startPage=305, endPage=314, ext={EN=ArticleExt(id=1322531884219871796, articleId=1322531884001767987, tenantId=1146029695717560320, journalId=1146031654075715584, language=EN, title=Multi-physical Domain Coupling Analysis of Multi-chip Parallel Controller, columnId=1321491666431751062, journalTitle=Journal of Power Supply, columnName=Motor Drives and Control, runingTitle=null, highlight=null, articleAbstract=

Silicon carbide devices with multi-chip parallel structure are widely used in motor controllers for new energy vehicles in high frequency and high power density applications. The motor controller is a highly coupled electromagnetic-thermal system. The imbalance of chip temperature and stray inductance in the multi-chip parallel structure aggravates the complexity of the coupling system. In order to reveal the deep coupling mechanism of electromagnetic-thermal and the variation law of electromagnetic-thermal domain in the motor controller, multi-physical field coupling analysis under multi-parallel structure is needed. A multi-physical field coupling analysis method based on parameter transfer is proposed. First, the stray inductance model of chip parallel branch at different temperatures is established by magnetic-thermal coupling analysis. Then, through the electro-thermal coupling analysis, the simulation model of silicon carbide chip losses under different temperatures and stray inductance is established. Finally, loss parameter transfer is used to simulate the temperature of the controller under fluid-solid coupling, and the stray inductance model and loss model at this temperature are updated in real time. The electromagnetic-thermal coupling parameters of the chips under the multi-chip parallel structure during the temperature rise of the controller are studied. The accuracy of the multi-physics coupling analysis method is verified by the temperature rise experiment.

, authors=Zhaoran WANG, Wei SHI, Aihua LIAO, Dingyu HU, authorsList=Zhaoran WANG, Wei SHI, Aihua LIAO, Dingyu HU, authorCompany=null, correspAuthors=Zhaoran WANG, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1322531884513473077, articleId=1322531884001767987, tenantId=1146029695717560320, journalId=1146031654075715584, language=CN, title=多芯片并联控制器的多物理场耦合分析, columnId=1321491668273050520, journalTitle=电源学报, columnName=电机驱动与控制, runingTitle=null, highlight=null, articleAbstract=

碳化硅器件以多芯片并联结构,广泛应用于高频和高功率密度场合的新能源车用电机控制器中。电机控制器是电磁热高度耦合系统,多芯片并联结构的芯片温度及杂散电感不均衡加剧了耦合系统的复杂性。为揭示电机控制器内部电磁热深度耦合机制及电磁热域变化规律,需进行多并联结构下的多物理场耦合分析。于是提出了一种基于参数传递的多物理场耦合分析方法。首先,通过磁热耦合分析建立不同温度下的芯片并联支路杂散电感模型;然后,通过电热耦合分析建立不同温度及杂散电感下的碳化硅芯片损耗仿真模型;最后,利用损耗参数传递进行流固耦合下的控制器温度仿真,并实时更新该温度下的杂散电感模型及损耗模型,研究了在控制器温升过程中多芯片并联结构下的芯片电磁热耦合参数变化,并通过温升实验验证了多物理场耦合分析方法的准确性。

, authors=王钊冉, 师蔚, 廖爱华, 胡定玉, authorsList=王钊冉, 师蔚, 廖爱华, 胡定玉, authorCompany=null, correspAuthors=王钊冉, authorNote=

师蔚(1981— ),女,博士,副教授。研究方向:永磁电机及其控制技术。E-mail:。

廖爱华(1978— ),女,博士,副教授。研究方向:车辆故障诊断与智能维护。E-mail:。

胡定玉(1987— ),男,博士,教授。研究方向:车辆故障诊断与智能维护。E-mail:。

, correspAuthorsNote=
王钊冉(1999— ),男,通信作者,硕士研究生。研究方向:基于多物理场耦合的牵引功率模块温度分析。E-mail:。
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师蔚(1981— ),女,博士,副教授。研究方向:永磁电机及其控制技术。E-mail:。

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师蔚(1981— ),女,博士,副教授。研究方向:永磁电机及其控制技术。E-mail:。

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廖爱华(1978— ),女,博士,副教授。研究方向:车辆故障诊断与智能维护。E-mail:。

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廖爱华(1978— ),女,博士,副教授。研究方向:车辆故障诊断与智能维护。E-mail:。

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胡定玉(1987— ),男,博士,教授。研究方向:车辆故障诊断与智能维护。E-mail:。

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胡定玉(1987— ),男,博士,教授。研究方向:车辆故障诊断与智能维护。E-mail:。

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多芯片并联控制器的多物理场耦合分析
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王钊冉 , 师蔚 , 廖爱华 , 胡定玉
电源学报 | 电机驱动与控制 2026,24(7): 305-314
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多芯片并联控制器的多物理场耦合分析
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师蔚(1981— ),女,博士,副教授。研究方向:永磁电机及其控制技术。E-mail:。

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廖爱华(1978— ),女,博士,副教授。研究方向:车辆故障诊断与智能维护。E-mail:。

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廖爱华(1978— ),女,博士,副教授。研究方向:车辆故障诊断与智能维护。E-mail:。

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胡定玉(1987— ),男,博士,教授。研究方向:车辆故障诊断与智能维护。E-mail:。

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胡定玉(1987— ),男,博士,教授。研究方向:车辆故障诊断与智能维护。E-mail:。

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王钊冉 , 师蔚 , 廖爱华 , 胡定玉
作者信息
  • 上海工程技术大学城市轨道交通学院,上海 201620
通讯作者:
王钊冉(1999— ),男,通信作者,硕士研究生。研究方向:基于多物理场耦合的牵引功率模块温度分析。E-mail:。
作者简介:

师蔚(1981— ),女,博士,副教授。研究方向:永磁电机及其控制技术。E-mail:。

廖爱华(1978— ),女,博士,副教授。研究方向:车辆故障诊断与智能维护。E-mail:。

胡定玉(1987— ),男,博士,教授。研究方向:车辆故障诊断与智能维护。E-mail:。

Multi-physical Domain Coupling Analysis of Multi-chip Parallel Controller
Zhaoran WANG , Wei SHI , Aihua LIAO , Dingyu HU
Affiliations
  • School of Urban Rail Transit, Shanghai University of Engineering Science, Shanghai 201620, China
出版时间: 2026-07-30 doi: 10.13234/j.issn.2095-2805.2026.7.305
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碳化硅器件以多芯片并联结构,广泛应用于高频和高功率密度场合的新能源车用电机控制器中。电机控制器是电磁热高度耦合系统,多芯片并联结构的芯片温度及杂散电感不均衡加剧了耦合系统的复杂性。为揭示电机控制器内部电磁热深度耦合机制及电磁热域变化规律,需进行多并联结构下的多物理场耦合分析。于是提出了一种基于参数传递的多物理场耦合分析方法。首先,通过磁热耦合分析建立不同温度下的芯片并联支路杂散电感模型;然后,通过电热耦合分析建立不同温度及杂散电感下的碳化硅芯片损耗仿真模型;最后,利用损耗参数传递进行流固耦合下的控制器温度仿真,并实时更新该温度下的杂散电感模型及损耗模型,研究了在控制器温升过程中多芯片并联结构下的芯片电磁热耦合参数变化,并通过温升实验验证了多物理场耦合分析方法的准确性。

多芯片并联  /  多物理场  /  参数耦合  /  杂散电感

Silicon carbide devices with multi-chip parallel structure are widely used in motor controllers for new energy vehicles in high frequency and high power density applications. The motor controller is a highly coupled electromagnetic-thermal system. The imbalance of chip temperature and stray inductance in the multi-chip parallel structure aggravates the complexity of the coupling system. In order to reveal the deep coupling mechanism of electromagnetic-thermal and the variation law of electromagnetic-thermal domain in the motor controller, multi-physical field coupling analysis under multi-parallel structure is needed. A multi-physical field coupling analysis method based on parameter transfer is proposed. First, the stray inductance model of chip parallel branch at different temperatures is established by magnetic-thermal coupling analysis. Then, through the electro-thermal coupling analysis, the simulation model of silicon carbide chip losses under different temperatures and stray inductance is established. Finally, loss parameter transfer is used to simulate the temperature of the controller under fluid-solid coupling, and the stray inductance model and loss model at this temperature are updated in real time. The electromagnetic-thermal coupling parameters of the chips under the multi-chip parallel structure during the temperature rise of the controller are studied. The accuracy of the multi-physics coupling analysis method is verified by the temperature rise experiment.

Multi-chip parallel  /  multi-physical domain  /  parameter coupling  /  stray inductance
王钊冉, 师蔚, 廖爱华, 胡定玉. 多芯片并联控制器的多物理场耦合分析. 电源学报, 2026 , 24 (7) : 305 -314 . DOI: 10.13234/j.issn.2095-2805.2026.7.305
Zhaoran WANG, Wei SHI, Aihua LIAO, Dingyu HU. Multi-physical Domain Coupling Analysis of Multi-chip Parallel Controller[J]. Journal of Power Supply, 2026 , 24 (7) : 305 -314 . DOI: 10.13234/j.issn.2095-2805.2026.7.305
  • 国家重点研发计划“新能源汽车”重点专项资助项目(2022YFB2502805)
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2026年第24卷第7期
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doi: 10.13234/j.issn.2095-2805.2026.7.305
  • 接收时间:2024-09-09
  • 首发时间:2026-10-29
  • 出版时间:2026-07-30
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  • 收稿日期:2024-09-09
  • 修回日期:2024-11-13
  • 录用日期:2024-11-26
基金
National Key Research and Development Plan “New Energy Vehicles” Key Special Project(2022YFB2502805)
国家重点研发计划“新能源汽车”重点专项资助项目(2022YFB2502805)
作者信息
    上海工程技术大学城市轨道交通学院,上海 201620

通讯作者:

王钊冉(1999— ),男,通信作者,硕士研究生。研究方向:基于多物理场耦合的牵引功率模块温度分析。E-mail:。
参考文献
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