电源学报

功率模块集成TEC温度控制研究

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杨嘉俊 ¹^,²^,³ , 刘同健 ⁴ , 宁圃奇中国电源学会会员 ¹^,²^,³ , 闫欣 ⁴ , 回晓双 ¹^,²^,³ , 康玉慧 ¹^,²^,³

电源学报 | 功率半导体器件与驱动 2026,24(7): 20-28

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电源学报 |功率半导体器件与驱动 2026 , 24 (7) : 20 -28

功率模块集成TEC温度控制研究

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杨嘉俊¹^,²^,³, 刘同健⁴, 宁圃奇中国电源学会会员¹^,²^,³, 闫欣⁴, 回晓双¹^,²^,³, 康玉慧¹^,²^,³

作者信息

^1.中国科学院电工研究所，北京　100190

^2.中国科学院大学，北京　100049

^3.电力电子与电气驱动重点实验室（中国科学院电工研究所），北京　100190

^4.东北大学信息科学与工程学院，沈阳　110819

通讯作者:

宁圃奇（1982—　），男，中国电源学会会员，通信作者，博士，研究员。研究方向：功率模块封装。E-mail：npq@mail.iee.ac.cn。

作者简介:

杨嘉俊（1999—　），男，硕士研究生。研究方向：车用功率模块散热。E-mail：yangjiajun@mail.iee.ac.cn。

刘同健（1997—　），男，博士研究生。研究方向：热电器件制备，功率模块散热。E-mail：2290065@stu.neu.edu.cn。

闫欣（1978—　），男，博士，研究员。研究方向：碳基电子器件，光纤传感器件。E-mail：yanxin@ise.neu.edu.cn。

回晓双（1999—　），男，博士研究生。研究方向：高功率密度电机驱动系统优化设计。E-mail：hui00@mail.iee.ac.cn。

康玉慧（1993—　），女，硕士，研究员。研究方向：半导体器件特性建模及模块封装技术。E-mail：kangyuhui@mail.iee.ac.cn。

Research on Power Module Integration of TEC Temperature Control

Jiajun YANG¹^,²^,³, Tongjian LIU⁴, Puqi NING Member, CPSS¹^,²^,³, Xin YAN⁴, Xiaoshuang HUI¹^,²^,³, Yuhui KANG¹^,²^,³

Affiliations

^1.Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China

^2.University of Chinese Academy of Sciences, Beijing 100049, China

^3.Key Laboratory of Power Electronics and Electric Drive, Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China

^4.School of Information Science and Engineering, Northeastern University, Shenyang 110819, China

出版时间: 2026-07-30 doi: 10.13234/j.issn.2095-2805.2026.7.20

文章导航

摘要

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电动汽车的功率模块是车辆动力系统中的核心部件，高频化、小型化、高功耗和高集成化特性成为其发展的主要趋势，因此功率模块的热管理面临着越来越严峻的挑战。热电制冷器TEC（thermoelectric cooler）因具有体积小、结构简单、可靠性高、制冷迅速等优点引起了广泛关注。基于此提出了一种基于TEC的温度反馈控制策略，采用相变材料PCM（phase change material）作为TEC冷热端的界面层，同时通过仿真和实验研究了从芯片到散热器的横向和纵向传热路径布局设计的原因。与无TEC方案相比，集成TEC的方案将SiC芯片的最高温度从77.6 ℃降至60.0 ℃，实现了有效的热管理和温度的反馈控制。本研究为高功率密度SiC模块提供了一种有效的热管理方法，具有一定的潜力。

关键词

功率模块 / 热电制冷器 / 热管理 / 温度控制

Abstract

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The power module is a critical component of the powertrain system in electric vehicles, and its development is driven by the trends of high-frequency operation, miniaturization, high power density and high integration, which brings increasingly severe challenges to thermal management. Thermoelectric cooler (TEC) has attracted widespread attention for its compact structure, high reliability and rapid cooling performance. A temperature feedback control strategy based on thermoelectric cooling is proposed, with phase change materials (PCM) adopted as the interface layers at both cold and hot ends of TEC. Combined with simulation and experimental verification, the layout design of transverse and longitudinal heat transfer paths from the chip to the heat sink is investigated. Compared with the non-TEC cooling scheme, the proposed integrated TEC-based thermal management method reduces the maximum temperature of the SiC chip from 77.6 ℃ to 60.0 ℃, achieving effective thermal regulation and precise temperature feedback control. An efficient thermal management solution for high-power-density SiC power modules is provided and its application potential in electric vehicle power systems is exhibited.

Key words

Power module / thermoelectric cooler (TEC) / thermal management / temperature control

引用本文

杨嘉俊, 刘同健, 宁圃奇中国电源学会会员, 闫欣, 回晓双, 康玉慧. 功率模块集成TEC温度控制研究. 电源学报, 2026 , 24 (7) : 20 -28 . DOI: 10.13234/j.issn.2095-2805.2026.7.20

Jiajun YANG, Tongjian LIU, Puqi NING, Xin YAN, Xiaoshuang HUI, Yuhui KANG. Research on Power Module Integration of TEC Temperature Control[J]. Journal of Power Supply, 2026 , 24 (7) : 20 -28 . DOI: 10.13234/j.issn.2095-2805.2026.7.20

基金

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国家重点研发计划资助项目(2021YFB2500600)

参考文献

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2026年第24卷第7期

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文章信息

doi: 10.13234/j.issn.2095-2805.2026.7.20

接收时间：2025-11-20
首发时间：2026-10-29
出版时间：2026-07-30

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出版历史

收稿日期：2025-11-20
修回日期：2026-01-07
录用日期：2026-01-26

基金

National Key Research and Development Program of China(2021YFB2500600)

国家重点研发计划资助项目(2021YFB2500600)

作者信息

^1.中国科学院电工研究所，北京　100190

^2.中国科学院大学，北京　100049

^3.电力电子与电气驱动重点实验室（中国科学院电工研究所），北京　100190

^4.东北大学信息科学与工程学院，沈阳　110819

通讯作者:

宁圃奇（1982—　），男，中国电源学会会员，通信作者，博士，研究员。研究方向：功率模块封装。E-mail：npq@mail.iee.ac.cn。

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https://castjournals.cast.org.cn/joweb/dyxb/CN/10.13234/j.issn.2095-2805.2026.7.20

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2种不同金属材料的力学参数

科 Family	属数 Number of genus	种数 Number of species	占总种数比例 Percentage of total species (%)	属 Genus	种数 Number of species	占总种数比例 Percentage of total species (%)
鹅膏菌科Amanitaceae	2	11	5.26	鹅膏菌属 Amanita	10	4.78
小菇科 Mycenaceae	2	12	5.74	丝盖伞属 Inocybe	5	2.39
多孔菌科 Polyporaceae	8	14	6.70	蜡蘑属 Laccaria	5	2.39
红菇科 Russulaceae	3	23	11.00	小皮伞属 Marasmius	6	2.87
				小菇属 Mycena	11	5.26
				光柄菇属 Pluteus	5	2.39
				红菇属 Russula	17	8.13
				栓菌属 Trametes	5	2.39

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