Article(id=1322532027761545546, tenantId=1146029695717560320, journalId=1146031654075715584, issueId=1322531779840426416, articleNumber=null, orderNo=null, doi=10.13234/j.issn.2095-2805.2026.7.1, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=null, receivedDate=1714320000000, receivedDateStr=2024-04-29, revisedDate=1730649600000, revisedDateStr=2024-11-04, acceptedDate=1732464000000, acceptedDateStr=2024-11-25, onlineDate=1793245806875, onlineDateStr=2026-10-29, pubDate=1785340800000, pubDateStr=2026-07-30, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1793245806875, onlineIssueDateStr=2026-10-29, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1793245806875, creator=13701087609, updateTime=1793245806875, updator=13701087609, issue=Issue{id=1322531779840426416, tenantId=1146029695717560320, journalId=1146031654075715584, year='2026', volume='24', issue='7', pageStart='1', pageEnd='368', issueExtLink='null', onlineDate='null', pubDate='1785340800000', pubDateStr='2026-07-30', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=null, createTime=1793245747766, creator='13701087609', updateTime=1793245747766, updator='13701087609', preIssue=null, nextIssue=null, articleTotal=null, ext=null, issueFiles=null, downloadFileDto=null}, startPage=1, endPage=7, ext={EN=ArticleExt(id=1322532028180975947, articleId=1322532027761545546, tenantId=1146029695717560320, journalId=1146031654075715584, language=EN, title=A New Structural Design of UMOSFET with PN-Bottom, columnId=1321491639659516540, journalTitle=Journal of Power Supply, columnName=Power Semiconductor Devices and Drive Circuits, runingTitle=null, highlight=null, articleAbstract=

Due to the trade-off relationship between breakdown voltage (BV) and specific on-resistance Ron,sp, to minimize the decrease in breakdown voltage while reducing on-resistance, an improved U-trench metal-oxide-semiconductor field-effect transistor (UMOSFET) structure with PN-Bottom is proposed. First, on the basis of traditional 100 V U-trench metal-oxide-semiconductor (UMOS) devices, deep trench etching technology is adopted to introduce a PN-Bottom wrapping region at the bottom of the trench, which wraps the P-type region inside the N-type region. Then, the new structural parameters and fabrication process of the device are introduced. Next, using the TCAD simulation tool, a detailed discussion was conducted on the doping concentration, width, and depth of the N-Bottom and P-Bottom encapsulation regions, and their effects on the breakdown voltage and specific on-resistance of the device were studied. Finally, the simulation results show that under the same conditions, an optimized design with BV of 110 V and Ron,sp of 1.15 mΩ·cm2 was obtained.

, authors=Chunhui PEI, Quanyuan FENG, authorsList=Chunhui PEI, Quanyuan FENG, authorCompany=null, correspAuthors=Quanyuan FENG, authorNote=null, correspAuthorsNote=null, copyrightStatement=null, copyrightOwner=null, extLink=null, articleAbsUrl=null, sourceXml=null, magXml=null, pdfUrl=null, pdf=null, pdfFileSize=null, pdfExtLink=null, richHtmlUrl=null, mobilePdfUrl=null, reviewReport=null, pdfFirstPage=null, abstractGraph=null, abstractGraphContent=null, abstractVideo=null, citation=null, cebUrl=null, magXmlContent=null, mapNumber=null, fund=null), CN=ArticleExt(id=1322532029443461455, articleId=1322532027761545546, tenantId=1146029695717560320, journalId=1146031654075715584, language=CN, title=一种具有PN-Bottom的UMOSFET新结构设计, columnId=1321491641425318526, journalTitle=电源学报, columnName=功率半导体器件与驱动, runingTitle=null, highlight=null, articleAbstract=

由于击穿电压BV(breakdown voltage)和特征导通电阻Ron,sp之间存在折中关系,为了在减小导通电阻的同时尽可能抑制击穿电压的下降,提出了一种改进的具有PN-Bottom的U型金属氧化物半导体场效应晶体管UMOSFET(U-trench metal-oxide-semiconductor field-effect transistor)结构。首先在传统100 V U型金属氧化物半导体UMOS(U-trench metal-oxide-semiconductor)器件的基础上,采用深沟槽刻蚀技术,在沟槽底部引入了一个PN型包裹区PN-Bottom,N型区将P型区包裹在内;然后介绍了器件的新结构参数和制备工艺流程;接着借助TCAD仿真工具,对N型包裹区和P型包裹区的掺杂浓度、宽度和深度进行详细讨论,研究了其对器件击穿电压和特征导通电阻的影响;最后在控制其他参数不变的条件下,实现了击穿电压为110 V、特征导通电阻为1.115 mΩ·cm2的优化设计。

, authors=裴春荟, 冯全源, authorsList=裴春荟, 冯全源, authorCompany=null, correspAuthors=冯全源, authorNote=

裴春荟(2000— ),女,硕士。研究方向:功率器件。E-mail:。

, correspAuthorsNote=
冯全源(1963— ),男,通信作者,博士,教授。研究方向:集成电路设计,功率器件设计,移动天线与智能天线设计。E-mail:。
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裴春荟(2000— ),女,硕士。研究方向:功率器件。E-mail:。

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裴春荟(2000— ),女,硕士。研究方向:功率器件。E-mail:。

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一种具有PN-Bottom的UMOSFET新结构设计
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裴春荟 , 冯全源
电源学报 | 功率半导体器件与驱动 2026,24(7): 1-7
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电源学报 |功率半导体器件与驱动 2026 , 24 (7) : 1 -7
一种具有PN-Bottom的UMOSFET新结构设计
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裴春荟 , 冯全源
作者信息
  • 西南交通大学微电子研究所,成都 611756
通讯作者:
冯全源(1963— ),男,通信作者,博士,教授。研究方向:集成电路设计,功率器件设计,移动天线与智能天线设计。E-mail:。
作者简介:

裴春荟(2000— ),女,硕士。研究方向:功率器件。E-mail:。

A New Structural Design of UMOSFET with PN-Bottom
Chunhui PEI , Quanyuan FENG
Affiliations
  • Institute of Microelectronics, Southwest Jiaotong University, Chengdu 611756, China
出版时间: 2026-07-30 doi: 10.13234/j.issn.2095-2805.2026.7.1
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由于击穿电压BV(breakdown voltage)和特征导通电阻Ron,sp之间存在折中关系,为了在减小导通电阻的同时尽可能抑制击穿电压的下降,提出了一种改进的具有PN-Bottom的U型金属氧化物半导体场效应晶体管UMOSFET(U-trench metal-oxide-semiconductor field-effect transistor)结构。首先在传统100 V U型金属氧化物半导体UMOS(U-trench metal-oxide-semiconductor)器件的基础上,采用深沟槽刻蚀技术,在沟槽底部引入了一个PN型包裹区PN-Bottom,N型区将P型区包裹在内;然后介绍了器件的新结构参数和制备工艺流程;接着借助TCAD仿真工具,对N型包裹区和P型包裹区的掺杂浓度、宽度和深度进行详细讨论,研究了其对器件击穿电压和特征导通电阻的影响;最后在控制其他参数不变的条件下,实现了击穿电压为110 V、特征导通电阻为1.115 mΩ·cm2的优化设计。

沟槽金属氧化物半导体场效应晶体管  /  PN型包裹区  /  击穿电压  /  特征导通电阻

Due to the trade-off relationship between breakdown voltage (BV) and specific on-resistance Ron,sp, to minimize the decrease in breakdown voltage while reducing on-resistance, an improved U-trench metal-oxide-semiconductor field-effect transistor (UMOSFET) structure with PN-Bottom is proposed. First, on the basis of traditional 100 V U-trench metal-oxide-semiconductor (UMOS) devices, deep trench etching technology is adopted to introduce a PN-Bottom wrapping region at the bottom of the trench, which wraps the P-type region inside the N-type region. Then, the new structural parameters and fabrication process of the device are introduced. Next, using the TCAD simulation tool, a detailed discussion was conducted on the doping concentration, width, and depth of the N-Bottom and P-Bottom encapsulation regions, and their effects on the breakdown voltage and specific on-resistance of the device were studied. Finally, the simulation results show that under the same conditions, an optimized design with BV of 110 V and Ron,sp of 1.15 mΩ·cm2 was obtained.

Trench metal-oxide-semiconductor field-effect transistor (MOSFET)  /  PN-Bottom  /  breakdown voltage  /  specific on-resistance
裴春荟, 冯全源. 一种具有PN-Bottom的UMOSFET新结构设计. 电源学报, 2026 , 24 (7) : 1 -7 . DOI: 10.13234/j.issn.2095-2805.2026.7.1
Chunhui PEI, Quanyuan FENG. A New Structural Design of UMOSFET with PN-Bottom[J]. Journal of Power Supply, 2026 , 24 (7) : 1 -7 . DOI: 10.13234/j.issn.2095-2805.2026.7.1
  • 国家自然科学基金资助项目(62090012)
  • 四川省重点研发资助项目(2023YFG0004)
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2026年第24卷第7期
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doi: 10.13234/j.issn.2095-2805.2026.7.1
  • 接收时间:2024-04-29
  • 首发时间:2026-10-29
  • 出版时间:2026-07-30
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  • 收稿日期:2024-04-29
  • 修回日期:2024-11-04
  • 录用日期:2024-11-25
基金
National Natural Science Foundation of China(62090012)
国家自然科学基金资助项目(62090012)
Key R&D Project of Sichuan Province(2023YFG0004)
四川省重点研发资助项目(2023YFG0004)
作者信息
    西南交通大学微电子研究所,成都 611756

通讯作者:

冯全源(1963— ),男,通信作者,博士,教授。研究方向:集成电路设计,功率器件设计,移动天线与智能天线设计。E-mail:。
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2种不同金属材料的力学参数
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属
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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